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www.ChineseStandard.net Database: 189760 (18 Oct 2025)

YS/T 1105-2024 English PDF

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YS/T 1105-2024: (Silver bonding wire for semiconductor packaging)
Status: Valid

YS/T 1105: Evolution and historical versions

Standard IDContents [version]USDSTEP2[PDF] delivered inStandard Title (Description)StatusPDF
YS/T 1105-2024English229 Add to Cart 3 days [Need to translate] (Silver bonding wire for semiconductor packaging) Valid YS/T 1105-2024
YS/T 1105-2016English559 Add to Cart 3 days [Need to translate] Silver bonding wire for semiconductor package Obsolete YS/T 1105-2016

Basic data

Standard ID YS/T 1105-2024 (YS/T1105-2024)
Description (Translated English) (Silver bonding wire for semiconductor packaging)
Sector / Industry Nonferrous Metallurgy Industry Standard (Recommended)
Classification of Chinese Standard H68
Classification of International Standard 77.150.99
Word Count Estimation 10,115
Date of Issue 2024-10-24
Date of Implementation 2025-05-01
Older Standard (superseded by this standard) YS/T 1105-2016
Issuing agency(ies) Ministry of Industry and Information Technology
Summary This standard specifies the classification and marking, technical requirements, test methods, inspection rules, marking, packaging, transportation, storage, accompanying documents and order forms of bonding silver wire for semiconductor packaging. This standard applies to bonding silver wire for semiconductor packaging.

YS/T 1105-2016: Silver bonding wire for semiconductor package

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Silver bonding wire for semiconductor package ICS 77.150.99 H68 People's Republic of China Nonferrous Metals Industry Standard Bonded silver wire for semiconductor packaging 2016-04-05 release 2016-09-01 implementation Issued by the Ministry of Industry and Information Technology of the People's Republic of China

Foreword

This standard is drafted in accordance with the rules given in GB/T 1.1-2009. This standard is proposed by the National Committee for Standardization of Nonferrous Metals (SAC/TC243). The drafting unit of this standard. Yantai a Connaught Electronic Materials Co., Ltd., Beijing Dobo non-ferrous metal solder limited liability company, non-ferrous metal technology Economic Research Institute, Shandong Branch of the new electronic Technology Co., Ltd. The main drafters of this standard. Lin Liang, Xiang Cuihua, Xiang Lei, Miao Haichuan, Zang Xiaodan, Miao Hongyuan, Yan Ru, Li Tianxiang, Zhou Xiaoguang, Liu Jie. Bonded silver wire for semiconductor packaging

1 Scope

This standard specifies the semiconductor discrete devices, integrated circuits, LED package with silver wire (hereinafter referred to as silver) requirements, test methods, Inspection rules, signs, packaging, shipping and storage quality certificates, orders (or contracts) and so on. This standard is applicable to bonded silver for semiconductor packaging.

2 normative reference documents

The following documents are indispensable for the application of this document. For dated references, only the dated edition applies to this article Pieces. For undated references, the latest edition (including all modifications) applies to this document. Test method for density of precious metals and their alloys GB/T 1423 GB/T 8750-2014 Bonded gold wire for semiconductor encapsulation Test method for tensile test of non - ferrous metal filaments GB/T GB/T 11067 (all parts) Silver chemical analysis method GB/T 15072 (all parts) Chemical analysis of precious metal alloys GB/T 15077 Geometrical measurement methods for precious metals and their alloys

3 request

3.1 Product Classification 3.1.1 Types, models, grades, status and specifications Silver by chemical composition is divided into ordinary silver, alloy silver two categories. Ordinary silver wire is Ag content of 99% and above the silver wire CS, alloy Silver wire can be divided into AS1, AS2, AS3 and AS4 according to the alloying elements and their contents. The type of silver, model, state And diameter shall comply with the provisions of Table 1. Table 1 Category, model, grade and diameter Type Type Grade Status Diameter/mm Ordinary silver Alloy silver wire CS Ag99 AS1 Ag88AuPd AS2 Ag92AuPd AS3 Ag95PdAu AS4 Ag97PdAu Semi-hard 0.020, 0.020, 0.023, 0.025, 0.028, 0.030, 0.032, 0.033, 0.035, 0.038, 0.040, 0.045, 0.050 Note. According to the requirements of the demand side can increase the diameter of the other silver. 3.1.2 Example of marking The marks are marked in the order of product name, standard number, grade, status and size. Examples of tags are as follows.

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Question 5: Should I purchase the latest version YS/T 1105-2024?

Answer: Yes. Unless special scenarios such as technical constraints or academic study, you should always prioritize to purchase the latest version YS/T 1105-2024 even if the enforcement date is in future. Complying with the latest version means that, by default, it also complies with all the earlier versions, technically.