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GB/T 39807-2021: Process specifications of Pb-free plating tin and tin alloys
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Process specifications of Pb-free plating tin and tin alloys
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GB/T 39807-2021
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Basic data | Standard ID | GB/T 39807-2021 (GB/T39807-2021) | | Description (Translated English) | Process specifications of Pb-free plating tin and tin alloys | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | A29 | | Word Count Estimation | 10,144 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 39807-2021: Process specifications of Pb-free plating tin and tin alloys---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Process specifications of Pb-free plating tin and tin alloys
ICS 25.220.40
A29
National Standards of People's Republic of China
Process specification for lead-free tin electroplating and tin alloy
Released on 2021-03-09
2021-10-01 implementation
State Administration of Market Supervision and Administration
Issued by the National Standardization Management Committee
Table of contents
Foreword Ⅲ
1 Scope 1
2 Normative references 1
3 Terms and definitions 1
4 Process requirements 1
4.1 Process flow 1
4.2 Production Control 2
4.3 Alternative sample 3
4.4 Equipment requirements 3
5 Product quality requirements 3
5.1 Base material requirements 3
5.2 Coating copper and tin content 3
5.3 Appearance of the coating 3
5.4 Coating thickness 3
5.5 Bond strength 4
5.6 Solderability 4
5.7 Porosity 4
5.8 Anti-tarnish performance 4
5.9 Anti-tin whisker performance 4
6 Sampling 5
Process specification for lead-free tin electroplating and tin alloy
1 Scope
This standard specifies the process requirements for electroplating pure tin and tin-copper alloy, product quality requirements and sampling.
This standard applies to the solderability of electroplated pure tin and tin-copper alloy electroplating in the electronics industry.
This standard does not apply to decorative tin and tin alloy electroplating.
2 Normative references
The following documents are indispensable for the application of this document. For dated reference documents, only the dated version applies to this article
Pieces. For undated reference documents, the latest version (including all amendments) is applicable to this document.
GB/T 2423.28 Environmental testing of electrical and electronic products Part 2.Test methods Test T. Soldering
GB/T 3138 Terminology for surface treatment of metal and other inorganic coatings
GB/T 9789 Metal and other inorganic coatings, sulfur dioxide corrosion test under normal condensation conditions
GB/T 10125 Artificial atmosphere corrosion test salt spray test
GB/T 12609 Electrodeposited metal coatings and related finishing sampling procedures for inspection by attributes
GB/T 12334 Definitions and general rules for thickness measurement of metal and other non-organic coatings
GB/T 12599-2002 Technical specifications and test methods for tin electroplated metal coatings
3 Terms and definitions
The following terms and definitions defined in GB/T 3138 and GB/T 12334 apply to this document.
3.1
Lead-free tin plating and tin alloy Pb-freeplatingtinandtinaloys
Lead-free tin electroplating and tin alloy plating.
3.2
Electroplating pure tin electroplatingpuretin
Electroplated tin coatings with carbon content lower than 0.05% and tin content higher than 99.95%.
3.3
Electroplatingtin-copper
A tin-copper alloy coating with a copper content of 2% to 4%.
4 Process requirements
4.1 Process flow
4.1.1 Pre-treatment of electroplating
The electroplating pretreatment adopts a combination of chemical degreasing, cathode electrolytic degreasing, anode electrolytic degreasing and activation.
4.1.2 Electroplating underplating (optional)
When there are any of the following reasons, some substrate surfaces may require underplating.
a) Proliferation prevention (should be in accordance with C.2.2 and C.2.3 of GB/T 12599-2002);
b) Maintain solderability (according to C.2.2, C.2.3 and C.2.4 in GB/T 12599-2002);
c) Ensure the adhesion strength (should be in accordance with C.2.4 and C.2.5 in GB/T 12599-2002);
d) Improve corrosion resistance.
In order to avoid undesirable properties, such as brittleness, to the base material or processed parts, attention should be paid to the choice of the underlying coating. For example, should be avoided
Use high-stress nickel plating.
If the base material is a zinc-containing copper alloy and solderability is required, in addition to the specified tin plating thickness (should be in accordance with GB/T 12599-
C.2.3) in.2002, it is also necessary to make the minimum local thickness of the nickel or copper underplating layer reach 2.5μm; this underplating layer is important for maintaining a good outer layer.
View and adhesion strength are also necessary.
If the bottom coating has been determined, the buyer should specify its characteristics (should be in accordance with GB/T 12599-2002 Appendix C) and minimum local thickness
(Should be in accordance with 10.2 of GB/T 12599-2002).
The thickness of one or more bottom coatings should be measured in accordance with the method specified in Appendix A of GB/T 12599-2002.
4.1.3 Electroplating tin and tin alloy
Electroplating tin and tin alloy can use sulfate or methane sulfonate process, and appropriate additives should be used to meet the requirements of this standard.
The required coating.
4.1.4 Post-processing
In order to improve the discoloration resistance and high temperature resistance of the coating, a suitable treatment solution should be used for post-treatment.
The water, raw and auxiliary materials used in lead-free tin electroplating and tin alloy processes should be lead-free.
4.2 Production control
4.2.1 Inspection of production equipment
Before production, the operator should check whether the relevant production equipment has a qualified label or certificate, and it can be used within the validity period after verification.
4.2.2 Water quality requirements
Preparation of electroplating tin and tin alloy and post-treatment liquid, all washing after electroplating should use deionized water or distilled water.
4.2.3 Washing
In the production process, two or more water washings are carried out after each process to ensure that it is cleaned.
