US$229.00 ยท In stock Delivery: <= 3 days. True-PDF full-copy in English will be manually translated and delivered via email. YS/T 1105-2024: (Silver bonding wire for semiconductor packaging) Status: Valid YS/T 1105: Evolution and historical versions
Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
YS/T 1105-2024 | English | 229 |
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3 days [Need to translate]
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(Silver bonding wire for semiconductor packaging)
| Valid |
YS/T 1105-2024
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YS/T 1105-2016 | English | 559 |
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3 days [Need to translate]
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Silver bonding wire for semiconductor package
| Obsolete |
YS/T 1105-2016
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Basic data Standard ID | YS/T 1105-2024 (YS/T1105-2024) | Description (Translated English) | (Silver bonding wire for semiconductor packaging) | Sector / Industry | Nonferrous Metallurgy Industry Standard (Recommended) | Classification of Chinese Standard | H68 | Classification of International Standard | 77.150.99 | Word Count Estimation | 10,115 | Date of Issue | 2024-10-24 | Date of Implementation | 2025-05-01 | Older Standard (superseded by this standard) | YS/T 1105-2016 | Issuing agency(ies) | Ministry of Industry and Information Technology | Summary | This standard specifies the classification and marking, technical requirements, test methods, inspection rules, marking, packaging, transportation, storage, accompanying documents and order forms of bonding silver wire for semiconductor packaging. This standard applies to bonding silver wire for semiconductor packaging. |
YS/T 1105-2016: Silver bonding wire for semiconductor package---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Silver bonding wire for semiconductor package
ICS 77.150.99
H68
People's Republic of China Nonferrous Metals Industry Standard
Bonded silver wire for semiconductor packaging
2016-04-05 release
2016-09-01 implementation
Issued by the Ministry of Industry and Information Technology of the People's Republic of China
Foreword
This standard is drafted in accordance with the rules given in GB/T 1.1-2009.
This standard is proposed by the National Committee for Standardization of Nonferrous Metals (SAC/TC243).
The drafting unit of this standard. Yantai a Connaught Electronic Materials Co., Ltd., Beijing Dobo non-ferrous metal solder limited liability company, non-ferrous metal technology
Economic Research Institute, Shandong Branch of the new electronic Technology Co., Ltd.
The main drafters of this standard. Lin Liang, Xiang Cuihua, Xiang Lei, Miao Haichuan, Zang Xiaodan, Miao Hongyuan, Yan Ru, Li Tianxiang, Zhou Xiaoguang, Liu Jie.
Bonded silver wire for semiconductor packaging
1 Scope
This standard specifies the semiconductor discrete devices, integrated circuits, LED package with silver wire (hereinafter referred to as silver) requirements, test methods,
Inspection rules, signs, packaging, shipping and storage quality certificates, orders (or contracts) and so on.
This standard is applicable to bonded silver for semiconductor packaging.
2 normative reference documents
The following documents are indispensable for the application of this document. For dated references, only the dated edition applies to this article
Pieces. For undated references, the latest edition (including all modifications) applies to this document.
Test method for density of precious metals and their alloys GB/T 1423
GB/T 8750-2014 Bonded gold wire for semiconductor encapsulation
Test method for tensile test of non - ferrous metal filaments GB/T
GB/T 11067 (all parts) Silver chemical analysis method
GB/T 15072 (all parts) Chemical analysis of precious metal alloys
GB/T 15077 Geometrical measurement methods for precious metals and their alloys
3 request
3.1 Product Classification
3.1.1 Types, models, grades, status and specifications
Silver by chemical composition is divided into ordinary silver, alloy silver two categories. Ordinary silver wire is Ag content of 99% and above the silver wire CS, alloy
Silver wire can be divided into AS1, AS2, AS3 and AS4 according to the alloying elements and their contents. The type of silver, model, state
And diameter shall comply with the provisions of Table 1.
Table 1 Category, model, grade and diameter
Type Type Grade Status Diameter/mm
Ordinary silver
Alloy silver wire
CS Ag99
AS1 Ag88AuPd
AS2 Ag92AuPd
AS3 Ag95PdAu
AS4 Ag97PdAu
Semi-hard
0.020, 0.020, 0.023, 0.025, 0.028, 0.030,
0.032, 0.033, 0.035, 0.038, 0.040, 0.045, 0.050
Note. According to the requirements of the demand side can increase the diameter of the other silver.
3.1.2 Example of marking
The marks are marked in the order of product name, standard number, grade, status and size. Examples of tags are as follows.
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