SJ/T 10455-2020 PDF English
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SJ/T 10455: Historical versions
| Std ID | Version | USD | Buy | Deliver [PDF] in | Title (Description) |
| SJ/T 10455-2020 | English | 279 | Add to Cart | 3 days [Need to translate] | Copper conductor paste for thick film hybrid integrated circuits |
| SJ/T 10455-1993 | English | 319 | Add to Cart | 3 days [Need to translate] | Copper conductor pastc for thick film hybrid integrated circuits |
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Basic data
| Standard ID | SJ/T 10455-2020 (SJ/T10455-2020) |
| Description (Translated English) | Copper conductor paste for thick film hybrid integrated circuits |
| Sector / Industry | Electronics Industry Standard (Recommended) |
| Classification of Chinese Standard | L90 |
| Classification of International Standard | 31.030 |
| Word Count Estimation | 12,110 |
| Date of Issue | 2020-12-09 |
| Date of Implementation | 2021-04-01 |
| Older Standard (superseded by this standard) | SJ/T 10455-1993 |
| Quoted Standard | GB/T 2421-1999; GJB 548B-2005; SJ/T 11512-2015 |
| Regulation (derived from) | Ministry of Industry and Information Technology Announcement No. 48 (2020) |
| Issuing agency(ies) | Ministry of Industry and Information Technology |
| Summary | This standard specifies the technical requirements, test methods, inspection rules, packaging, storage and transportation of copper conductor paste for thick film hybrid integrated circuits (hereinafter referred to as paste). This standard applies to copper conductor paste for thick film hybrid integrated circuits. |