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GB/T 20870.10-2023: Semiconductor devices - Part 16-10: Technology Approval Schedule for monolithic microwave integrated circuits
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Semiconductor devices - Part 16-10: Technology Approval Schedule for monolithic microwave integrated circuits
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GB/T 20870.10-2023
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Basic data | Standard ID | GB/T 20870.10-2023 (GB/T20870.10-2023) | | Description (Translated English) | Semiconductor devices - Part 16-10: Technology Approval Schedule for monolithic microwave integrated circuits | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L56 | | Classification of International Standard | 31.200 | | Word Count Estimation | 50,544 | | Date of Issue | 2023-09-07 | | Date of Implementation | 2024-01-01 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 20870.10-2023: Semiconductor devices - Part 16-10: Technology Approval Schedule for monolithic microwave integrated circuits
---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 31.200
CCSL56
National Standards of People's Republic of China
Semiconductor Devices Part 16-10.
Monolithic microwave integrated circuit technology receivable program
(IEC 60747-16-10.2004,IDT)
Published on 2023-09-07
2024-01-01 Implementation
State Administration for Market Regulation
Released by the National Standardization Administration Committee
Table of contents
Preface III
Introduction IV
1 Scope 1
2 Normative reference documents 1
3 Terms, definitions and abbreviations2
3.1 Units, symbols and terminology 2
3.2 Standard and preferred values 2
3.3 Terms and Definitions 2
3.4 Abbreviations 3
3.5 Definition of the scope of technically acceptable procedures 4
4 Definition of device technology 4
4.1 Scope of device technology 4
4.2 Activity description and flow chart 5
4.3 Technical Summary 6
4.4 Subcontractor control requirements 8
5 MMIC device design 8
5.1 Device design scope of MMIC8
5.2 Activity description and flow chart 9
5.3 Interface 10
5.4 Process confirmation and control 12
6 Mask Manufacturing 13
6.1 Scope of mask manufacturing13
6.2 Activity description and flow chart 13
6.3 Process confirmation and control13
6.4 Subcontractors, suppliers and internal suppliers13
7 MMIC wafer manufacturing13
7.1 MMIC wafer manufacturing scope 13
7.2 Activity Description and Flowchart 14
7.3 Device 16
7.4 Materials 17
7.5 Rework17
7.6 Process confirmation methods and control 17
7.7 Interrelationships 18
8 MMIC wafer testing 18
8.1 Scope of MMIC wafer testing 18
8.2 Activity Description and Flowchart 19
8.3 Equipment 19
8.4 Test Procedure 19
8.5 Interrelationships 20
9 Backside process for bare chip delivery20
9.1 Scope of backside process for bare chip delivery20
9.2 Activity Description and Flowchart 20
9.3 Device 22
9.4 Material 22
9.5 Process confirmation methods and control 22
9.6 Interrelationships 22
9.7 Validity of release23
10 MMIC assembly 23
10.1 Scope of MMIC assembly 23
10.2 Activity Description and Flowchart 23
10.3 Materials, inspection and handling 24
10.4 Equipment 25
10.5 Rework 25
10.6 Process Validation and Control 25
10.7 Interrelationships 25
11 MMIC test 26
11.1 Scope of MMIC testing 26
11.2 Activity Description and Flowchart 26
11.3 Equipment 28
11.4 Test Procedure 28
11.5 Interface 29
11.6 Process Validation and Control30
11.7 Process Limit Verification 31
11.8 Product Verification 34
12 Process Characterization 34
12.1 Identification of process characterization 34
12.2 Activity Description 35
12.3 Characterization procedure 36
13 Packaging and Shipping37
13.1 Activity Description and Flowchart 37
13.2 Interface 38
13.3 Validity of release38
14 Cancellation Technology Acceptable 38
Reference 40
Foreword
This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents"
Drafting.
This document is Part 10 of GB/T 20870 "Semiconductor Devices". GB/T 20870 has released the following parts.
---Part 16-1.Microwave integrated circuit amplifier;
---Part 16-2.Microwave integrated circuit prescaler;
---Part 16-5.Microwave integrated circuit oscillators;
---Part 16-10.Monolithic microwave integrated circuit technology receivable procedures.
This document is equivalent to IEC 60747-16-10.2004 "Semiconductor Devices Part 16-10 Monolithic Microwave Integrated Circuit Technology Acceptable
Collection Procedures”.
This document adds two chapters. "Normative Reference Documents" and "Terms, Definitions and Abbreviations".
Please note that some content in this document may be subject to patents. The publisher of this document assumes no responsibility for identifying patents.
This document is proposed by the Ministry of Industry and Information Technology of the People's Republic of China.
