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GB/T 8446.3-2022 English PDF

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GB/T 8446.3-2022: Heat sinks for power semiconductor devices - Part 3: Insulators and fasteners
Status: Valid

GB/T 8446.3: Evolution and historical versions

Standard IDContents [version]USDSTEP2[PDF] delivered inStandard Title (Description)StatusPDF
GB/T 8446.3-2022English459 Add to Cart 4 days [Need to translate] Heat sinks for power semiconductor devices - Part 3: Insulators and fasteners Valid GB/T 8446.3-2022
GB/T 8446.3-2004English879 Add to Cart 5 days [Need to translate] Heat sink for power semiconductor device -- Part 3: Insulators and fasteners Obsolete GB/T 8446.3-2004
GB/T 8446.3-1988English799 Add to Cart 5 days [Need to translate] Insulators and fasteners for heat sink for power semiconductor device Obsolete GB/T 8446.3-1988

PDF similar to GB/T 8446.3-2022


Standard similar to GB/T 8446.3-2022

GB/T 37404   GB/T 31487.3   GB/T 3859.1   GB/T 8446.2   GB/T 8446.1   GB/T 4023   

Basic data

Standard ID GB/T 8446.3-2022 (GB/T8446.3-2022)
Description (Translated English) Heat sinks for power semiconductor devices - Part 3: Insulators and fasteners
Sector / Industry National Standard (Recommended)
Classification of Chinese Standard K46
Word Count Estimation 23,262
Issuing agency(ies) State Administration for Market Regulation, China National Standardization Administration

GB/T 8446.3-2022: Heat sinks for power semiconductor devices - Part 3: Insulators and fasteners

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Heat sinks for power semiconductor devices - Part 3.Insulators and fasteners ICS 29.080.99; 21.060.99 CCSK46 National Standards of People's Republic of China Replacing GB/T 8446.3-2004 Heat sinks for power semiconductor devices Part 3.Insulation and Fasteners Published on 2022-03-09 2022-10-01 Implementation State Administration for Market Regulation Released by the National Standardization Administration directory Preface I Introduction II 1 Scope 1 2 Normative references 1 3 Terms and Definitions 1 4 Insulation 1 4.1 Models and series 1 4.2 Size 2 4.3 Other technical requirements5 5 Fasteners 6 5.1 Models and series 6 5.2 Size 7 5.3 Other technical requirements 15 6 Inspection rules 16 6.1 Lot-by-lot inspection 16 6.2 Periodic inspection 16 7 Packaging, transport and storage 18 7.1 Package, transport and storage requirements18 7.2 Requirements for individual packaging, transport and storage 18 Appendix A (normative) Sampling Table 19

foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1.Structure and Drafting Rules of Standardization Documents" drafted. GB/T 8446 "Heat sinks for power semiconductor devices" and the following standards together constitute the series of heat sinks for power semiconductor devices in my country standard. ---JB/T 5781 Specifications for Profile Heatsinks for Power Semiconductor Devices; ---JB/T 8175 Profile dimensions of heat sinks for power semiconductor devices; ---JB/T 8757 Heat pipe radiator for power semiconductor devices; ---JB/T 9684 Guidelines for selection of heat sinks for power semiconductor devices. This document is part 3 of GB/T 8446 "Heat sinks for power semiconductor devices". GB/T 8446 has released the following parts. --- Part 1.Heat sink; --- Part 2.Measurement methods of thermal resistance and flow resistance; --- Part 3.Insulation and fasteners. This document replaces GB/T 8446.3-2004 "Radiators for Power Semiconductor Devices - Part 3.Insulators and Fasteners". and Compared with GB/T 8446.3-2004, in addition to structural adjustment and editorial changes, the main technical changes are as follows. a) Changed the "normative references" (see Chapter 2, Chapter 2 of the.2004 edition); b) the chapter "Terms and Definitions" was added (see Chapter 3); c) Changed the dielectric withstand voltage and high temperature performance requirements of insulating parts (see 4.3.2 and 4.3.4, 3.3.2 and 3.3.4 of the.2004 edition), added flame retardant properties and comparative tracking index (CTI) requirements for insulating parts (see 4.3.5 and 4.3.6); d) Changed the appearance requirements of fasteners (see 5.3.1, 4.3.1 of the.2004 edition); e) Changed the inspection rules (see Chapter 6, Chapter 5 of the.2004 edition); f) Changed Appendix A (see Appendix A, Appendix A of the.2004 edition). Please note that some content of this document may be patented. The issuing agency of this document assumes no responsibility for identifying patents. This document is proposed by China Electrical Equipment Industry Association. This document is under the jurisdiction of the National Standardization Technical Committee for Power Electronic Systems and Equipment (SAC/TC60). This document is drafted by. Hebei Huazheng Industrial Co., Ltd., Jiangsu Xincaiyang Electromechanical Technology Co., Ltd., Xi'an Perry Power Semiconductor Transformer Flow Technology Co., Ltd., Xiangbo Heat Transfer Technology Co., Ltd., Guangzhou Gaolan Energy Saving Technology Co., Ltd., Global Energy Internet Research Institute Co., Ltd., CRRC Zhuzhou Electric Locomotive Research Institute Co., Ltd., Hubei Taiji Semiconductor Co., Ltd., Xi'an Power Electronics Technology Co., Ltd. Technology Research Institute, Jiangsu Hongwei Technology Co., Ltd. The main drafters of this document. Song Xiaofei, Sang Chun, Zeng Maojin, Wei Hongqi, Cui Pengfei, Zhou Jianhui, Tian En, Wang Xiaobao, Yan Jiasheng, Wen Yuliang, Li Xiaoguo, Guo Shaoqiang, Yu Wangchun, Lu Zhengbai, Ji Weifeng. The previous versions of this document and its superseded documents are as follows. --- First published in 1987 as GB/T 8446.3, first revised in.2004; ---This is the second revision.

