HOME   Cart(0)   Quotation   About-Us Policy PDFs Standard-List
www.ChineseStandard.net Database: 189759 (19 Oct 2025)

GB/T 40564-2021 English PDF

US$819.00 · In stock
Delivery: <= 6 days. True-PDF full-copy in English will be manually translated and delivered via email.
GB/T 40564-2021: Test method of epoxy molding compound for electronic packaging
Status: Valid
Standard IDContents [version]USDSTEP2[PDF] delivered inStandard Title (Description)StatusPDF
GB/T 40564-2021English819 Add to Cart 6 days [Need to translate] Test method of epoxy molding compound for electronic packaging Valid GB/T 40564-2021

PDF similar to GB/T 40564-2021


Standard similar to GB/T 40564-2021

GB/T 41203   GB/T 37406   GB/T 29848   GB/T 29847   GB/T 40563   

Basic data

Standard ID GB/T 40564-2021 (GB/T40564-2021)
Description (Translated English) Test method of epoxy molding compound for electronic packaging
Sector / Industry National Standard (Recommended)
Classification of Chinese Standard L90
Word Count Estimation 45,495
Issuing agency(ies) State Administration for Market Regulation, China National Standardization Administration

GB/T 40564-2021: Test method of epoxy molding compound for electronic packaging

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Test method of epoxy molding compound for electronic packaging ICS 31.030 CCSL90 National Standards of People's Republic of China Test methods for epoxy plastic packaging materials for electronic packaging Released on 2021-10-11 2022-05-01 implementation State Administration for Market Regulation Issued by the National Standardization Management Committee

Table of contents

Foreword Ⅲ 1 Scope 1 2 Normative references 1 3 Terms and definitions 1 4 General requirements 2 4.1 Environmental conditions 2 4.2 Sample requirements 2 4.3 Report 2 5 Appearance inspection 2 5.1 Powder epoxy molding compound 2 5.2 Epoxy molding compound for cake material 2 6 Physical and chemical performance test 2 6.1 Gelation time 2 6.2 Spiral flow length 3 6.3 Flash 4 6.4 Hot hardness 6 6.5 Density 7 6.6 Thermal conductivity 7 6.7 Viscosity 7 6.8 Glass transition temperature 10 6.9 Coefficient of linear thermal expansion (TMA probe method) 14 6.10 Water absorption 15 6.11 Flame resistance 17 6.12 Conductivity (extracted aqueous solution) 17 6.13 pH value (extracted aqueous solution) 18 6.14 Sodium ion content (extracted aqueous solution) 19 6.15 Chloride ion content, bromide ion content (extracted aqueous solution) 22 6.16 Bromine content, antimony content, chlorine content 24 6.17 Ash 25 6.18 Uranium content 26 7 Mechanical performance test 30 7.1 Bending strength 30 7.2 Impact strength 33 7.3 Mold shrinkage 33 7.4 Bond strength 34 8 Electrical performance test 37 8.1 Volume resistivity 37 8.2 Dielectric constant, dielectric loss 40 8.3 Breakdown strength 41

Foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1.Structure and Drafting Rules of Standardization Documents" Drafting. Please note that some of the contents of this document may involve patents. The issuing agency of this document is not responsible for identifying patents. This document was proposed and managed by the National Semiconductor Equipment and Material Standardization Technical Committee (SAC/TC203). Drafting organizations of this document. Jiangsu Huahai Chengke New Materials Co., Ltd., China Electronics Standardization Institute, Lianyungang Food Drug Inspection and Testing Center, Jiangsu Changdian Technology Co., Ltd., National Silicon Material Deep-Processing Product Quality Supervision and Inspection Center Tokai Research Research Institute. The main drafters of this document. Cheng Xingming, Shi Erzeng, Yang Hui, Cui Liang, Chen Lingzhi, Cao Kewei, Guan Qi, Li Yunzhi, Li Xiaojuan, Tan Wei, Li Jiande. Test methods for epoxy plastic packaging materials for electronic packaging

