Search result: GB/T 45325-2025
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Determination of length of heat affected zone for precious metal bonding wire - Scanning electron microscope method
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GB/T 45325-2025
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| Standard ID | GB/T 45325-2025 (GB/T45325-2025) | | Description (Translated English) | Determination of length of heat affected zone for precious metal bonding wire - Scanning electron microscope method | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | H21 | | Classification of International Standard | 77.040.99 | | Word Count Estimation | 14,151 | | Date of Issue | 2025-02-28 | | Date of Implementation | 2025-09-01 | | Issuing agency(ies) | State Administration for Market Regulation, National Standardization Administration |
GB/T 45325-2025.Determination of heat affected zone length of precious metal bonding wires - Scanning electron microscopy method
GB/T 45325-2025 English version. Determination of length of heat affected zone for precious metal bonding wire - Scanning electron microscope method
ICS 77.040.99
CCSH21
National Standard of the People's Republic of China
Determination of heat-affected zone length of precious metal bonding wire
Scanning electron microscopy
Released on 2025-02-28
2025-09-01 Implementation
State Administration for Market Regulation
The National Standardization Administration issued
Preface
This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for standardization work Part 1.Structure and drafting rules for standardization documents"
Drafting.
Please note that some of the contents of this document may involve patents. The issuing organization of this document does not assume the responsibility for identifying patents.
This document was proposed by China Nonferrous Metals Industry Association.
This document is under the jurisdiction of the National Technical Committee on Standardization of Nonferrous Metals (SAC/TC243).
This document was drafted by. Guiyan Testing Technology (Yunnan) Co., Ltd., Beijing Dabo Nonferrous Metal Solder Co., Ltd., Guiyan Semiconductor
Materials (Yunnan) Co., Ltd., Yantai Yinuo Electronic Materials Co., Ltd., Guohe General (Qingdao) Testing and Evaluation Co., Ltd., Chenzhou City Manufacturer
Product Quality Supervision and Inspection Institute, Yunnan Precious Metals Laboratory Co., Ltd., Nonferrous Metals Technology and Economic Research Institute Co., Ltd., Beijing Nonferrous Metals
Metal and Rare Earth Application Research Institute Co., Ltd., Zhejiang Jiabo Technology Co., Ltd.
The main drafters of this document are. Wang Yiqing, Mao Duan, Zhao Wanchun, Chen Wen, Chen Guohua, Zhou Wenyan, Xiang Lei, Zhu Wuxun, Yan Ru, Lin Liang, Qi Yuefeng,
Xue Ziye, Zhang Xiaochen, Zhang Zhuojia, Liu Jie, Bi Qinsong, Yuan Xiaohong, Liang Chen, Jin Yaqiu, Zhao Yidong.
Determination of heat affected zone length of precious metal bonding wire
Scanning electron microscopy
1 Scope
This document describes the SEM method for determining the heat affected zone length of various types of precious metal bonding wires (hereinafter referred to as "bonding wires").
Method 1 of this document is applicable to the determination of the length of the heat affected zone of bonding wire.
Method 2 of this document is applicable to the determination of the heat affected zone length of pure metal, alloy or composite bonding wires with a diameter not exceeding 50μm.
2 Normative references
The contents of the following documents constitute essential clauses of this document through normative references in this document.
For referenced documents without a date, only the version corresponding to that date applies to this document; for referenced documents without a date, the latest version (including all amendments) applies to
This document.
GB/T 23414-2009 Terminology for microbeam analysis scanning electron microscopy
GB/T 38783-2020 Scanning electron microscopy method for measuring thickness of precious metal composite coatings
3 Terms and definitions
The terms and definitions defined in GB/T 23414-2009 and the following apply to this document.
3.1
free air ballfreeairbal;FAB
During the wire bonding process, the high voltage arc breaks through the air and releases a large amount of heat, causing the end of the bonding wire to melt.
The action forms a metal ball at the end of the bonding wire.
3.2
Heat affected zone heat affected zone; HAZ
During the wire bonding process, the high temperature melts the end of the bonding wire to form a free air ball (FAB), and the heat conduction causes the bonding wire to
The FAB region is the area where recrystallization and grain growth occur.
3.3
Focused ion beam; FIB
The ion source is accelerated by an ion gun and focused by an electromagnetic lens to form an ion beam.
[Source. GB/T 38783-2020, 3.1, modified]
3.4
Dual beam electron microscope
A dual-beam (electron beam/ion beam) system that combines a focused ion beam with a scanning electron microscope.
[Source. GB/T 38783-2020, 3.2, modified]
3.5
Gas injection system gasinjectionsystem;GIS
In a dual-beam electron microscope, a system that injects various gas compounds to assist deposition or enhance etching.
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