|
Std ID |
Description (Standard Title) |
|
SJ/T 960-2000
|
Graphic representation for arrangement of side output electron beam tubes
|
|
SJ/T 99-2016
|
Series of laminations and laminations stack height for transformers and chockes
|
|
SJ/Z 1081-1976
|
General requirements for typical methods for the analysis of electroplating solution
|
|
SJ/Z 1082-1976
|
Typical methods for the analysis of nickel-plating solution
|
|
SJ/Z 1083-1976
|
Typical methods for the analysis of chromium-plating solution
|
|
SJ/Z 1084-1976
|
Typical methods for the analysis of copper-plating solution
|
|
SJ/Z 1085-1976
|
Typical methods for the analysis of zine-plating solution
|
|
SJ/Z 1086-1976
|
Typical methods for the analysis of cadmium-plating solution
|
|
SJ/Z 1087-1976
|
Typical methods for the analysis of tin-plating solution
|
|
SJ/Z 1088-1976
|
Typical methods for the analysis of cyaniding silver-plating solution
|
|
SJ/Z 1089-1976
|
Typical methods for the analysis of gold-plating solution
|
|
SJ/Z 1090-1976
|
Typical methods for the analysis of platinum plating solution
|
|
SJ/Z 1091-1976
|
Typical methods for the analysis of palladium plating solution
|
|
SJ/Z 1092-1976
|
Typical methods for the analysis of rhodium plating solution
|
|
SJ/Z 1093-1976
|
Typical methods for the analysis of cyaniding copper-zinc alloy (yellow porgy) plating solution
|
|
SJ/Z 1094-1976
|
Typical methods for the analysis of cyaniding coper-tin alloy plating solution
|
|
SJ/Z 1095-1976
|
Typical methods for the analysis of lead-tin alloy plating solution
|
|
SJ/Z 1096-1976
|
Typical methods for the analysis alloy coatings
|
|
SJ/Z 1097-1976
|
Typical methods for the analysis of other solutions
|
|
SJ/Z 1122-1976
|
Preferred series and types of fluorescent display tubes
|
|
SJ/Z 11266-2002
|
Safety of electronic equipment
|
|
SJ/Z 11289-2003
|
Guide of object-oriented domain engineering
|
|
SJ/Z 11351-2006
|
Integrated circuit IP core attributes with formats for profiling, selection and transfer standard
|
|
SJ/Z 11352-2006
|
Integrated circuit IP core test data interchange formats and guidelines specification
|
|
SJ/Z 11353-2006
|
Integrated circuit IP core transfer specification
|
|
SJ/Z 11354-2006
|
Integrated circuit analog/mixed-signal IP core specification
|
|
SJ/Z 11355-2006
|
Specification for integrated circuit IP/SoC functional verification
|
|
SJ/Z 11356-2006
|
On-Chip bus attributes specification
|
|
SJ/Z 11357-2006
|
Integrated circuit soft and hard IP core structural, performance and physica Imodeling specification
|
|
SJ/Z 11358-2006
|
Integrated circuit IP core model taxonomy
|
|
SJ/Z 11359-2006
|
Taxonomy of functional verification for integrated circuit IP core development and integration
|
|
SJ/Z 11360-2006
|
Integrated circuit IP core signal integrity specification
|
|
SJ/Z 11361-2006
|
Integrated circuit intellectual property core protection: schemes, alternatives and discussion
|
|
SJ/Z 11362-2006
|
Technical specification of enterprise informatization. Specification for manufacturing execution system
|
|
SJ 1.12-1987
|
Requirements for review of draft standards by technical committees for professional standardization
|
|
SJ/Z 11648-2016
|
(Radio frequency identification technology Warehousing Application Guide)
|
|
SJ/Z 1171-1977
|
Methods for determination of polarization curve of electroplating solution
|
|
SJ/Z 1172-1977
|
Methods for determination of throwing power of electroplating solution
|
|
SJ/Z 1173-1977
|
Methods for determination of current efficiency of electroplating solution
|
|
SJ/Z 1275-1977
|
(Electronic equipment design documentation, sample)
|
|
SJ/Z 1463-1979
|
General requirements for chemical analysis of electronic ceramic materials
|
|
SJ/Z 1464-1979
|
Method of chemical analysis of ore materials
|
|
SJ/Z 1465-1979
|
Method of chemical analysis of ceramic blank
|
|
SJ/Z 1466-1979
|
Method of chemical analysis of raw materials for use in chemical engineering
|
|
SJ/Z 1504-1979
|
(Permanent magnet materials, semi-finished chemical analysis methods)
|
|
SJ/Z 1505-1979
|
(Gyromagnetic material, semi-finished chemical analysis methods)
|
|
SJ/Z 1526-1979
|
Preferred series for siliver-zinc alkaline batteries
|
|
SJ/Z 1544-1979
|
Method for spectral analysis of Nickel-- Tungsten-Magnesium alloy
|
|
SJ/Z 1586-1980
|
Preferred series for heater voltage of electronic tubes
|
|
SJ/Z 1610-1980
|
(Silicon wafer defect Atlas)
|
|
SJ/Z 1758-1981
|
Typical calculations for 400Hz three-phase power transformers using E-cores
|
|
SJ/Z 1762-1981
|
Typical calculations for 50Hz single-phase power tranformers and filter choke using C-cores