1 Scope

This document specifies the appearance, gelation time, spiral flow length, flash, thermal hardness, density, and thermal conductivity of epoxy plastic encapsulants for electronic packaging. Coefficient, viscosity, glass transition temperature, linear thermal expansion coefficient, water absorption, flame retardancy, electrical conductivity, pH value, sodium ion content, chloride ion content Amount, bromide ion content, bromine content, antimony content, chlorine content, ash content, uranium content, bending strength, impact strength, molding shrinkage, bonding strength, body Test methods for product resistivity, dielectric constant, dielectric loss, breakdown strength, etc. This document is applicable to the performance testing of epoxy plastic packaging materials used for electronic packaging of semiconductor discrete devices, integrated circuits and special devices.

2 Normative references

The content of the following documents constitutes an indispensable clause of this document through normative references in the text. Among them, dated quotations Only the version corresponding to the date is applicable to this document; for undated reference documents, the latest version (including all amendments) is applicable In this document. GB/T 602-2002 Preparation of standard solutions for impurity determination of chemical reagents GB/T 1033.1-2008 Determination of the density of plastic non-foam plastics Part 1.Immersion method, liquid pycnometer method and titration method GB/T 1043.1-2008 Determination of impact properties of plastic simply supported beams Part 1.Non-instrumented impact test GB/T 1408.1-2016 Insulating material electric strength test method Part 1.Test under power frequency GB/T 1409-2006 Measure the permittivity and dielectric loss of electrical insulating materials at power frequency, audio frequency, and high frequency (including meter wave wavelength) Recommended method of dissipation factor GB/T 2408 Determination of the Burning Properties of Plastics by Horizontal Method and Vertical Method GB/T 2411-2008 Plastic and hard rubber use a durometer to determine the indentation hardness (Shore hardness) GB/T 3139-2005 Test method for thermal conductivity of fiber reinforced plastics GB/T 6682-2008 Analytical laboratory water specifications and test methods GB/T 9723-2007 General Rules of Flame Atomic Absorption Spectrometry for Chemical Reagents GB/T 9724-2007 General rules for the determination of pH value of chemical reagents GB/T 16597-2019 General Rules of X-ray Fluorescence Spectrometry for Analysis Methods of Metallurgical Products

3 Terms and definitions

The following terms and definitions apply to this document. 3.1 Flashandbleed During the molding process, the epoxy molding compound overflows between the mold and the frame joint surface, and remains the remaining material on the frame. 3.2 Post-curing postmoldcure After the epoxy molding compound is plasticized, put the plasticized material into a hot air circulating oven at 175°C and continue to maintain a constant temperature for a period of time. The cross-linking reaction will continue, and the curing degree will continue to increase.

Tips & Frequently Asked Questions:

Question 1: How long will the true-PDF of GB/T 40564-2021_English be delivered?

Answer: Upon your order, we will start to translate GB/T 40564-2021_English as soon as possible, and keep you informed of the progress. The lead time is typically 4 ~ 6 working days. The lengthier the document the longer the lead time.

Question 2: Can I share the purchased PDF of GB/T 40564-2021_English with my colleagues?

Answer: Yes. The purchased PDF of GB/T 40564-2021_English will be deemed to be sold to your employer/organization who actually pays for it, including your colleagues and your employer's intranet.

Question 3: Does the price include tax/VAT?

Answer: Yes. Our tax invoice, downloaded/delivered in 9 seconds, includes all tax/VAT and complies with 100+ countries' tax regulations (tax exempted in 100+ countries) -- See Avoidance of Double Taxation Agreements (DTAs): List of DTAs signed between Singapore and 100+ countries

Question 4: Do you accept my currency other than USD?

Answer: Yes. If you need your currency to be printed on the invoice, please write an email to [email protected]. In 2 working-hours, we will create a special link for you to pay in any currencies. Otherwise, follow the normal steps: Add to Cart -- Checkout -- Select your currency to pay.