This document is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78).
This document was drafted by. The Thirteenth Research Institute of China Electronics Technology Group Corporation and the Military Representative Bureau of the Ministry of Equipment Development in Wuhan
Table room, Henan Zhuozheng Electronic Technology Co., Ltd., Hebei Beixin Semiconductor Technology Co., Ltd., Shenzhen Liangji Automation Equipment Co., Ltd., Zhang
Zhouhetai Electric Light Source Technology Co., Ltd., Chizhou Xinda Electronic Technology Co., Ltd., Shandong Zhongzhike Standardization Research Institute Co., Ltd.
The main drafters of this document. Shen Tongqian, Qiu Yu, Xie Xiaopin, Zhang Ruixia, Liu Lixin, Xue Kerui, Peng Hao, Pei Xuan, Gao Lei, Yin Lijing,
Hong Jianhua, Deng Zhichao, Li Minggang.
Introduction
Semiconductor devices are common basic products in the electronics industry chain and are the most basic units in electronic systems. GB/T 20870 "Semiconductors"
"Integrated Devices" is a microwave integrated circuit product standard. It is a basic and universal standard for the development, production and inspection of microwave integrated circuits.
Evaluating and assessing the quality and reliability of microwave integrated circuits plays an important role and is planned to consist of 10 parts.
---Part 16-1.Microwave integrated circuit amplifier. The purpose is to specify the terminology, basic ratings of microwave integrated circuit amplifiers
Values, properties, and test methods.
---Part 16-2.Microwave integrated circuit prescaler. The purpose is to specify the terms and letters of microwave integrated circuit prescalers.
Symbols, basic ratings, characteristics, and test methods.
---Part 16-3.Microwave integrated circuit frequency converter. The purpose is to specify the terminology and basic ratings of microwave integrated circuit inverters.
Values, properties, and test methods.
---Part 16-4.Microwave integrated circuit switches. The purpose is to specify the terminology, basic ratings, characteristics of microwave integrated circuit switches
properties and testing methods.
---Part 16-5.Microwave integrated circuit oscillators. The purpose is to specify the terminology, basic ratings of microwave integrated circuit oscillators
Values, properties, and test methods.
---Part 16-6.Microwave integrated circuit frequency multiplier. The purpose is to specify the terminology and basic ratings of microwave integrated circuit frequency multipliers.
Values, properties, and test methods.
---Part 16-7.Microwave integrated circuit attenuators. The purpose is to specify the terminology, basic ratings of microwave integrated circuit attenuators
Values, properties, and test methods.
---Part 16-8.Microwave integrated circuit limiter. The purpose is to specify the terminology, basic ratings of microwave integrated circuit limiters
Values, properties, and test methods.
---Part 16-9.Microwave integrated circuit phase shifters. The purpose is to specify the terminology, basic ratings of microwave integrated circuit phase shifters
Values, properties, and test methods.
---Part 16-10.Monolithic microwave integrated circuit technology receivable procedures. The purpose is to specify the design,
Terminology, definitions, symbols, quality systems, testing, evaluation, verification methods and other requirements for manufacturing and delivery.
This series of standards is equivalent to the IEC 60747-16 series of standards, ensuring that microwave integrated circuit product standards are consistent with international standards, achieving
Microwave integrated circuit product standards are in line with international standards. Through the formulation of this series of standards, the terminology definitions and basic specifications of microwave integrated circuit products are unified.
The fixed values, characteristics and test methods are of great significance to the research, production, inspection and use of microwave integrated circuits, and at the same time complement and improve the semiconductor
The integrated circuit standard system plays a guiding role in the development of the microwave integrated circuit industry.
Semiconductor Devices Part 16-10.
Monolithic microwave integrated circuit technology receivable program
1 Scope
This document specifies the terminology, definitions, symbols, quality systems, testing, evaluation and design of monolithic microwave integrated circuits.
pricing, verification methods, and other requirements.
2 Normative reference documents
The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, the dated quotations
For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to
this document.
Note. GB/T 2423 (all parts) Environmental test [IEC 60068 (all parts)]
ductordevices-Part 2.Dimensions)
Note. GB/T 4728 (all parts) Graphical symbols for electrical diagrams [IEC 60617 (all parts)]
Note. GB/T 20870.1-2007 Semiconductor devices Part 16-1.Microwave integrated circuit amplifiers (IEC 60747-16-1.2001, IDT)
cuits-Part 1.General)
QC001002-3.2005 IEC Quality Assessment System (IEC Q) Procedure Rules for Electronic Components Part 3.Approval Procedure (IEC
Quality Assessment System for Electronic Component(IEC Q)-Rule of procedure-Part 3.
Approval procedure
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