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GB/T 36476-2018: General specification for metal base copper-clad laminates for printed circuits
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General specification for metal base copper-clad laminates for printed circuits
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GB/T 36476-2018
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PDF similar to GB/T 36476-2018
Standard similar to GB/T 36476-2018 GB/T 12631 GB/T 45638 GB/T 19405.3 Basic data | Standard ID | GB/T 36476-2018 (GB/T36476-2018) | | Description (Translated English) | General specification for metal base copper-clad laminates for printed circuits | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L30 | | Classification of International Standard | 31.180 | | Word Count Estimation | 30,358 | | Date of Issue | 2018-06-07 | | Date of Implementation | 2019-01-01 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 36476-2018: General specification for metal base copper-clad laminates for printed circuits---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
General specification for metal base copper-clad laminates for printed circuits
ICS 31.180
L30
National Standards of People's Republic of China
General specification for metal-based copper clad laminates for printed circuits
Published on.2018-06-07
2019-01-01 implementation
State market supervision and administration
China National Standardization Administration issued
Content
Foreword III
1 Scope 1
2 Normative references 1
3 Terms and Definitions 1
4 model, naming, identification and code 2
4.1 Model 2
4.2 Name 2
4.3 Identification and Code 2
5 Structures and materials 4
5.1 Structure 4
5.2 Material 4
6 Requirements 5
6.1 General 5
6.2 Appearance 5
6.3 size 6
6.4 Performance Requirements 8
7 Inspection rules 10
7.1 Inspection classification 10
7.2 Material Inspection 10
7.3 Identification test 11
7.4 Quality consistency test 13
8 Test method 14
8.1 Sample Preparation 14
8.2 Appearance 14
8.3 Size 14
8.4 Thermal Conductivity (Insulator Layer) 15
8.5 Thermal impedance 15
8.6 Peel strength 15
8.7 Water absorption rate 15
8.8 Copper foil surface cleanability 15
8.9 Thermal stress 15
8.10 Chemical resistance 15
8.11 Glass transition temperature (Tg) 15
8.12 Flammability 15
8.13 Copper etchability 16
8.14 Solderability 16
8.15 Dielectric constant and loss factor 16
8.16 Volume resistivity and surface resistivity 16
8.17 Electrical strength (perpendicular to the surface of the board) 16
8.18 compared to the tracking index 16
8.19 Arc resistance 17
8.20 withstand voltage 17
9 Packaging, marking, transportation and storage 17
9.1 Packing 17
9.2 Mark 17
9.3 Transportation 17
9.4 Storage 17
10 Order Information 17
Appendix A (Normative) Thermal Conductivity and Thermal Impedance Test Method 18
Appendix B (Normative) Media withstand voltage test (high voltage test) 24
Foreword
This standard was drafted in accordance with the rules given in GB/T 1.1-2009.
Please note that some of the contents of this document may involve patents. The issuing organization of this document is not responsible for identifying these patents.
This standard is under the jurisdiction of the National Printed Circuit Standardization Technical Committee (SAC/TC47).
This standard was drafted. Zhuhai Quanbao Electronic Technology Co., Ltd., Xianyang Ruide Technology Co., Ltd., Zhejiang Huazheng New Materials Co., Ltd.
Company, Tianjin Jinghong Electronic Materials Co., Ltd.
The main drafters of this standard. Dai Jianhong, Gao Yanru, Jiang Wei, Zhang Hua, Shi Jianjun, Cao Yi, Zhao Yuancheng, Zeng Yaode, Li Huijuan.
General specification for metal-based copper clad laminates for printed circuits
1 Scope
This standard specifies the structure and material of metal-based (aluminum-based, copper-based) copper-clad laminates for printed circuits (hereinafter referred to as metal-based copper-clad laminates).
Materials, requirements, inspection rules, inspection methods, packaging, marking, transportation and storage.
This standard applies to metal-based (aluminum-based, copper-based) copper clad laminates for printed circuits, and is not suitable for iron-based copper clad laminates for printed circuits. Printed circuit
Other metal-based copper clad laminates and metal-based copper clad laminates for microwave circuits can be referred to.
2 Normative references
The following documents are indispensable for the application of this document. For dated references, only dated versions apply to this article.
Pieces. For undated references, the latest edition (including all amendments) applies to this document.
GB/T 2036 printed circuit terminology
GB/T 2040 copper and copper alloy sheet
GB/T 2059 copper and copper alloy strip
GB/T 3198 aluminum and aluminum alloy foil
GB/T 3880 General industrial aluminum and aluminum alloy plates and strips
GB/T 4722-2017 Test method for rigid copper clad laminate for printed circuits
GB/T 4957-2003 Non-conductive coating on non-magnetic base metal, thickness measurement, eddy current method
GB/T 5230 electrolytic copper foil
SJ20780-2000 Flame Retardant Aluminum-based Copper Clad Laminate Specification
3 Terms and definitions
The following terms and definitions as defined in GB/T 2036 apply to this document.
3.1
Thermal conductivity
The ratio of heat flux density to temperature gradient under steady-state heat conduction, in watts per meter Kelvin [W/(m·K)].
Note. The thermal conductivity of a material varies with temperature, so the average temperature of the material at which the thermal conductivity is measured is also given.
3.2
Thermal impedance thermalimpedance
Apparent thermal resistance
The temperature difference (Δt) between the two isothermal interfaces is divided by the heat flux density (q) through the two isothermal surfaces, in units of Kelvin square meters per watt (K·m2/W).
3.3
Heat flux density heatfluxdensity
The amount of heat (Q) transmitted per unit area (A) per unit time is called heat flux density and is expressed by q=Q/A. The unit is watts per square
Meter (W/m2).
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