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GB/T 8750-2022: Gold-based bonding wire and bandlet for semiconductor package
Status: Valid GB/T 8750: Evolution and historical versions
| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 8750-2022 | English | 659 |
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5 days [Need to translate]
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Gold-based bonding wire and bandlet for semiconductor package
| Valid |
GB/T 8750-2022
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| GB/T 8750-2014 | English | 959 |
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5 days [Need to translate]
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Gold bonding wire for semiconductor package
| Obsolete |
GB/T 8750-2014
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| GB/T 8750-2007 | English | 639 |
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5 days [Need to translate]
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Gold bonding wire for semiconductor devices
| Obsolete |
GB/T 8750-2007
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| GB/T 8750-1997 | English | 599 |
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4 days [Need to translate]
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Gold wire for semiconductor devices lead bonding
| Obsolete |
GB/T 8750-1997
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| GB/T 8750-1988 | English | RFQ |
ASK
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3 days [Need to translate]
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Cold wire for semiconductor lead bonding
| Obsolete |
GB/T 8750-1988
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PDF similar to GB/T 8750-2022
Basic data | Standard ID | GB/T 8750-2022 (GB/T8750-2022) | | Description (Translated English) | Gold-based bonding wire and bandlet for semiconductor package | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | H68 | | Classification of International Standard | 77.150.99 | | Word Count Estimation | 32,311 | | Date of Issue | 2022-12-30 | | Date of Implementation | 2023-07-01 | | Older Standard (superseded by this standard) | GB/T 8750-2014 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 8750-2022: Gold-based bonding wire and bandlet for semiconductor package---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 77.150.99
CCSH68
National Standards of People's Republic of China
Replacing GB/T 8750-2014
Gold-based bonding wire and ribbon for semiconductor packaging
Posted on 2022-12-30
2023-07-01 implementation
State Administration for Market Regulation
Released by the National Standardization Management Committee
table of contents
Preface III
1 Scope 1
2 Normative references 1
3 Terms and Definitions 1
4 Classification and labeling 1
4.1 Product Category 1
4.2 Product Marking 2
5 Technical requirements 3
5.1 Chemical composition 3
5.2 Dimensions and their tolerances 4
5.3 Mechanical properties 6
5.4 Surface quality 9
5.5 Process performance 10
5.6 Winding requirements 10
5.7 Pay-off performance 10
6 Test method 10
7 Inspection rules 10
7.1 Inspection and acceptance 10
7.2 Batch 11
7.3 Inspection items 11
7.4 Sampling 11
7.5 Judgment of test results 11
8 Marking, packaging, transportation and storage and accompanying documents 12
8.1 Flag 12
8.2 Packaging 12
8.3 Transport 12
8.4 Storage 12
8.5 Accompanying documents (or quality certificate) 13
9 Order form (or contract) content 13
Appendix A (informative) Gold-based bonding wire arc height test method 14
Appendix B (Informative) Product Surface Defects 15
Appendix C (Normative) Product Spool Regulations 17
Appendix D (Normative) Gold alloy wire diameter inspection method 19
Appendix E (Normative) Gold Strip Width Inspection Method 20
Appendix F (Normative) Product Length Inspection Method 21
Appendix G (Normative) Product Surface Quality Inspection Method 22
Appendix H (Normative) Inspection Method for Product Curl and Axial Distortion 23
Appendix I (Normative) Product release performance inspection method 27
foreword
This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1.Structure and Drafting Rules for Standardization Documents"
drafting.
This document replaces GB/T 8750-2014 "Bonding Gold Wire for Semiconductor Packaging". Compared with GB/T 8750-2014, except for structural adjustment
In addition to editorial changes, the main technical changes are as follows.
