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 GB/T 31471-2015: General specification for metal foil for printed circuits
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       PDF similar to GB/T 31471-2015 
 Standard similar to GB/T 31471-2015GB/T 12631   GB/T 45638   GB/T 19405.3Basic data             | Standard ID | GB/T 31471-2015 (GB/T31471-2015) |           | Description (Translated English) | General specification for metal foil for printed circuits |           | Sector / Industry | National Standard (Recommended) |           | Classification of Chinese Standard | L30 |           | Classification of International Standard | 31.18 |           | Word Count Estimation | 23,257 |           | Date of Issue | 2015-05-15 |           | Date of Implementation | 2016-01-01 |           | Quoted Standard | GB/T 2036; GB/T 8888; GB/T 29847-2013 |           | Regulation (derived from) | National Standard Announcement 2015 No. 15 |           | Issuing agency(ies) | General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China |           | Summary | This Standard specifies the printed circuit has a carrier (film or foil) supports and unsupported supporting metal foil logo, code, the general technical requirements, quality assurance regulations, test methods, packaging, marking and storage and transportation requirements. This Standard applies to rigid, flexible printed circuit metal foil. | GB/T 31471-2015: General specification for metal foil for printed circuits---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.General specification for metal foil for printed circuits
ICS 31.180
L30
National Standards of People's Republic of China
Metal foil for printed circuits General specification
Issued on. 2015-05-15
2016-01-01 implementation
Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China
Standardization Administration of China released
 Table of ContentsPreface Ⅰ
1 Scope 1
2 Normative references 1
3 Terms and definitions
4 metal foil identification code, type 2
4.1 2 metal foil logo
4.2 Code 2
4.3 Model of the metal foil 4
5 Requirements 4
5.1 General 4
5.2 General requirements 4
5.3 Exterior 5
5.4 Size 5
5.5 Physical Performance Requirements 7
5.6 process requirements 8
5.7 Particular requirements for the metal foil 8
6 Quality Assurance provisions 9
9 6.1 Responsibility for Inspection
6.2 test equipment and test equipment 9
6.3 Test conditions 9
6.4 Inspection classification 10
6.5 Identification Test 10
6.6 Quality conformance inspection 10
7 13 test method
13 7.1 Appearance
7.2 Dimensions 14
7.3 Physical Properties 14
15 7.4 Process Performance
15 7.5 Special Requirements
8 packaging, labeling and transport storage 16
8.1 Packaging 16
8.2 mark 16
8.3 Transport and storage 16
9 order documents 16
Appendix A (informative) domestic and foreign PCB with metal foil standard models and detailed specifications table number 18
References 19ForewordThis standard was drafted in accordance with GB/T 1.1-2009 given rules.
The standard equipment by the National Standardization Technical Committee and the semiconductor material (SAC/TC203) and focal points.
This standard was drafted. Guangdong Jia Yuan Technology Co., Ltd., Xianyang Reid Technology Co., Ltd., China Electronics Standardization
Hospital, Anhui copper foil crown Limited, Kingboard Fogang Industrial Co., Ltd., Hubei Branch foil Technology Limited, Qinghai electronic materials industry made
Exhibition Co., Ltd., Shandong Jinbao Electronics Co., Ltd. Heze Guangyuan Copper Strip.
The main drafters of this standard. High Yan Ru, Wang Junfeng, Chen Dingmiao, Li Yongzhen, Wang Xiang, Qi tube, Peikuai Chuan, Chen Shi, Ding Shiqi, Liu Xueping.
Metal foil for printed circuits General specification1 ScopeThis standard specifies the printed circuit has a carrier (film or foil) support and unsupported supporting metal foil (hereinafter referred to as a metal foil) the identity of behalf
No, the general technical requirements, quality assurance provisions, test methods, packaging, marking and storage and transportation requirements.
This standard applies to rigid, flexible printed circuit metal foil.2 Normative referencesThe following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein
Member. For undated references, the latest edition (including any amendments) applies to this document.
GB/T 2036 Printed Circuit Terminology
GB/T 8888 heavy non-ferrous metal processing products, packaging, labeling, transportation and storage
GB/T 29847-2013 Test method for copper foil for printed boards3 Terms and DefinitionsGB/T 2036 defined by the following terms and definitions apply to this document.
3.1
Elongation elongation
When the specimen fracture under tensile load, the effective portion of the sample from the increment between the reticle and the reticle between the initial distance ratio, expressed as a percentage
FIG.
3.2
Tensile strength tensilestrength
When the specimen fracture under tensile load, maximum load ratio of the average cross-sectional area of \u200b\u200bthe specimen.
3.3
Contour factor profilefactor
The average total thickness of the metal foil, the thickness of the sample exceeds the amount specified by the actual mass per unit area of \u200b\u200bthe metal foil and sample density calculations.
3.4
Profile of foilprofile
The processing and (or) enhanced adhesion treatment causes roughness of the metal foil surface.
3.5
Arithmetical mean deviation arithmeticalmeandeviationoftheprofile
Ra
In measuring length, from the centerline to the rough outline of the arithmetic mean of all absolute distances.
3.6
10.00 microscopic roughness height tenpointheightofirregularities
Rz
In measuring length, five consecutive maximum peak-to-average distance between the trough.
 
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