HG/T 20513-2014 PDF English
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HG/T 20513-2014: Design code of instrument grounding---This is an excerpt. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.), auto-downloaded/delivered in 9 seconds, can be purchased online: https://www.ChineseStandard.net/PDF.aspx/HGT20513-2014
HG
CHEMICAL INDUSTRY STANDARD
OF THE PEOPLE'S REPUBLIC OF CHINA
Filing number. J 1819-2014
Replacing HG/T 20513-2000
Design code of instrument grounding
Issued on. MAY 6, 2014
Implemented on. OCTOBER 1, 2014
Issued by. Ministry of Industry and Information Technology of the People's
Republic of China.
CHEMICAL INDUSTRY STANDARD
OF THE PEOPLE'S REPUBLIC OF CHINA
Design code of instrument grounding
Editor-in-chief. Hualu Engineering Technology Co., Ltd.
Approval authority. Ministry of Industry and Information Technology of the People's
Republic of China
Implementation date. October 1, 2014
Table of Contents
Foreword... 4
1 General... 6
2 Terms... 6
3 Grounding categories... 7
3.1 Safety grounding... 7
3.2 Working grounding... 8
3.3 Intrinsically safe grounding... 8
3.4 Electrostatic protective earthing... 9
4 Grounding system and grounding principles... 9
5 Bonding methods... 11
5.1 Field instrument bonding method... 11
5.2 Fieldbus instrument cable shielding grounding method... 14
5.3 Bonding method for instruments in the control room/field cabinet room... 16
6 Grounding system bonding requirements... 20
6.1 Bonding specifications... 20
6.2 Bonding bar and bonding terminal bar specifications... 20
6.3 Requirements for bonding structure... 20
7 Grounding resistance... 21
Explanation of words used in this standard... 22
1 General
1.0.1 This standard is formulated in order to unify the technical requirements for
instrument system grounding design in the chemical industry, promote the
standardization of instrument system grounding design, and achieve the goals of
technological advancement, economic rationality, safety, and applicability.
1.0.2 This standard is applicable to the design of grounding systems for instrument and
automatic control system engineering in the chemical industry.
1.0.3 In addition to complying with the requirements of this standard, the design of the
instrument grounding system shall also comply with the relevant current national
standards.
2 Terms
2.0.1 safety grounding
Grounding for the protection of instruments and personal safety, which is also called
safe grounding.
2.0.2 working grounding
Grounding required for the normal operation of instrument and control systems.
2.0.3 shielding grounding
Grounding is adopted to avoid electromagnetic field interference on instruments and
signals.
2.0.4 intrinsically safe grounding
Grounding required for proper operation of intrinsically safe instruments.
2.0.5 equipotential bonding
The connection by which the individual conductors are connected and equal to earth's
potential.
2.0.6 connecting resistance
The sum of the resistance of the conductors and connection points from the grounding
terminal of instruments and equipment to the grounding electrode.
3 Grounding categories
3.1 Safety grounding
3.1.1 The metal casing of electrical instruments and the normally non-energized metal
parts of automatic control equipment may carry dangerous voltage due to various
reasons (such as insulation damage). The safety grounding shall be implemented for the
following electrical instruments and automatic control equipment.
3.1.3 For field instruments, transmitters and local switches with a power supply lower
than 36 V, safety grounding is not required unless there are special needs.
3.1.4 Automatic control equipment that has safety grounding can be considered to have
electrostatic grounding. When using an anti-static raised floor in the control room,
electrostatic grounding shall be done. Electrostatic grounding shall share the grounding
system with safety grounding.
3.2 Working grounding
3.2.1 Working grounding shall include signal loop grounding and shielding grounding.
3.3 Intrinsically safe grounding
3.3.1 For components of intrinsically safe instruments that need to be grounded for
safety functions, the intrinsically safe grounding shall be implemented according to the
requirements of the instrument manufacturer.
3.3.2 The bus bar of the Zener safety barrier shall be connected to the common terminal
of the DC power supply, and the bus bar (or guide rail) of the Zener safety barrier shall
be intrinsically safe grounded.