a) Deleted "LED package" in "Scope", changed the applicable object of the standard, from "bonding gold wire for semiconductor package" to "semiconductor package
Gold-based bonding wires and ribbons for bulk discrete devices and integrated circuit packaging" (see Chapter 1, Chapter 1 of the.2014 edition);
b) The classification and marking, technical requirements, test methods, inspection rules, marking, packaging, transportation and storage of gold alloy wire and gold strip have been added
and accompanying documents and purchase orders (or contracts) (see Chapter 4, Chapter 5, Chapter 6, Chapter 7, Chapter 8 and Chapter 9);
c) The classification of doped gold wire and alloy gold wire has been deleted (see 3.1 of the.2014 edition),
d) Change the type of gold wire and the arc height regulations in some applications (see Section 4.1, 3.1 of the.2014 edition);
e) Changed the expression form of the gold wire product mark (see 4.2, 3.2 of the.2014 edition);
f) Changed the chemical composition of the gold wire (see 5.1.1, 3.3 of the.2014 edition);
g) The diameter of the gold wire and its allowable deviation have been changed (see 5.2.1.1, 3.4 of the.2014 edition);
h) Increase the length of the gold wire and its allowable deviation (see 5.2.3);
i) Changed the wire winding requirements for gold wire, changing "wire winding requirements" to "winding requirements" (see 5.6, 6.6, 3.8, 4.6 of the.2014 edition);
j) Changed the feeding performance of gold wire (see 5.7, 6.7, 3.9, 4.7 of the.2014 edition);
k) Changed the arbitration analysis method for the chemical composition of gold wire (see 6.1, 4.1 of the.2014 edition);
l) Add the measurement method of gold wire length and its deviation (see 6.2);
m) The gold wire crimp inspection arbitration method has been added (see 6.5);
n) Changed the determination of gold wire inspection results (see 7.5.2, 7.5.3, 5.5.2, 5.5.3 of the.2014 edition), and deleted "but approved by both the supplier and the buyer
agreed" (see 5.5.4 of the.2014 edition);
o) The gold wire surface quality inspection method has been changed (see Appendix G.2.4, Appendix B.1.2.4 of the.2014 edition).
Please note that some contents of this document may refer to patents. The issuing agency of this document assumes no responsibility for identifying patents.
This document is proposed by China Nonferrous Metals Industry Association.
This document is under the jurisdiction of the National Nonferrous Metals Standardization Technical Committee (SAC/TC243).
This document is drafted by. Beijing Dabo Nonferrous Metal Solder Co., Ltd., Beijing Nonferrous Metals and Rare Earth Application Research Institute Co., Ltd.
Company, Zhejiang Jiabo Technology Co., Ltd., Guiyan Platinum Industry Co., Ltd., Shanghang County Zijin Jiabo Electronic New Material Technology Co., Ltd.
The main drafters of this document. Yan Ru, Tian Liu, Zhang Jingye, Xue Ziye, Zhou Wenyan, Liu Jie, Huang Xiaomeng, Zhao Yidong, ConocoPhillips, Zhang Hu,
Yuan Linlin, Pei Hongying, Xiang Cuihua, Chen Xueping, Xie Haitao, Zhou Gang.
This document was first released in 1988, revised for the first time in.1997, revised for the second time in.2007, and revised for the third time in.2014.
Fourth revision.
Gold-based bonding wire and ribbon for semiconductor packaging
1 Scope
This document specifies the classification and marking, technical requirements, test methods, inspection rules, marks, package
Packing, transportation, storage and accompanying documents and purchase order (or contract) content.
This document is applicable to gold-based bonding wires and ribbons for semiconductor discrete devices and integrated circuit packaging.
2 Normative references
The contents of the following documents constitute the essential provisions of this document through normative references in the text. Among them, dated references
For documents, only the version corresponding to the date is applicable to this document; for undated reference documents, the latest version (including all amendments) is applicable to
this document.
GB/T 9288 Determination of gold content in gold alloy jewelry Ash blowing method (fire test gold method)
GB/T 10573 Tensile test method for non-ferrous metal filaments
GB/T 11066.5 Methods for chemical analysis of gold - Determination of silver, copper, iron, lead, antimony and bismuth - Atomic emission spectrometry
GB/T 15077 Geometric Dimensions Measurement Methods of Precious Metals and Their Alloys
YS/T 938.4 Chemical analysis methods of gold-based and palladium-based alloys for dental porcelain restorations - Part 4.Gold, platinum, palladium, copper, tin, indium,
Determination of zinc, gallium, beryllium, iron, manganese, lithium content Inductively coupled plasma atomic emission spectrometry
3 Terms and Definitions
The following terms and definitions apply to this document.
3.1
gold-based bonding wire gold-based bonding wire
It is drawn (or hole-rolled) and annealed by gold-based cast rods, the cross-sectional shape is circular, the diameter is less than 0.1mm, and it is used in semiconductor packaging circuits
Threads for connecting wires.
Note. Gold wire with a mass fraction of not less than 99% is called gold wire or pure gold wire, and gold wire with a mass fraction of less than 99% is called gold alloy wire.
3.2
Gold-based bonding tape gold-basedbondingbandlet
Rolled from gold-based bonding wire, the cross-sectional shape is rectangular, the thickness is less than 0.1mm, and the width is less than 2mm.
Note. The gold mass fraction is not less than 99% is called gold belt, and the gold mass fraction is less than 99% is called gold alloy strip.
3.3
Elongation fluctuation range rangeofelongation
The allowable deviation of gold-based bonded products when actually measuring the elongation is the extreme difference of at least three elongation measured values.
4 Classification and labeling
4.1 Product classification
The type, model, state, use and specification of the product shall comply with the provisions in Table 1.
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