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GB/T 44513-2024: Micro-electromechanical systems(MEMS) technology - Environmental test methods of MEMS piezoelectric thin films for sensor application
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| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 44513-2024 | English | 354 |
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Micro-electromechanical systems(MEMS) technology - Environmental test methods of MEMS piezoelectric thin films for sensor application
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GB/T 44513-2024
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Basic data | Standard ID | GB/T 44513-2024 (GB/T44513-2024) | | Description (Translated English) | Micro-electromechanical systems(MEMS) technology - Environmental test methods of MEMS piezoelectric thin films for sensor application | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L59 | | Classification of International Standard | 31.080.99 | | Word Count Estimation | 18,135 | | Date of Issue | 2024-09-29 | | Date of Implementation | 2025-01-01 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 44513-2024: Micro-electromechanical systems(MEMS) technology - Environmental test methods of MEMS piezoelectric thin films for sensor application
---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 31.080.99
CCSL59
National Standard of the People's Republic of China
Micro-electromechanical systems (MEMS) technology sensors
Environmental Test Methods for MEMS Piezoelectric Films
application,IDT)
Released on 2024-09-29
2025-01-01 Implementation
State Administration for Market Regulation
The National Standardization Administration issued
Table of Contents
Preface III
1 Scope 1
2 Normative references 1
3 Terms and Definitions 1
4 Test Procedure 1
4.1 General 1
4.2 Initial Measurement 2
4.3 Test 2
4.4 Post-processing 2
4.5 Final Measurement 3
5 Environmental and dielectric withstand voltage test 3
5.1 Environmental test 3
5.2 Dielectric Withstand Voltage Test 6
Appendix A (Informative) Test Result Report 8
A.1 General Principles 8
A.2 High temperature effect test 8
Reference 11
Foreword
This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1.Structure and drafting rules for standardization documents"
Drafting.
This document is equivalent to IEC 62047-37.2020 "Semiconductor devices - Microelectromechanical devices - Part 37.MEMS pressure sensors
Environmental Test Methods for Thin Film Electrolytes.
The following minimal editorial changes were made to this document.
--- In order to coordinate with the existing standards, the name of the standard will be changed to "MEMS piezoelectric film for micro-electromechanical system (MEMS) technology sensors
Environmental Test Methods";
--- Modified the PZT thickness from 3μm to 2μm in Table A.1 to make the table content correspond to the content of the text in Appendix A.
Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.
This document is proposed and coordinated by the National Micro-Electromechanical Technology Standardization Technical Committee (SAC/TC336).
This document was drafted by. Kunshan Kunbo Intelligent Sensing Industry Technology Research Institute Co., Ltd., Zhongyong Technology Co., Ltd., and China Machinery Productivity Promotion Co., Ltd.
Center Co., Ltd., Suzhou University, Chengdu Aerospace Kate Electromechanical Technology Co., Ltd., Wuhan University, Beijing Zhixin Microelectronics Technology Co., Ltd.
Wuxi Huarun Shanghua Technology Co., Ltd., Kunshan Shuangqiao Sensor Measurement and Control Technology Co., Ltd., Shenzhen Meisi Advanced Electronics Co., Ltd.,
Institute of Microelectronics, Chinese Academy of Sciences, Chongqing Chenshuo Measurement and Control Technology Co., Ltd., Suzhou Institute of Quality and Standardization, Suzhou Huiwen Nanotechnology Co., Ltd.
Company, Shanghai Xinwei Technology R&D Center Co., Ltd., Suzhou University of Science and Technology, Suzhou Jingfang Semiconductor Technology Co., Ltd., Taiyuan Aviation Instrument
Co., Ltd., Shandong Zhongkesier Technology Co., Ltd., Akashi Innovation (Yantai) Micro-Nano Sensing Technology Research Institute Co., Ltd., Hebei Chuguang Automotive
Auto Parts Co., Ltd., Guangdong Runyu Sensor Co., Ltd., and Wuhu Lejia Electric Co., Ltd.
The main drafters of this document are. Chen Liguo, Jiang Dabai, Li Genzi, Liu Huicong, Jiang Liping, Liu Sheng, Fang Dongming, Xia Changfeng, Wang Bing, Zhou Weihu,
Xu Zhou, Zhong Ming, Zhang Shuo, Sun Xuhui, Xia Yan, Lou Liang, Cheng Xinli, Yang Jianhong, Chen Zhiwen, Zhang Zhongfei, Hu Zeng, Shang Yanlong, Wang Yangjun, Gao Feng, Lu Yipeng,
Yuan Changzuo, Zhong Shengli, Li Haiquan, Qian Yongguo.
Micro-electromechanical systems (MEMS) technology sensors
Environmental Test Methods for MEMS Piezoelectric Films
1 Scope
This document describes the evaluation of the durability of MEMS piezoelectric thin film materials under environmental stress (temperature and humidity), mechanical stress and strain.
This document specifically describes the test methods and test conditions for quality assessment under temperature, humidity conditions and applied voltage.
Test methods and test conditions for device durability.
This document is applicable to the evaluation of the durability and quality of MEMS piezoelectric thin film materials, and also to the evaluation of piezoelectric thin films formed on silicon substrates.
Positive piezoelectric properties of films, such as piezoelectric films used as acoustic sensors or cantilever sensors.
This document does not cover reliability assessments such as methods for predicting the lifetime of piezoelectric films based on the Weibull distribution.
2 Normative references
The contents of the following documents constitute essential clauses of this document through normative references in this document.
For referenced documents without a date, only the version corresponding to that date applies to this document; for referenced documents without a date, the latest version (including all amendments) applies to
This document.
IEC 62047-30 Semiconductor devices Microelectromechanical devices Part 30.Measurement of electromechanical conversion characteristics of MEMS piezoelectric films
Note. GB/T 44515-2024 Micro-electromechanical systems (MEMS) technology - Measurement methods for electromechanical conversion characteristics of MEMS piezoelectric films (IEC 62047-30.
2017, IDT)
GB/T 2423.22-2012 Environmental testing Part 2.Test method Test N. Temperature change (IEC 60068-2-14.
2009, IDT)
3 Terms and definitions
There are no terms or definitions that require definition in this document.
4 Experimental process
4.1 General
The degradation of the device under test is evaluated by measuring the piezoelectric performance before and after applying temperature and humidity environmental stress. Figure 1 shows the test process
The basic process.
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