US$1439.00 · In stock Delivery: <= 8 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 7289-2017: Electric components -- Reliability -- Reference conditions for failure rates and stress models for conversion Status: Valid GB/T 7289: Evolution and historical versions
Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
GB/T 7289-2017 | English | 1439 |
Add to Cart
|
8 days [Need to translate]
|
Electric components -- Reliability -- Reference conditions for failure rates and stress models for conversion
| Valid |
GB/T 7289-2017
|
GB/T 7289-1987 | English | 319 |
Add to Cart
|
3 days [Need to translate]
|
Presentation of reliability, maintainability and availability predictions
| Obsolete |
GB/T 7289-1987
|
PDF similar to GB/T 7289-2017
Basic data Standard ID | GB/T 7289-2017 (GB/T7289-2017) | Description (Translated English) | Electric components -- Reliability -- Reference conditions for failure rates and stress models for conversion | Sector / Industry | National Standard (Recommended) | Classification of Chinese Standard | L05 | Classification of International Standard | 31.020 | Word Count Estimation | 72,761 | Date of Issue | 2017-11-01 | Date of Implementation | 2018-05-01 | Older Standard (superseded by this standard) | GB/T 7289-1987 | Quoted Standard | IEC 60050-191; IEC 60605-6; IEC 60721-3-3; IEC 60721-3-4; IEC 60721-3-5; IEC 60721-3-7 | Adopted Standard | IEC 61709-2011, IDT | Regulation (derived from) | National Standard Announcement 2017 No. 29 | Issuing agency(ies) | General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China | Summary | This standard specifies how to use the failure rate data for the reliability of electronic components in electronic equipment is expected. The reference condition is a typical value of component stress observed in a large number of applications. The base condition is useful because it calculates the failure rate under any conditions by using a stress model that considers real working conditions. In the early design phase, the failure rate at the baseline was allowed for the actual reliability estimate. The stress model described in this standard is a general-purpose model that can be used as a basis for converting failure rate data to a basis for failure rates under realistic operating conditions when needed, which simplifies the method of prediction and conversion of failure rate data is only permitted Function within the limits of use. This standard also on how to build component failure rate database to provide for the standard stress model |
GB/T 7289-2017: Electric components -- Reliability -- Reference conditions for failure rates and stress models for conversion ---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Electric components.Reliability.Reference conditions for failure rates and stress models for conversion
ICS 31.020
L05
National Standards of People's Republic of China
Replacing GB/T 7289-1987
Electrical components reliability failure rate of the benchmark
Stress model of conversion of condition and failure rate
(IEC 61709.2011, IDT)
Posted.2017-11-01
2018-05-01 implementation
General Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China
China National Standardization Administration released
Directory
Foreword Ⅲ
1 Scope 1
2 Normative references 1
3 Terms, definitions and symbols 2
3.1 Terms and definitions 2
3.2 Symbol 3
4 content and conditions 5
4.1 Failure mode 5
4.2 Working Profile Considerations 5
4.3 storage conditions 5
4.4 Environmental conditions 6
5 General reference conditions and stress models 7
5.1 Recommended Common Criteria 7
5.2 General Stress Model 8
5.2.1 Overview 8
5.2.2 Voltage stress coefficient πU 8
5.2.3 current stress factor πI 9
5.2.4 temperature stress coefficient πT 9
5.2.5 Environmental Application Factor πE 10
5.2.6 Other factors of influence 10
Detailed reference conditions and stress models
6.1 Semiconductor integrated circuit 11
6.1.1 Baseline conditions 11
6.1.2 Stress Factor 13
6.2 Semiconductor Discrete Devices 16
6.2.1 Baseline conditions 16
6.2.2 Stress Factor 17
6.3 Optoelectronic Devices
6.3.1 Baseline conditions
6.3.2 Stress Coefficient
6.4 Capacitors 24
6.4.1 Baseline conditions 24
6.4.2 Stress Coefficient 25
6.5 Resistor and resistor network 27
6.5.1 Baseline conditions 27
6.5.2 Stress factor 28
6.6 Inductors, Transformers and Coils 29
6.6.1 Baseline conditions 29
6.6.2 Stress Coefficient 29
6.7 Microwave Components 30
6.7.1 Baseline conditions
6.7.2 Stress factor 30
6.8 other passive components 30
6.8.1 Baseline conditions
6.8.2 Stress Coefficient
6.9 Electrical Connections 31
6.9.1 Baseline conditions 31
6.9.2 Stress Coefficient
6.10 Connectors and Receptacles 32
6.10.1 Baseline conditions 32
6.10.2 Stress Coefficient
6.11 Relay 32
6.11.1 Baseline conditions 32
6.11.2 Stress Coefficient
6.12 switch and button 35
6.12.1 Baseline conditions 35
6.12.2 Stress Coefficient 35
6.13 Signals and Indicators 36
6.13.1 Baseline conditions 36
6.13.2 Stress Coefficient 36
Appendix A (Normative) Component Failure Mode 38
Appendix B (Informative) Estimated Failure Rate 40
Appendix C (informative) Failure rate database design considerations 48
Appendix D (Informative) Potential Sources of Failure Rate Data and Selection of Methods 50
Appendix E (Informative) Component Classification Overview 55
Appendix F (informative) Example 66
References 68
Foreword
This standard was drafted in accordance with the rules given in GB/T 1.1-2009.
