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GB/T 40564-2021: Test method of epoxy molding compound for electronic packaging
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| GB/T 40564-2021 | English | 819 |
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Test method of epoxy molding compound for electronic packaging
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GB/T 40564-2021
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Basic data | Standard ID | GB/T 40564-2021 (GB/T40564-2021) | | Description (Translated English) | Test method of epoxy molding compound for electronic packaging | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | L90 | | Word Count Estimation | 45,495 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 40564-2021: Test method of epoxy molding compound for electronic packaging---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Test method of epoxy molding compound for electronic packaging
ICS 31.030
CCSL90
National Standards of People's Republic of China
Test methods for epoxy plastic packaging materials for electronic packaging
Released on 2021-10-11
2022-05-01 implementation
State Administration for Market Regulation
Issued by the National Standardization Management Committee
Table of contents
Foreword Ⅲ
1 Scope 1
2 Normative references 1
3 Terms and definitions 1
4 General requirements 2
4.1 Environmental conditions 2
4.2 Sample requirements 2
4.3 Report 2
5 Appearance inspection 2
5.1 Powder epoxy molding compound 2
5.2 Epoxy molding compound for cake material 2
6 Physical and chemical performance test 2
6.1 Gelation time 2
6.2 Spiral flow length 3
6.3 Flash 4
6.4 Hot hardness 6
6.5 Density 7
6.6 Thermal conductivity 7
6.7 Viscosity 7
6.8 Glass transition temperature 10
6.9 Coefficient of linear thermal expansion (TMA probe method) 14
6.10 Water absorption 15
6.11 Flame resistance 17
6.12 Conductivity (extracted aqueous solution) 17
6.13 pH value (extracted aqueous solution) 18
6.14 Sodium ion content (extracted aqueous solution) 19
6.15 Chloride ion content, bromide ion content (extracted aqueous solution) 22
6.16 Bromine content, antimony content, chlorine content 24
6.17 Ash 25
6.18 Uranium content 26
7 Mechanical performance test 30
7.1 Bending strength 30
7.2 Impact strength 33
7.3 Mold shrinkage 33
7.4 Bond strength 34
8 Electrical performance test 37
8.1 Volume resistivity 37
8.2 Dielectric constant, dielectric loss 40
8.3 Breakdown strength 41
Foreword
This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1.Structure and Drafting Rules of Standardization Documents"
Drafting.
Please note that some of the contents of this document may involve patents. The issuing agency of this document is not responsible for identifying patents.
This document was proposed and managed by the National Semiconductor Equipment and Material Standardization Technical Committee (SAC/TC203).
Drafting organizations of this document. Jiangsu Huahai Chengke New Materials Co., Ltd., China Electronics Standardization Institute, Lianyungang Food
Drug Inspection and Testing Center, Jiangsu Changdian Technology Co., Ltd., National Silicon Material Deep-Processing Product Quality Supervision and Inspection Center Tokai Research
Research Institute.
The main drafters of this document. Cheng Xingming, Shi Erzeng, Yang Hui, Cui Liang, Chen Lingzhi, Cao Kewei, Guan Qi, Li Yunzhi, Li Xiaojuan, Tan Wei,
Li Jiande.
Test methods for epoxy plastic packaging materials for electronic packaging
1 Scope
This document specifies the appearance, gelation time, spiral flow length, flash, thermal hardness, density, and thermal conductivity of epoxy plastic encapsulants for electronic packaging.
Coefficient, viscosity, glass transition temperature, linear thermal expansion coefficient, water absorption, flame retardancy, electrical conductivity, pH value, sodium ion content, chloride ion content
Amount, bromide ion content, bromine content, antimony content, chlorine content, ash content, uranium content, bending strength, impact strength, molding shrinkage, bonding strength, body
Test methods for product resistivity, dielectric constant, dielectric loss, breakdown strength, etc.
This document is applicable to the performance testing of epoxy plastic packaging materials used for electronic packaging of semiconductor discrete devices, integrated circuits and special devices.
2 Normative references
The content of the following documents constitutes an indispensable clause of this document through normative references in the text. Among them, dated quotations
Only the version corresponding to the date is applicable to this document; for undated reference documents, the latest version (including all amendments) is applicable
In this document.
GB/T 602-2002 Preparation of standard solutions for impurity determination of chemical reagents
GB/T 1033.1-2008 Determination of the density of plastic non-foam plastics Part 1.Immersion method, liquid pycnometer method and titration method
GB/T 1043.1-2008 Determination of impact properties of plastic simply supported beams Part 1.Non-instrumented impact test
GB/T 1408.1-2016 Insulating material electric strength test method Part 1.Test under power frequency
GB/T 1409-2006 Measure the permittivity and dielectric loss of electrical insulating materials at power frequency, audio frequency, and high frequency (including meter wave wavelength)
Recommended method of dissipation factor
GB/T 2408 Determination of the Burning Properties of Plastics by Horizontal Method and Vertical Method
GB/T 2411-2008 Plastic and hard rubber use a durometer to determine the indentation hardness (Shore hardness)
GB/T 3139-2005 Test method for thermal conductivity of fiber reinforced plastics
GB/T 6682-2008 Analytical laboratory water specifications and test methods
GB/T 9723-2007 General Rules of Flame Atomic Absorption Spectrometry for Chemical Reagents
GB/T 9724-2007 General rules for the determination of pH value of chemical reagents
GB/T 16597-2019 General Rules of X-ray Fluorescence Spectrometry for Analysis Methods of Metallurgical Products
3 Terms and definitions
The following terms and definitions apply to this document.
3.1
Flashandbleed
During the molding process, the epoxy molding compound overflows between the mold and the frame joint surface, and remains the remaining material on the frame.
3.2
Post-curing postmoldcure
After the epoxy molding compound is plasticized, put the plasticized material into a hot air circulating oven at 175°C and continue to maintain a constant temperature for a period of time.
The cross-linking reaction will continue, and the curing degree will continue to increase.
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