| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | See Detail | Status | Related Standard |
| YS/T 1105-2024 | English | 229 |
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Days<=3
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(Silver bonding wire for semiconductor packaging)
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YS/T 1105-2024
| Valid |
YS/T 1105-2024
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