This standard replaces GB/T 7289-1987 "reliability, maintainability and validity of the preparation of the report preparation guide." This standard and
GB/T 7289-1987 compared to the main changes there.
--- Standard name changed to "failure rate of electrical components reliability of the benchmark conditions and failure rate conversion stress model";
--- Provided based on the benchmark failure rate data on the device in the electronic components for the reliability of specific methods.
This standard uses the translation method identical with IEC 61709.2011 "Failure rate of electrical components reliability benchmark conditions and failure rate
Transformed stress model ".
The documents of our country that are consistent with the corresponding international documents that are normative references in this standard are as follows.
International Electrotechnical Terminology Part 191. Credibility and Quality of Service (IEC 60050-191).
1990);
Reliability testing of equipment - Tests for validity of a constant failure rate assumption (IEC 60605-6..1996).
1989);
--- GB/T 4798.3-2007 Environmental conditions for the application of electrical and electronic products Part 3. There is a fixed use of climate protection sites
(IEC 60721-3-3.2002);
--- GB/T 4798.4-2007 Environmental conditions for the application of electrical and electronic products Part 4. Stationary use of non-climate protection
(IEC 60721-3-4.1995);
--- GB/T 4798.5-2007 Environmental conditions for the application of electric and electronic products - Part 5. Ground vehicles (IEC 60721-3-
5.1997);
--- GB/T 4798.7-2007 Environmental conditions for the application of electrical and electronic products Part 7. Portable and non-fixed use
(IEC 60721-3-7.2002).
This standard made the following editorial changes.
--- Modify the original text of the error, the 6.11.2.1 in the "stress factor values see 6.11.2.3 and 6.11.2.4." For "each stress factor value
See 6.11.2.2, 6.11.2.3 and 6.11.2.4. ".
Please note that some of this document may be patentable. The issuing agencies of this document do not bear the responsibility of identifying these patents.
This standard proposed by the Ministry of Industry and Information Technology of the People's Republic of China.
This standard by the National Electrical and Electronic Product Reliability and Maintenance of Standardization Technical Committee (SAC/TC24) centralized.
This standard was drafted Unit. Institute of Electronics and the Fifth Ministry of Industry and Information Technology.
The main drafters of this standard. Mo Yuwei, Zhou Junlian, Nie Guojian, Zhai Fang, Ren Yan.
This standard replaces the standards previously issued as.
--- GB/T 7289-1987.
Electrical components reliability failure rate of the benchmark
Stress model of conversion of condition and failure rate
1 Scope
This standard specifies how to use the failure rate data for the reliability of electronic components in electronic equipment is expected.
The reference condition is a typical value of component stress observed in a large number of applications. The base condition is useful because it passes
The stress model considering real working conditions is used to calculate the failure rate under any conditions. In the early design stage, failure under the baseline conditions
The rate allowed for the actual reliability is estimated.
The stress model described in this standard is a general-purpose model that can be used to convert failure rate data to true working conditions when needed
Under the failure rate of the basis, which simplifies the estimation method, the conversion of failure rate data only allows the use of functional components within the specified limits
get on.
This standard also provides guidance on how to construct a component failure rate database to provide a failure rate that can be used in this standard stress model.
The baseline condition for specifying failure rate data is to allow data from different sources to be compared on the same basis. If the failure rate data according to
According to this standard is given, you do not need to attach specific conditions of the information.
This standard does not provide the basic failure rate of components, but to provide models to obtain failure rates obtained by other means by a working condition
Conversion to another working condition of the failure rate.
The methods described in this standard assume that components are used during their useful life. The standard method has versatility, but clear appropriate
For the component types given in Chapter 6 and Appendix E.2.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version applies to this article
Pieces. For undated references, the latest edition (including all amendments) applies to this document.
IEC 60050-191 International Electrotechnical terminology - Part 191. Credibility and quality of service (Internationalelectrotechnical
vocabulary-Part 191.Dependabilityandqualityofservice)
IEC 60605-6, Equipment reliability testing - Part 6. Validity tests of constant failure rates and constant failure density assumptions
(Equipmentreliabilitytesting-Part 6.Testsforthevalidityandestimationoftheconstantfailure
rateandconstantfailureintensity)
IEC 60721-3-3 Classification of electric and electronic products application environment - Part 3. Fixed place with climate protection place
ofenvironmentalconditions-Part 3.Classificationofgroupsofenvironmentalparametersandtheir
severities-Section3.Stationaryuseatweatherprotectedlocations)
IEC 60721-3-4 Classification of electrical and electronic equipment - Environmental classification - Part 4. Classification of non-weather protective equipment
ofenvironmentalconditions-Part 3.Classificationofgroupsofenvironmentalparametersandtheir
severities-Section4.Stationaryuseatnonweatherprotectedlocations)
IEC 60721-3-5 Classification of electrical and electronic products application environment Part 5. Use of ground vehicles (Classificationofenviron-
mentalconditions-Part 3.Classificationofgroupsofenvironmentalparametersandtheirseverities-
Section4.Groundvehicleinstalations)
IEC 60721-3-7 Classification of electrical and electronic products application environment Part 7. Carrying and non-fixed use (Classificationofen-
vironmentalconditions-Part 3.Classificationofgroupsofenvironmentalparametersandtheirseveri-
|