US$209.00 · In stock Delivery: <= 3 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 19444-2025: Test method for oxygen precipition characteristics of silicon wafers - Interstitial oxygen reduction Status: Valid GB/T 19444: Evolution and historical versions
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GB/T 19444-2025 | English | 209 |
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Test method for oxygen precipition characteristics of silicon wafers - Interstitial oxygen reduction
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GB/T 19444-2025
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GB/T 19444-2004 | English | 134 |
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Oxygen precipitation characterization of silicon wafers by measurement of interstitial oxygen reduction
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GB/T 19444-2004
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PDF similar to GB/T 19444-2025
Basic data Standard ID | GB/T 19444-2025 (GB/T19444-2025) | Description (Translated English) | Test method for oxygen precipition characteristics of silicon wafers - Interstitial oxygen reduction | Sector / Industry | National Standard (Recommended) | Classification of Chinese Standard | H21 | Classification of International Standard | 77.040 | Word Count Estimation | 10,117 | Date of Issue | 2025-06-30 | Date of Implementation | 2026-01-01 | Older Standard (superseded by this standard) | GB/T 19444-2004 | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration |
GB/T 19444-2025: Test method for oxygen precipition characteristics of silicon wafers - Interstitial oxygen reduction ---This is an excerpt. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.), auto-downloaded/delivered in 9 seconds, can be purchased online: https://www.ChineseStandard.net/PDF.aspx/GBT19444-2025
ICS 77.040
CCSH21
National Standard of the People's Republic of China
Replaces GB/T 19444-2004
Testing of silicon wafer oxygen precipitation characteristics
Interstitial oxygen content reduction method
Released on June 30, 2025
Implementation on January 1, 2026
State Administration for Market Regulation
The National Standardization Administration issued
Preface
This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1.Structure and drafting rules for standardization documents"
Drafting.
This document replaces GB/T 19444-2004 "Determination of oxygen precipitation characteristics of silicon wafers - Interstitial oxygen content reduction method" and GB/T 19444-
Compared with.2004, in addition to structural adjustments and editorial changes, the main technical changes are as follows.
a) The scope of application has been changed (see Chapter 1, Chapter 1 of the.2004 edition);
b) Added terms and definitions (see Chapter 3);
c) The principle of the method has been changed (see Chapter 4, Chapter 3 of the.2004 edition);
d) Increased interference factors (see Chapter 5);
e) Added test conditions (see Chapter 6);
f) The reagents or materials have been changed (see Chapter 7, Chapter 5 of the.2004 edition);
g) Added instruments and equipment (see Chapter 8);
h) The sample has been changed (see Chapter 9, Chapter 6 of the.2004 edition);
i) The test steps have been changed (see Chapter 10, Chapter 7 of the.2004 edition);
j) Added test data processing (see Chapter 11);
k) The precision has been changed (see Chapter 12, Chapter 10 of the.2004 edition);
l) The test report has been changed (see Chapter 13, Chapter 9 of the.2004 edition).
Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.
This document was jointly issued by the National Technical Committee on Semiconductor Equipment and Materials Standardization (SAC/TC203) and the National Technical Committee on Semiconductor Equipment and Materials Standardization (SAC/TC203).
It is jointly proposed and coordinated by the Materials Subcommittee of the Chemical Technology Committee (SAC/TC203/SC2).
This document was drafted by. Maxek Electronic Materials Co., Ltd., Zhejiang Zhongjing Technology Co., Ltd., and Longi Green Energy Technology Co., Ltd.
Co., Ltd., Inner Mongolia Zhonghuan Crystal Materials Co., Ltd., Zhejiang Haina Semiconductor Co., Ltd., Shandong Youyan Ace Semiconductor Materials Co., Ltd.
Co., Ltd., Zhejiang Jinruihong Technology Co., Ltd., Hangzhou Zhongxin Wafer Semiconductor Co., Ltd., Shanghai Hejing Silicon Materials Co., Ltd.
Company, Zhejiang University Ningbo Institute of Technology.
The main drafters of this document are. Fang Lixia, Chen Weiqun, Yao Xianpeng, Huang Xiaoxiao, Kou Wenhui, Wang Xinshe, Guo Hongqiang, Liu Lijuan, Xiao Shihao, Zhu Xiaotong,
Zhang Haiying, Wang Jianghua, Shang Haibo, and Zhang Jinbing.
This document was first published in.2004 and this is the first revision.
Testing of silicon wafer oxygen precipitation characteristics
Interstitial oxygen content reduction method
1 Scope
This document describes a method for testing the oxygen precipitation characteristics of silicon wafers by measuring the reduction in interstitial oxygen content before and after thermal treatment of the wafers.
This document applies to n-type silicon single crystals with room temperature resistivity greater than 0.1Ω·cm and p-type silicon with room temperature resistivity greater than 0.5Ω·cm
Testing of oxygen precipitation characteristics of single wafers.
2 Normative references
The contents of the following documents constitute the essential clauses of this document through normative references in this document.
For referenced documents without a date, only the version corresponding to that date applies to this document; for referenced documents without a date, the latest version (including all amendments) applies to
This document.
GB/T 1557-2018 Infrared absorption measurement method for interstitial oxygen content in silicon crystals
GB/T 6682 Specifications and test methods for water used in analytical laboratories
GB/T 14264 Terminology of Semiconductor Materials
3 Terms and Definitions
The terms and definitions defined in GB/T 14264 and the following apply to this document.
3.1
oxygen precipitation
During the crystal growth and subsequent heat treatment stages, oxygen atoms between the lattices react with silicon and other impurities in the silicon crystal to form oxygen deposits.
Accumulation of things.
3.2
Initial oxygen content initialoxygencontent
Interstitial oxygen content of silicon single wafer without heat treatment process.
3.3
Final oxygen content finaloxygencontent
Interstitial oxygen content of silicon single wafer after heat treatment process.
3.4
The difference between the initial oxygen content and the final oxygen content.
4 Principles
The sample was heat treated and the interstitial oxygen content of the sample before and after heat treatment was tested by infrared absorption method. The difference was regarded as
The amount of interstitial oxygen precipitation is used to characterize the oxygen precipitation characteristics of the sample.
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