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JJF 1179-2007

JJF 1179-2007_English: PDF (JJF1179-2007)
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JJF 1179-2007English359 Add to Cart 3 days Calibration Specification of High Temperature Dynamic IC Burn-in System JJF 1179-2007 Valid JJF 1179-2007

BASIC DATA
Standard ID JJF 1179-2007 (JJF1179-2007)
Description (Translated English) Calibration Specification of High Temperature Dynamic IC Burn-in System
Sector / Industry Metrology & Measurement Industry Standard
Classification of Chinese Standard A56
Classification of International Standard 17.220
Word Count Estimation 15,141
Date of Issue 2007/6/14
Date of Implementation 2007-09-14
Quoted Standard GB/T 5170.1-1995; GB/T 5170.2-1996
Drafting Organization Information Industry, Ministry of Electronics Industry Standardization Institute
Administrative Organization National radio measurement technology committee
Regulation (derived from) AQSIQ Announcement No. 95 of 2007
Issuing agency(ies) State Administration of Quality Supervision, Inspection and Quarantine
Summary This standard applies to IC high dynamic aging system calibration.

JJF 1179-2007
Calibration Specification of High Temperature Dynamic IC Burn-in System
People's Republic of China National Metrology Technical Specifications
IC temperature dynamic aging system calibration specifications
Posted 2007-06-14
2007-09-14 implementation
The State Administration of Quality Supervision, Inspection and Quarantine released
IC temperature dynamic aging system
Calibration Specification
stem
This specification by the State Administration of Quality Supervision, Inspection and Quarantine, 2007 June 14 ratification and
From September 14, 2007 implementation.
Focal point. the National Radio Technical Commission metering
Drafted by. Ministry of Information Industry Institute of Electronics Industry Standardization
The specification of the National Radio Technical Commission responsible for the interpretation of measurement
The main drafters of this specification.
Wang intoxicated (Information Industry, Ministry of Electronics Industry Standardization Institute)
Wu Jingyan (Information Industry, Ministry of Electronics Industry Standardization Institute)
Chen greatly (Information Industry, Ministry of Electronics Industry Standardization Institute)
Drafters participate.
Guoshou Jun (Guilin University of Electronic Science and Technology)
table of Contents
1 Scope (1)
2. Referenced Documents (1)
3 Overview (1)
4 Metrological characteristics (1)
4.1 Temperature Performance (1)
4.2 digital drive signal parameters (2)
4.3 analog drive signal parameters (2)
4.4 aging board device power parameters (2)
Calibration Condition 5 (2)
5.1 environmental conditions (2)
5.2 calibration standards of measurement, instrumentation (2)
6 Calibration methods and calibration items (2)
6.1 device is working properly check (2)
6.2 high temperature calibration chamber (3)
6.3 digital drive signal characteristic parameter calibration unit (4)
6.4 analog drive signal characteristic parameter calibration unit (5)
6.5 Aging Area device supply voltage setting unit calibration (6)
7 statements calibration results (7)
8 Recalibration interval (7)
Appendix A dynamic burn-in system IC temperature calibration certificate format (8)
IC temperature dynamic aging system calibration specifications
1 Scope
This standard applies to integrated calibration temperature dynamic aging system.
2 Citations
GB/T 5170.1-1995 Environmental testing for electric and electronic test equipment basic parameters - General
GB/T 5170.2-1996 Inspection methods for basic parameters of temperature Electrical test equipment and electronic products environmental testing equipment
Note. When using this code, you should pay attention to using the currently valid version of the documents cited.
3 Overview
IC temperature dynamic aging system for integrated circuit dynamic high temperature aging test, mainly by the control
Part of the machine, high temperature chamber, the device power supply unit, a signal drive unit, etc., the system architecture is shown in Figure 1
Shown.
Figure 1 integrated circuit temperature dynamic aging system structure diagram
Aging system temperature chamber for providing integrated high temperature dynamic aging high temperature environment. That is the power supply unit
Aging power, using two power mode, wherein an aging power supply enough power for providing a positive and negative voltage,
Two aging power supply to a power source as the input reference integrated circuit device aging providing electrical specifications for the aging device
source. Burn-in system is usually divided into three to four workspaces by four independent programmable devices provide electrical power for the entire system
Source and signal power. Signal drive unit is integrated dynamic aging core subsystems, its main function is through the main
Computer programming control, resulting in a variety of chips required for aging to be analog, digital, and tri-state drive signal waveforms to meet
Aging requirements of integrated circuit devices.
4 Metrological characteristics
4.1 Temperature Performance
4.1.1 temperature parameters