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CJ/T 306-2009 English PDF

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CJ/T 306-2009: Requirement for chip technology of contactless CPU card in construction case
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PDF similar to CJ/T 306-2009


Standard similar to CJ/T 306-2009

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Basic data

Standard ID CJ/T 306-2009 (CJ/T306-2009)
Description (Translated English) Requirement for chip technology of contactless CPU card in construction case
Sector / Industry Urban Construction Industry Standard (Recommended)
Classification of Chinese Standard P07
Classification of International Standard 35.240.60
Word Count Estimation 48,445
Date of Issue 2009-05-19
Date of Implementation 2009-10-01
Quoted Standard GB/T 16649.5; CJ/T 166; JR/R 0025; ISO/IEC 14443-3; ISO/IEC 14443-4
Regulation (derived from) Bulletin of the Ministry of Housing and Urban No. 315
Issuing agency(ies) Ministry of Housing and Urban-Rural Development of the People's Republic of China
Summary This standard specifies the construction CPU card chip basic requirements, construction non-contact CPU card chip communication interface, contactless logical encryption card compatibility requirements and the corresponding definitions and symbols. This standard applies to construction in non-contact CPU card chip design, manufacture and use.

CJ/T 306-2009: Requirement for chip technology of contactless CPU card in construction case

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Requirement for chip technology of contactless CPU card in construction case ICS 35.240.60 P07 People's Republic of China urban construction industry standards Non-contact construction of CPU card chip technology requirements Released on May 19,.2009 2009-10-01 implementation Ministry of Housing and Urban-Rural Development, People's Republic of China released Directory Foreword Ⅲ 1 Scope 1 2 Normative references 1 3 Terms and definitions 1 4 Abbreviations and symbols indicate 3 5 construction CPU card chip basic requirements 5 5.1 microprocessor and coprocessor 5 5.2 encryption algorithm 5 5.3 Memory 5 5.4 Security Features 5 5.5 AC and DC parameters 6 5.6 Low-power design 6 6 construction CPU card chip non-contact communication interface 6 6.1 Non-contact communication interface type 6 6.2 Polling (Poling) 6 6.3 Class A communication signal interface 7 6.4 Class B communication signal interface 21 Appendix A (informative) PICC Cyclic redundancy check definition 31 Appendix B (Informative) PICC Status Description 32 Appendix C (informative) SFGT calculation 36 Appendix D (informative) error detection and recovery 37 Appendix E (informative) frame waiting time 39

Foreword

This standard Appendix A, Appendix B, Appendix C, Appendix D, Appendix E is an informative annex. This standard proposed by the Ministry of Housing and Urban Rural Development and standards. This standard is drafted by. Ministry of Housing and Urban Information Center, Ministry of Housing and Urban-Rural Development IC card application service center. Participated in the drafting of this standard. Chinese and foreign construction information limited liability company, built Yitong Data Processing Co., Ltd., Shanghai Fudan Microelectronics Co., Ltd., Core Semiconductor (Shanghai) Co., Ltd., Infineon Technologies (China) Co., Ltd., Eastcompeace Smart Card Co., Ltd., Yasuo Tuo Technology (Shanghai) Co., Ltd., Shanghai Cosmos Software Co., Ltd., Beijing Huadian Electronics Design Co., Ltd., NXP half Conductor (Shanghai) Co., Ltd., Motorola (China) Electronics Co., Ltd. Beijing Branch, Shanghai Huahong Integrated Circuit Co., Ltd., Canton East United Electronic Toll Co., Ltd., Shanghai Samsung Semiconductor Co., Ltd. The main drafters of this standard. Wang Hui, Du Hao, Zhou Xin, Ma Hong, Shen Fei Fei, Yang Hui, Wang Xin, Wang Yi, (the following by surname stroke order) Wang Baodong, Wang Hui, Sun Wei, Yu Xinlang, Zhang Yongjiang, Zhang Jianping, Li Xin, Li Need, Yang Xiaoye, Chen ?, Zhou Yi Tong, Chang Jiang, Zhao Ying, Liang Shaofeng, Liang Jianjun, Han Xingcheng. This standard is first formulated. Non-contact construction of CPU card chip technology requirements

1 Scope

This standard specifies the basic requirements of the construction business CPU chip, the construction of non-contact CPU chip communication interface, contactless logic Edit encryption card compatibility requirements and the corresponding definition of symbols and so on. This standard applies to the construction of non-contact CPU chip design, manufacture and use.

2 Normative references

The following documents contain provisions which, through reference in this standard and become the standard terms. All dated references, which are subsequently owned Amendments (not including errata content) or revisions do not apply to this standard, however, encourage the parties to reach an agreement based on this standard research Whether you can use the latest versions of these files. For undated references, the latest version applies to this standard. GB/T 16649.5 integrated circuit card identification card contacts - Part 5. Application identifier country numbering system and registration Procedures CJ/T 166 Construction Technology Application of Integrated Circuit (IC) Card JR/T 0025 China Financial Integrated Circuit (IC) card specification ISO /IEC 14443-3 Identification cards Contactless integrated circuit cards Proximity cards Part 3. Initialization and anti-collision ISO /IEC 14443-4 Identification cards Contactless integrated circuit cards Proximity cards Part 4. Transmission protocols

3 Terms and definitions

The following terms and definitions apply to this standard. 3.1 Description Completed and card exchange signals and supply card energy, without using through-current components (ie, there is no external interface device to the card Including the integrated circuit within the direct access). 3.2 An ID-1 card on which an integrated circuit has been mounted and which communicates with proximity-coupled devices in a contactless manner Into 3.3 An ID-1 card, on which integrated circuits and coupling circuits have been mounted and which is inductively coupled with a proximity coupling device. 3.4 Inductive coupling is used to power the PICC and control read/write devices that exchange data with the PICC. 3.5 Determine the time of a logic state, at the end of this period, a new bit will start. 3.6 The phase shift of 180 ° phase shift keying, resulting in two possible phase states.

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