4.2.4 Bath analysis
All bath components should be analyzed regularly, and not less than three times a week, and the impurities in the plating solution should be analyzed once a week with complete records.
4.2.5 Filter
Continuous filtration should be used in the electroplating process, and the circulation of bath liquid should not be less than four times per hour, and the record should be complete.
4.2.6 Freezing
Electroplating tin and tin alloy solutions are prone to hydrolysis of divalent tin due to high temperatures. The plating solution should be equipped with refrigeration equipment.
4.2.7 Production records
During the production process, the processing date, name, quantity, time, current and addition of raw and auxiliary materials should be recorded.
4.3 Alternative samples
When parts are not suitable for destructive testing, samples can be used instead of parts, the test piece is 150mm×100mm×1mm copper plate,
The test piece should be electroplated and other treatments under the same conditions as the represented parts.
4.4 Equipment requirements
4.4.1 Power requirements
The power supply used for electroplating can adopt various DC power supplies, and the rated output value of voltage and current should be able to meet the minimum requirements of the plating tank under full load.
Large voltage and current. The accuracy grade of the voltage and ammeter should not be lower than 1.5.
4.4.2 Slot requirements
The tank should have corrosion resistance to the solution contained, and the tank should be equipped with a ventilation device for electrolytic degreasing, acid activation, electroplating, etc.
4.4.3 Instruments and meters
Measuring instruments, meters, and measuring tools should have certificates of conformity and be regularly calibrated before they can be used within the validity period.
5 Product quality requirements
5.1 Substrate requirements
Lead-free tin electroplating and tin alloy substrates should meet the following requirements.
a) There should be no serious oil stains, metal chips, paint, rust and oxide scale, etc.;
b) The surface of the parts should be free of burrs, cracks, pits and other man-made damage caused by poor operation, and the surface is scratched;
c) The welded parts should be free of solder residue and slag;
d) Castings must not have unremoved sand particles and paint sintered products.
5.2 Coating copper and tin content
Use stainless steel as the substrate for electroplating tin or tin alloy, use 1.1 nitric acid to remove the surface coating, and use atomic absorption spectroscopy (or other instruments) to measure
The amount of tin, lead and copper content, the coating should be lead-free, the copper content of electroplated tin-copper alloy is 2% to 4%, and the tin content of electroplated pure tin coating is greater than 99.95%.
The electronic energy spectrum can also be used for direct measurement.
5.3 Appearance of the coating
All parts should be visually inspected. The coating is silver-white or slightly yellowish, and the coating crystals are uniform, fine and smooth. hang
Plated parts allow slight fixture marks on hidden parts. Allows slight unevenness due to uneven substrate material and different surface processing conditions
Uniform color or gloss; the surface of the parts after high temperature inspection is allowed to slightly turn yellow. Spots, black spots, burnt, roughness, pinholes, and hemp are not allowed
Spots, cracks, delamination, blistering, peeling, peeling, crystalline coating, partial non-coating (except for blind holes, deep holes and technical documents), etc.
defect.
5.4 Coating thickness
Pure tin and tin alloy coatings are classified according to thickness, and are used for different conditions of use in accordance with 7.1 of GB/T 12599-2002.
The minimum thickness value is specified in Table 1.
According to the appropriate method given in Appendix A of GB/T 12599-2002, any small diameter of 20mm can be measured in the main surface.
A basic measuring surface on the part contacted by the ball shall be measured in accordance with GB/T 12334 for the thickness of the coating. When the main surface area of the plated part
When it is greater than or equal to 100mm2, the minimum thickness shall be regarded as the minimum local thickness value. When the main surface of the plated part is less than 100mm2, the minimum
The thickness should be regarded as the minimum value of the average thickness.
5.5 Bond strength
When the buyer stipulates that the test should be carried out according to one of the methods given in Appendix B of GB/T 12599-2002, the coating should not peel off
phenomenon.
5.6 Solderability
5.6.1 General materials and parts
If the purchaser has regulations on solderability, it should follow the method 1 of the Ta test in GB/T 2423.28, and use inactive flux for solderability.
test.
If accelerated aging is required before the test, the purchaser shall specify the accelerated aging process.
5.6.2 Printed Circuit Board
If the buyer has regulations on solderability, the plating on the printed circuit board that meets this standard should be tested in accordance with the Tc test method in GB/T 2423.28
Method for solderability test.
If accelerated aging is required before the test, the purchaser shall specify the accelerated aging process.
5.7 Porosity
If the purchaser has regulations on porosity, for coatings with a minimum thickness greater than or equal to 10 μm, one of the following tests should be passed.
a) The coating on the steel substrate is in accordance with the provisions of GB/T 10125;
b) The coating on non-steel substrates shall be in accordance with GB/T 9789.
In the above two cases, when observed with a three-fold magnifying glass, the substrate should have no traces of corrosion.
5.8 Anti-tarnish performance
In a closed container, heat pure water (conductivity less than 5μS/cm) to 100°C under normal pressure, place the work piece 1cm on the water surface, and expose it to steam.
After 5h in the steam, the coating does not change color.
5.9 Anti-tin whisker performance
Use a high and low temperature damp heat test chamber at a temperature of 85°C and a relative humidity of 85% to carry out the experiment for 1000 hours, and then use the scanning electron microscope to zoom in
Observed at.200 times, there should be no whiskers.
6 sampling
The sampling method can be in accordance with the provisions of GB/T 12609.Sampling methods and acceptance levels can also be negotiated between the supplier and the buyer.
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