3.3.3 The isolation safety barrier does not need to be grounded.
3.4 Electrostatic protective earthing
3.4.1 Control rooms, cabinet rooms, and process control computer rooms where
automatic control systems and other equipment are installed shall be grounded against
static electricity. These indoor static conductive floors, anti-static raised floors,
workbenches, etc. shall be anti-static grounded.
3.4.2 Instruments and equipment, for which the safety grounding and working
grounding are implemented, do not need to be grounded against static electricity.
4 Grounding system and grounding principles
4.0.1 The grounding system shall consist of two parts. bonding and earthing termination
system.
4.0.3 All types of grounding in the instrument system shall be connected to the main
grounding plate to achieve equipotential connection. They share the earthing
termination system with electrical devices and then are connected to the equipotential
network.
5 Bonding methods
5.1 Field instrument bonding method
5.1.1 For the safety grounding of field instrument cable troughs, instrument cable
protective tubes and instrument shells above 36 V, bonding wires shall be connected to
nearby grounded metal components every 30 m, and the reliability and electrical
continuity of the grounding shall be ensured. Metal equipment and pipelines for storing
or transporting flammable media as well as related metal components shall not be used
for grounding.
5.1.3 For field instruments that require or need to be grounded on site, they shall be
grounded on the field side (see Figure 5.1.3).
5.2 Fieldbus instrument cable shielding grounding method
5.2.1 The signals of the fieldbus instrument system are transmitted by digital
communication. The grounding of the shielding layer of the bus signal cable is different
from that of the analog signal cable. Both ends of the shielding layer of the bus cable
should be grounded (see Figure 5.2.1).
5.2.2 When it is not certain that there is a good equipotential grounding system between
the control room and the field, it is advisable to directly ground the shielding layer at
the field end of the bus signal cable shielding layer, and the other end of the cable
shielding layer is connected to the grounding system through a capacitor. In places with
explosive hazards, the capacitor connection grounding end of the cable shielding layer
shall be set in a non-explosive safe place (see Figure 5.2.2).
5.2.3 The metal housings of all fieldbus instruments shall be connected to the
equipotential grounding system.
5.2.4 For bonding of digital communication cable shields between systems, it is
advisable to use a capacitor to connect to the grounding system at one end of the
communication cable shielding layer, and the other end is directly grounded. The
capacitor connection grounding end of the cable shielding layer shall be set up in a non-
explosive safe place (see Figure 5.2.4).
Figure 5.2.4 -- Shielding grounding of communication cables between
equipotential bonding control systems
5.3 Bonding method for instruments in the control room/field cabinet room
6 Grounding system bonding requirements
6.1 Bonding specifications
6.1.1 The conductors of the grounding system shall be multi-stranded copper core
insulated wires or cables.
6.1.2 The cross-section of the grounding system connecting wire should be selected
according to the type of bonding and the following values.
Bonding wire. 1 mm2~2.5 mm2; grounding branch trunk wire. 4 mm2~16 mm2; bonding
trunk wire. 10 mm2~25 mm2; grounding main line. 16 mm2~50 mm2.
6.2 Bonding bar and bonding terminal bar specifications
6.2.1 The bonding bar should be made of 25 mm×6 mm copper strips, or it can be
formed by the combination of connecting terminals.
6.2.2 The bonding terminal bar and main grounding plate should be made of copper
plates. The thickness of the copper plate shall not be less than 6 mm, and the length and
width dimensions shall be determined as needed.
6.3 Requirements for bonding structure
6.3.1 All bonding wires shall be well insulated before being connected to the bonding
bar; all grounding branch trunk wires shall be well insulated before being connected to
the bonding terminal bar; all bonding trunk wires shall be well insulated before being
connected to the main grounding plate.
6.3.2 The bonding bar (bus bar), bonding terminal bar, and main grounding plate shall
be fixed with insulating brackets.
6.3.3 Various connections of the grounding system shall ensure good electrical
conductivity.
6.3.4 The grounding system shall be marked with durability. The color of identification
shall comply with the provisions of Table 6.3.4.
7 Grounding resistance
7.0.1 The grounding connecting resistance of the instrument system shall not be greater
than 1 Ω.