|
|
SJ/Z 1763-1981
|
Typical calculations for 50Hz three-phase power transformers using E-cores
|
|
SJ/Z 1766-1981
|
(Ferrite material series and test methods)
|
|
SJ/Z 1792-1981
|
Electrical performance requirements for assembling of special equipment for electronic industry
|
|
SJ/Z 1850-1981
|
Design for medium and low-duty audio transformers
|
|
SJ/Z 1941-1981
|
General specification for machining operation of special equipment for electronic industry
|
|
SJ/Z 2014-1982
|
Terms and definitions for quality management
|
|
SJ/Z 2067-1982
|
General specification for forgings of special equipment for electronic industry
|
|
SJ/Z 2068-1982
|
General specification for metallic welding of special equipments for electronic industry
|
|
SJ/Z 2082-1982
|
Rare earth-cobalt permanent magnet for permanent d. c. moment motors
|
|
SJ/Z 2091-1982
|
Information processing interchange--Arrangement and interface of usual control and function keys of 7-bit coded character set keyboard
|
|
SJ/Z 21080-2016
|
(Guidance on the Evaluation of Production Capacity of Military Printed Board)
|
|
SJ/Z 21087-2016
|
(Printed board drilling guide)
|
|
SJ/Z 21088-2016
|
(Printed board solder mask processing guide)
|
|
SJ/Z 21089-2016
|
(Printed copper guide for printed circuit boards)
|
|
SJ/Z 21090-2016
|
(Guidelines for hot - air leveling of printed boards)
|
|
SJ/Z 21146-2016
|
(Guide for Typical Parameter Description of Military Electronic Components)
|
|
SJ/Z 2165-1982
|
Typical calculations for single-phase power transformers and filter chokes using C-cores
|
|
SJ/Z 2312-1983
|
Methods of measurement for climatic environmental test equipnent for electronic industry
|
|
SJ/Z 2321-1983
|
(Electronic ceramic zirconium dioxide impurity emission spectrometry method)
|
|
SJ/Z 2556-1984
|
Typical calculations for 50Hz single-phase power transformers using GE/GEB cores
|
|
SJ/Z 2567-1985
|
Preferred series for slide switches
|
|
SJ/Z 2574-1985
|
(Typical paint coating process)
|
|
SJ/Z 2583-1985
|
(The composition and preparation of software product design documents)
|
|
SJ/Z 2603-1985
|
Drawings of associated parts for XCD-type C-cores for single-phase transformers and chokes
|
|
SJ/Z 2655-1986
|
Collection of single crystal Germaninm defects
|
|
SJ/Z 2740-1986
|
Guide to Quality assurance system for electric industrial enterprises
|
|
SJ/Z 2782-1987
|
Method of analysis for overall activation process of non-evaporable getrters (catmasphere method)
|
|
SJ/Z 2808-1987
|
Thermal design of printed board assemblies
|
|
SJ/Z 2808-2015
|
Military software quality measurement-Reliability - Part 3: Testing method
|
|
SJ/Z 2815-1987
|
Sampling procedures and tables for lot-by-lot inspection by attributes (applicable to inspection of isolated lot or batch)
|
|
SJ/Z 2921-1988
|
Calculating methods for transformers for switched mode power supplies
|
|
SJ/Z 2922-1988
|
Choking methods for acoustic noise of transformers and chokes for use in electronic equipment
|
|
SJ/Z 2924-1988
|
Technical guide to the optimum designing of vibration and shock isolators
|
|
SJ/Z 2926-1988
|
Test methods for properties of mask-making equipment for manufacturing of ICs
|
|
SJ/Z 2927-1988
|
Terminology for mask-making equipment for integrated circuits manufacturing
|
|
SJ/Z 2976-1988
|
Test method for physical characteristics of brazing for electronic devices--Determination of pull brazed away temperature of brazing
|
|
SJ/Z 3200-1989
|
Typical solder process adopted in electronic industry-Flame soldering copper wareguide manually
|
|
SJ/Z 3201-1989
|
Typical solder process adopted in electronic industry-Flame soldering aluminium waveguide manually
|
|
SJ/Z 3202-1989
|
Typical solder process adopted in electronic industry-Electron beam solder
|
|
SJ/Z 3206.10-1989
|
General rules for analysis of properties of emision spectrum
|
|
SJ/Z 3206.11-1989
|
General rules for analysis of quantities of emision spectrum
|
|
SJ/Z 3206.1-1989
|
General requirements for laboratories involved with determination of emision spectrum
|
|
SJ/Z 3206.12-1989
|
General rules for emission spectrum analysis for vacuum materials
|
|
SJ/Z 3206.13-1989
|
General rules for emision spectrum analysis for semiconductor materials
|
|
SJ/Z 3206.14-1989
|
General rules for error in spectrum chemical analysis and data processing in laboratories
|
|
SJ/Z 3206.2-1989
|
Laser source and its performance requirements for determination of emision spectrum
|
|
SJ/Z 3206.3-1989
|
Instrument and its performance requirements for determination of emision spectrum
|
|
SJ/Z 3206.4-1989
|
General rule for use of sensitized plate using spectrum
|