|
US$274.00 · In stock
Delivery: <= 3 days. True-PDF full-copy in English will be manually translated and delivered via email.
GB/T 44514-2024: Micro-electromechanical system(MEMS) technology - Four-point bending test method for interfacial adhesion energy of layered MEMS materials
Status: Valid
| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 44514-2024 | English | 274 |
Add to Cart
|
3 days [Need to translate]
|
Micro-electromechanical system(MEMS) technology - Four-point bending test method for interfacial adhesion energy of layered MEMS materials
| Valid |
GB/T 44514-2024
|
PDF similar to GB/T 44514-2024
Basic data | Standard ID | GB/T 44514-2024 (GB/T44514-2024) | | Description (Translated English) | Micro-electromechanical system(MEMS) technology - Four-point bending test method for interfacial adhesion energy of layered MEMS materials | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L59 | | Classification of International Standard | 31.080.99 | | Word Count Estimation | 14,113 | | Date of Issue | 2024-09-29 | | Date of Implementation | 2024-09-29 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 44514-2024: Micro-electromechanical system(MEMS) technology - Four-point bending test method for interfacial adhesion energy of layered MEMS materials
---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Micro-electromechanical system(MEMS) technology - Four-point bending test method for interfacial adhesion energy of layered MEMS materials
Micro-Electro-Mechanical Systems (MEMS) Technology
Layered MEMS material interface adhesion four-point bending
Test methods
Micro-electromechanical system (MEMS) technology-Four-point bending test
method for interfacial adhesion energy of layered MEMS materials
(IEC 62047-31..2019, Semiconductor devices-Micro-electromechanical
of layered MEMS materials, IDT)
ICS 31.080.99
CCS L 59
National Standard of the People's Republic of China
Published on 2024-09-29 Implemented on 2024-09-29
State Administration for Market Regulation
The National Standardization Administration issued
Table of Contents
Preface ... Ⅲ
1 Scope ... 1
2 Normative references ... 1
3 Terms, definitions, symbols and names ... 1
3.1 Terms and Definitions 1
3.2 Symbols and Names 1
4 Test pieces ... 2
4.1 General Requirements 2
4.2 Shape of the test piece ... 2
4.3 Dimensional Measurement ... 3
4.4 Evaluation of energy release rate 3
5 Test methods and test equipment 3
5.1 Test Principle ... 3
5.2 Test equipment ... 3
5.3 Test Procedure 3
5.4 Test environment ... 4
6 Test Report ... 4
Appendix A (Informative) Failure modes in four-point bending test 6
A.1 General Principles 6
A.2 Failure Mode 6
References ... 8
Foreword
This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1.Structure and drafting rules for standardization documents"
Drafting is required.
This document is equivalent to IEC 62047﹘31.2019 "Semiconductor devices - Microelectromechanical devices - Part 31.Layered MEMS materials interface
Four-point bending test method for surface bonding energy.
The following minimal editorial changes were made to this document.
To coordinate with the existing standards, the name of the standard is changed to "Microelectromechanical Systems (MEMS) Technology - Layered MEMS Material Interface Adhesion
Four-point bending test method";
To show the original state of the test piece, Figure 1a) is added as a schematic diagram of the test piece with prefabricated cracks before the test, and a pressure roller is added.
and description of the support rollers.
Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.
This document is proposed and coordinated by the National Micro-Electromechanical Technology Standardization Technical Committee (SAC/TC 336).
This document was drafted by. Beijing Automation Control Equipment Research Institute, Hefei Midea Refrigerator Co., Ltd., China Machinery Productivity Promotion Center
Ltd., Beijing Chenjing Electronics Co., Ltd., Shandong Zhongkang Guochuang Advanced Printing and Dyeing Technology Research Institute Co., Ltd., Suzhou University, Xi'an Jiaotong University
Institute of Space Information Innovation, Chinese Academy of Sciences, Shenzhen Suteng Juchuang Technology Co., Ltd., Wuxi China Resources Shanghua Technology Co., Ltd., An
Huiaofei Acoustic Technology Co., Ltd., Aerospace Long March Rocket Technology Co., Ltd., Tianjin Xinzhi Perception Technology Co., Ltd., East China Electronic Engineering Research Institute
Institute (38th Institute of China Electronics Technology Group Corporation), Shandong Zhongkesier Technology Co., Ltd., Suzhou Helin Micro-Nano Technology Co., Ltd.
Co., Ltd., Akashi Innovation (Yantai) Micro-Nano Sensing Technology Research Institute Co., Ltd.
The main drafters of this document are. Wang Yongsheng, Cao Shiliang, Shang Kejun, Li Genzi, Liu Ren, Tang Yi, Mao Zhiping, Sun Lining, Wang Zhiguang,
Chen Deyong, Yang Yang, Yao Yanqing, Zhang Luyu, Lu Yulan, Zhang Xinwei, An Zhiwu, Zheng Dongchen, Lu Wenyi, Chen Demin, Zhang Hongqi,
Shang Yanlong, Li Fanya, Qian Xiaochen, Gao Feng.
Micro-Electro-Mechanical Systems (MEMS) Technology
Layered MEMS material interface adhesion four-point bending
Test methods
1 Scope
This paper describes a four-point bending measurement method based on fracture mechanics concepts, using pure bending forces acting on layered MEMS materials.
The critical bending moment of the weakest interface steady-state cracking is used to measure the interface adhesion energy.
This document applies to MEMS devices that deposit thin film layers on semiconductor substrates. The total thickness of the thin film layer should be less than the supporting substrate (usually silicon
1/100 of the thickness of the wafer).
2 Normative references
This document has no normative references.
3 Terms, definitions, symbols and names
3.1 Terms and Definitions
The following terms and definitions apply to this document.
3.1.1
Energy release rate
The strain energy per unit surface area released during crack growth.
NOTE. The energy release rate is considered to be the crack driving force and is expressed in joules per square meter (J/m2).
3.1.2
interfacial adhesion energy
The energy release rate when the interface crack starts to grow and expands steadily along the interface.
Note. Also known as critical energy release rate, its unit is joule per square meter (J/m2).
3.2 Symbols and names
The shape and symbol of the test piece are shown in Figure 1 and Table 1 respectively. The overall shape of the test piece is similar to a sandwich cantilever beam.
A prefabricated crack or a notch for crack initiation. After crack initiation, the crack extends along the weakest interface in the layered material system.
Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GB/T 44514-2024_English be delivered?Answer: Upon your order, we will start to translate GB/T 44514-2024_English as soon as possible, and keep you informed of the progress. The lead time is typically 1 ~ 3 working days. The lengthier the document the longer the lead time. Question 2: Can I share the purchased PDF of GB/T 44514-2024_English with my colleagues?Answer: Yes. The purchased PDF of GB/T 44514-2024_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet. Question 3: Does the price include tax/VAT?Answer: Yes. Our tax invoice, downloaded/delivered in 9 seconds, includes all tax/VAT and complies with 100+ countries' tax regulations (tax exempted in 100+ countries) -- See Avoidance of Double Taxation Agreements (DTAs): List of DTAs signed between Singapore and 100+ countriesQuestion 4: Do you accept my currency other than USD?Answer: Yes. If you need your currency to be printed on the invoice, please write an email to [email protected]. In 2 working-hours, we will create a special link for you to pay in any currencies. Otherwise, follow the normal steps: Add to Cart -- Checkout -- Select your currency to pay.
|