Introduction

GB/T 8446 "Heat sinks for power semiconductor devices" gives the heat sinks, insulating parts and fasteners that constitute heat sinks for power semiconductor devices. Technical requirements for firmware, inspection rules, requirements for marking, packaging, transportation and storage, and measurement methods for thermal resistance and flow resistance of heat sinks are planned to consist of 3 part composition. --- Part 1.Heat sink. The purpose is to specify the terms, definitions, and techniques of heat sinks constituting heat sinks for power semiconductor devices. requirements, inspection rules and requirements for marking, packaging, transport and storage. --- Part 2.Thermal and flow resistance measurement methods. The purpose is to standardize heat sinks (including heat sinks) that constitute heat sinks for power semiconductor devices Methods for the measurement of thermal and flow resistance of cast, extruded, profiled and heat pipe radiators). --- Part 3.Insulation and fasteners. The purpose is to specify insulating members and fasteners constituting heat sinks for power semiconductor devices technical requirements, inspection rules and requirements for marking, packaging, transportation and storage. Heat sinks for power semiconductor devices Part 3.Insulation and Fasteners

1 Scope

This document specifies the model and series, dimensions, other technical requirements, inspection inspection rules and packaging and shipping requirements. This document applies to insulating parts and fasteners of cast (including extruded) heat sinks for power semiconductor devices, and also applies to mounting dimensions Insulators and fasteners for profile radiators and heat pipe radiators that are the same as cast (including extruded) radiators.

2 Normative references

The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, dated citations documents, only the version corresponding to that date applies to this document; for undated references, the latest edition (including all amendments) applies to this document. GB/T 1031 Product Geometric Specifications (GPS) Surface Structure Profile Method Surface Roughness Parameters and Their Values GB/T 2423.2-2008 Environmental testing of electrical and electronic products - Part 2.Test method Test B. High temperature GB/T 2423.17-2008 Environmental Testing of Electrical and Electronic Products Part 2.Test Method Test Ka. Salt Spray GB/T 2423.22-2012 Environmental Test Part 2.Test Method Test N. Temperature Change GB/T 4207-2012 Determination method of tracking resistance index and comparative tracking index of solid insulating materials GB/T 5169.11-2017 Fire hazard test for electrical and electronic products - Part 11.Basic test method for glow wire/hot wire Glow Wire Flammability Test Method for Products (GWEPT) GB/T 8446.1 Heat sinks for power semiconductor devices - Part 1.Heat sinks

3 Terms and Definitions

Terms and definitions defined in GB/T 8446.1 apply to this document.

4 insulation

4.1 Models and series 4.1.1 Model The model of the insulating part consists of the following three parts. ××(□) Indicates the serial number of the insulating part [two digits or two digits and one letter (see Table 1)] Indicates the serial code of the insulating part [one letter (see Table 1)] Indicates the applicable radiator (one letter. F--- air cooling radiator; S--- water cooling radiator)

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