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GB/T 22376.2-2008: Adhesives -- Methods of preparing bulk specimens -- Part 2: Elevated-temperature-curing one-part systems
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| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 22376.2-2008 | English | 134 |
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Adhesives -- Methods of preparing bulk specimens -- Part 2: Elevated-temperature-curing one-part systems
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GB/T 22376.2-2008
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Basic data | Standard ID | GB/T 22376.2-2008 (GB/T22376.2-2008) | | Description (Translated English) | Adhesives -- Methods of preparing bulk specimens -- Part 2: Elevated-temperature-curing one-part systems | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | G38 | | Classification of International Standard | 83.180 | | Word Count Estimation | 7,715 | | Date of Issue | 2008-09-18 | | Date of Implementation | 2009-05-01 | | Quoted Standard | GB/T 11997; ISO 2818-1994 | | Adopted Standard | ISO 15166-2-2000, IDT | | Regulation (derived from) | National Standard Approval Announcement 2008 No.16 (Total No.129) | | Issuing agency(ies) | General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China | | Summary | This standard specifies the method for preparing adhesive body specimens. Suitable for the preparation of heat-curable, one-component adhesives, such as epoxy resins. Does not apply to gas release or by solvent evaporation and curing of the adhesive. | GB/T 22376.2-2008: Adhesives -- Methods of preparing bulk specimens -- Part 2: Elevated-temperature-curing one-part systems
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Adhesives Methods of preparing bulk specimens Part 2. Elevated-temperature-curing one-part systems
ICS 83.180
G38
National Standards of People's Republic of China
GB/T 22376.2-2008/ISO 15166-2.2000
Adhesive sample preparation method body
Part 2. Hot curing one-component system
(ISO 15166-2.2000, IDT)
Posted 2008-09-18
2009-05-01 implementation
Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China
Standardization Administration of China released
Foreword
GB/T 22376 "Adhesive bulk sample preparation method" is divided into two parts.
--- Part 1. Two-component system;
--- Part 2. Hot curing one-component system.
Preparation of 2000 "adhesive body specimens. This section GB/T 22376 Part 2, this part identical with ISO 15166-2
Part 2. Hot curing one-component systems "(in English).
This section is equivalent translation ISO 15166-2.2000, part of the normative references replaced by the national standards with international standards, the reference standard
Associate content with international standards there is no difference.
For ease of use, this standard to the following editorial changes.
a) "this International Standard" be replaced by "this standard";
b) Remove the preface to the international standards.
This part is proposed by the China Petroleum and Chemical Industry Association.
The adhesive part of the National Standardization Technical Committee (SAC/TC185) centralized.
This section is drafted. Shanghai Rubber Products Research Institute, Beijing Tianshan new materials technology limited liability company, Foshan Nanhai tyrants of chemical
Co., Ltd., Shanghai Kangda Chemical Co., Ltd.
The main drafters of this section. Bianzheng Jun, Feng Yan, Lin Huayu, Linxin Song.
GB/T 22376.2-2008/ISO 15166-2.2000
Introduction
In the design adhesive joints, it is necessary to know the exact value of the mechanical properties of structural adhesives, it is possible to calculate the stress load in the joint distribution
And to determine the adhesive damage allowable value. Use adhesive joints in the form of a sample to test the performance of the above-mentioned method is not ideal. Because the standard
Layer thickness on the sample size of the strain and the thickness value is generally small (typically < 1mm), so the value of the test strain not allowed. Moreover, a
Destruction of a bonded joint sample is usually due to stress caused by the multiple, the main factors are. the geometry of the glued joints, are
Performance and fillet size and geometry of the adherend. Although the destruction of data samples can provide information for the design of adhesive joints, but needed
To many in a single state of stress (such as shear and uniaxial tensile) deformation and destruction of data.
Use the appropriate sample size of the body, through the application of engineering standards is a measure of the mechanical properties under different loads and environmental conditions,
Such testing more accurate and low cost.
By sample preparation methods specified below can be obtained joint structure and properties of the sample and the corresponding bonding. Sticky adhesive and the adherend
Received performance-related information needed by the relevant test adhesive joints obtained.
GB/T 22376.2-2008/ISO 15166-2.2000
Adhesive sample preparation method body
Part 2. Hot curing one-component system
1 Scope
This section GB/T 22376 specifies the preparation of bulk adhesive sample.
The method is suitable for the preparation of heat-curable, one-component adhesives, such as epoxy resins. Does not apply to the release of gas or solvent evaporation by
Cured adhesive.
2 Normative references
The following documents contain provisions which, through reference GB/T 22376 in this section constitute provisions of this section. For dated reference documents
Member, all subsequent amendments (not including errata content) or revisions do not apply to this section, however, encouraged to reach under this section
Parties to research agreement to use the latest versions of these documents. For undated reference documents, the latest versions apply to this
section.
GB/T 11997 Preparation and use of plastic multipurpose test specimens (ISO 3167.1993, MOD)
ISO 2818.1994 --- plastic machining method for preparing a sample
3 Die
3.1 Overview
Mold should be composed of two plates separated by a frame. For non-free-flowing adhesive should be used U-frame or continuous box (see Figure 1).
3.2 Tablet
Preparation of 5mm thick metal plate using at least said two plates. This facilitates heat transfer adhesive curing process, but also to avoid sample preparation
Process due to an external force caused by deformation of the metal plate.
Copper and brass is a good conductor of heat, often used as plate material. However, when the use of certain copper corrosive ingredients, should be
Alternative metal material.
We should not stick to the metal plate to ensure that the adhesive cured.
NOTE. This is achieved by a layer of material attached to the surface of a low surface energy material to achieve, such as polytetrafluoroethylene (PTFE) film, or brushing or spraying on the surface of the mold
Release agent (PTFE spraying other surfaces adjacent to guard against contamination).
a) for non-free-flowing adhesive U-shaped frame b) for the continuous free-flowing adhesive frame
Examples of suitable model 1
When preparing fast room temperature curing and curing process will produce a lot of heat adhesive bulk sample, since this procedure may cause adhesive
Performance change, so mold metal plate should be designed to pass cooling water structures.
GB/T 22376.2-2008/ISO 15166-2.2000
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