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SJ/T 10454-2020 English PDF

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SJ/T 10454-2020: Dielectric paste for multilayer lay out of thick film hybrid integrated circuits
Status: Valid

SJ/T 10454: Historical versions

Standard IDUSDBUY PDFLead-DaysStandard Title (Description)Status
SJ/T 10454-2020259 Add to Cart 3 days Dielectric paste for multilayer lay out of thick film hybrid integrated circuits Valid
SJ/T 10454-1993279 Add to Cart 3 days Dielectric paste for multilayer lay out of thick film hybrid integrated circuits Obsolete

Similar standards

SJ/T 11634   GB/T 11446.10   GB/T 11446.1   SJ/T 11801   SJ/T 10455   SJ/T 10464   

Basic data

Standard ID: SJ/T 10454-2020 (SJ/T10454-2020)
Description (Translated English): Dielectric paste for multilayer lay out of thick film hybrid integrated circuits
Sector / Industry: Electronics Industry Standard (Recommended)
Classification of Chinese Standard: L90
Classification of International Standard: 31.030
Word Count Estimation: 11,116
Date of Issue: 2020-12-09
Date of Implementation: 2021-04-01
Older Standard (superseded by this standard): SJ/T 10454-1993
Quoted Standard: GB/T 2423 2-2008; GB/T 2423.3 2006; GB/T 2423.22-2012; SJ/T 11512-2015
Regulation (derived from): Ministry of Industry and Information Technology Announcement No. 48 (2020)
Issuing agency(ies): Ministry of Industry and Information Technology
Summary: This standard specifies the technical requirements, test methods, inspection rules, packaging, storage and transportation of dielectric pastes for thick film hybrid integrated circuit multilayer wiring (hereinafter referred to as pastes). This standard applies to dielectric pastes for thick film hybrid integrated circuit multilayer wiring that match gold, palladium and silver conductor pastes.
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