7.0.2 The grounding resistance of the instrument system shall not be greater than 4 Ω.
Explanation of words used in this standard
HG/T 20513-2014
HG
CHEMICAL INDUSTRY STANDARD
OF THE PEOPLE'S REPUBLIC OF CHINA
Filing number. J 1819-2014
Replacing HG/T 20513-2000
Design code of instrument grounding
Issued on. MAY 6, 2014
Implemented on. OCTOBER 1, 2014
Issued by. Ministry of Industry and Information Technology of the People's
Republic of China.
CHEMICAL INDUSTRY STANDARD
OF THE PEOPLE'S REPUBLIC OF CHINA
Design code of instrument grounding
Editor-in-chief. Hualu Engineering Technology Co., Ltd.
Approval authority. Ministry of Industry and Information Technology of the People's
Republic of China
Implementation date. October 1, 2014
Table of Contents
Foreword... 4
1 General... 6
2 Terms... 6
3 Grounding categories... 7
3.1 Safety grounding... 7
3.2 Working grounding... 8
3.3 Intrinsically safe grounding... 8
3.4 Electrostatic protective earthing... 9
4 Grounding system and grounding principles... 9
5 Bonding methods... 11
5.1 Field instrument bonding method... 11
5.2 Fieldbus instrument cable shielding grounding method... 14
5.3 Bonding method for instruments in the control room/field cabinet room... 16
6 Grounding system bonding requirements... 20
6.1 Bonding specifications... 20
6.2 Bonding bar and bonding terminal bar specifications... 20
6.3 Requirements for bonding structure... 20
7 Grounding resistance... 21
Explanation of words used in this standard... 22
1 General
1.0.1 This standard is formulated in order to unify the technical requirements for
instrument system grounding design in the chemical industry, promote the
standardization of instrument system grounding design, and achieve the goals of
technological advancement, economic rationality, safety, and applicability.
1.0.2 This standard is applicable to the design of grounding systems for instrument and
automatic control system engineering in the chemical industry.
1.0.3 In addition to complying with the requirements of this standard, the design of the
instrument grounding system shall also comply with the relevant current national
standards.
2 Terms
2.0.1 safety grounding
Grounding for the protection of instruments and personal safety, which is also called
safe grounding.
2.0.2 working grounding
Grounding required for the normal operation of instrument and control systems.
2.0.3 shielding grounding
Grounding is adopted to avoid electromagnetic field interference on instruments and
signals.
2.0.4 intrinsically safe grounding
Grounding required for proper operation of intrinsically safe instruments.
2.0.5 equipotential bonding
The connection by which the individual conductors are connected and equal to earth's
potential.
2.0.6 connecting resistance
The sum of the resistance of the conductors and connection points from the grounding
terminal of instruments and equipment to the grounding electrode.
3 Grounding categories
3.1 Safety grounding
3.1.1 The metal casing of electrical instruments and the normally non-energized metal
parts of automatic control equipment may carry dangerous voltage due to various
reasons (such as insulation damage). The safety grounding shall be implemented for the
following electrical instruments and automatic control equipment.
3.1.3 For field instruments, transmitters and local switches with a power supply lower
than 36 V, safety grounding is not required unless there are special needs.
3.1.4 Automatic control equipment that has safety grounding can be considered to have
electrostatic grounding. When using an anti-static raised floor in the control room,
electrostatic grounding shall be done. Electrostatic grounding shall share the grounding
system with safety grounding.
3.2 Working grounding
3.2.1 Working grounding shall include signal loop grounding and shielding grounding.
3.3 Intrinsically safe grounding
3.3.1 For components of intrinsically safe instruments that need to be grounded for
safety functions, the intrinsically safe grounding shall be implemented according to the
requirements of the instrument manufacturer.
3.3.2 The bus bar of the Zener safety barrier shall be connected to the common terminal
of the DC power supply, and the bus bar (or guide rail) of the Zener safety barrier shall
be intrinsically safe grounded.
3.3.3 The isolation safety barrier does not need to be grounded.
3.4 Electrostatic protective earthing
3.4.1 Control rooms, cabinet rooms, and process control computer rooms where
automatic control systems and other equipment are installed shall be grounded against
static electricity. These indoor static conductive floors, anti-static raised floors,
workbenches, etc. shall be anti-static grounded.
3.4.2 Instruments and equipment, for which the safety grounding and working
grounding are implemented, do not need to be grounded against static electricity.
4 Grounding system and grounding principles
4.0.1 The grounding system shall consist of two parts. bonding and earthing termination
system.
4.0.3 All types of grounding in the instrument system shall be connected to the main
grounding plate to achieve equipotential connection. They share the earthing
termination system with electrical devices and then are connected to the equipotential
network.
5 Bonding methods
5.1 Field instrument bonding method
5.1.1 For the safety grounding of field instrument cable troughs, instrument cable
protective tubes and instrument shells above 36 V, bonding wires shall be connected to
nearby grounded metal components every 30 m, and the reliability and electrical
continuity of the grounding shall be ensured. Metal equipment and pipelines for storing
or transporting flammable media as well as related metal components shall not be used
for grounding.
5.1.3 For field instruments that require or need to be grounded on site, they shall be
grounded on the field side (see Figure 5.1.3).
5.2 Fieldbus instrument cable shielding grounding method
5.2.1 The signals of the fieldbus instrument system are transmitted by digital
communication. The grounding of the shielding layer of the bus signal cable is different
from that of the analog signal cable. Both ends of the shielding layer of the bus cable
should be grounded (see Figure 5.2.1).
5.2.2 When it is not certain that there is a good equipotential grounding system between
the control room and the field, it is advisable to directly ground the shielding layer at
the field end of the bus signal cable shielding layer, and the other end of the cable
shielding layer is connected to the grounding system through a capacitor. In places with
explosive hazards, the capacitor connection grounding end of the cable shielding layer
shall be set in a non-explosive safe place (see Figure 5.2.2).
5.2.3 The metal housings of all fieldbus instruments shall be connected to the
equipotential grounding system.
5.2.4 For bonding of digital communication cable shields between systems, it is
advisable to use a capacitor to connect to the grounding system at one end of the
communication cable shielding layer, and the other end is directly grounded. The
capacitor connection grounding end of the cable shielding layer shall be set up in a non-
explosive safe place (see Figure 5.2.4).
Figure 5.2.4 -- Shielding grounding of communication cables between
equipotential bonding control systems
5.3 Bonding method for instruments in the control room/field cabinet room
6 Grounding system bonding requirements
6.1 Bonding specifications
6.1.1 The conductors of the grounding system shall be multi-stranded copper core
insulated wires or cables.
6.1.2 The cross-section of the grounding system connecting wire should be selected
according to the type of bonding and the following values.
Bonding wire. 1 mm2~2.5 mm2; grounding branch trunk wire. 4 mm2~16 mm2; bonding
trunk wire. 10 mm2~25 mm2; grounding main line. 16 mm2~50 mm2.
6.2 Bonding bar and bonding terminal bar specifications
6.2.1 The bonding bar should be made of 25 mm×6 mm copper strips, or it can be
formed by the combination of connecting terminals.
6.2.2 The bonding terminal bar and main grounding plate should be made of copper
plates. The thickness of the copper plate shall not be less than 6 mm, and the length and
width dimensions shall be determined as needed.
6.3 Requirements for bonding structure
6.3.1 All bonding wires shall be well insulated before being connected to the bonding
bar; all grounding branch trunk wires shall be well insulated before being connected to
the bonding terminal bar; all bonding trunk wires shall be well insulated before being
connected to the main grounding plate.
6.3.2 The bonding bar (bus bar), bonding terminal bar, and main grounding plate shall
be fixed with insulating brackets.
6.3.3 Various connections of the grounding system shall ensure good electrical
conductivity.
6.3.4 The grounding system shall be marked with durability. The color of identification
shall comply with the provisions of Table 6.3.4.
7 Grounding resistance
7.0.1 The grounding connecting resistance of the instrument system shall not be greater
than 1 Ω.
7.0.2 The grounding resistance of the instrument system shall not be greater than 4 Ω.
Explanation of words used in this standard
......
Source: Above contents are excerpted from the full-copy PDF -- translated/reviewed by: www.ChineseStandard.net / Wayne Zheng et al.
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