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GB/T 38265.16-2019: Test methods for soft soldering fluxes -- Part 16: Flux efficacy test -- Wetting balance method
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Test methods for soft soldering fluxes -- Part 16: Flux efficacy test -- Wetting balance method
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GB/T 38265.16-2019
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Basic data | Standard ID | GB/T 38265.16-2019 (GB/T38265.16-2019) | | Description (Translated English) | Test methods for soft soldering fluxes -- Part 16: Flux efficacy test -- Wetting balance method | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | J33 | | Classification of International Standard | 25.160.50 | | Word Count Estimation | 14,150 | | Date of Issue | 2019-12-31 | | Date of Implementation | 2020-07-01 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 38265.16-2019: Test methods for soft soldering fluxes -- Part 16: Flux efficacy test -- Wetting balance method
---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Test methods for soft soldering fluxes-Part 16. Flux efficacy test. Wetting balance method
ICS 25.160.50
J33
National Standards of People's Republic of China
Test method for solder
Part 16. Wetting performance of solder
2019-12-31 release
2020-07-01 implementation
State Administration of Market Supervision
Published by the National Standardization Administration
Contents
Foreword I
1 Scope 1
2 Normative references 1
3 Terms and definitions 1
4 Symbols and descriptions 1
5 Principle 2
6 Reagent 2
7 Equipment 2
8 Test piece 3
9 Test step 3
10 Standard solder test 5
11 Test data description 5
12 Test data processing 6
13 Test report 7
Appendix A (informative) Structural changes in this part compared to ISO 9455-16..2013 8
Appendix B (Normative Appendix) Technical Requirements for Wetting Balance Test System 9
Appendix C (Normative Appendix) Preparation method of rosin-based liquid solder standard sample containing 25% non-volatile matter10
Foreword
GB/T 38265 `` Testing Method for Solder '' is divided into the following parts.
--- Part 1. Determination of non-volatile matter content by gravimetric method;
--- Part 2. Determination of non-volatile matter content by boiling point method;
--- Part 3. Determination of acid value by potentiometric titration and visual titration;
--- Part 5. copper mirror test;
--- Part 6. Determination of halide (excluding fluoride) content;
--- Part 8. Determination of zinc content;
--- Part 9. Determination of ammonia content;
--- Part 10. Spread test method for solder wettability;
--- Part 11. solubility of flux residues;
--- Part 13. Determination of solder splash;
--- Part 14. Evaluation of the stickiness of flux residues;
--- Part 15. Copper corrosion test;
--- Part 16. Wetting balance method of solder wetting performance;
--- Part 17. Surface insulation resistance comb test and electrochemical migration test of flux residue.
This part is the 16th part of GB/T 38265.
This section is drafted in accordance with the rules given in GB/T 1.1-2009.
This part uses the redrafting method to modify and adopt ISO 9455-16..2013 "Testing methods for solders-Part 16. Testing of flux efficacy
Test Wetting Balance Method.
This part has structural changes compared to ISO 9455-16..2013.Appendix A lists the chapters of this part and ISO 9455-16..2013.
Bar number comparison list.
The technical differences between this part and ISO 9455-16..2013 and their causes are as follows.
--- Regarding the normative references, this section has made adjustments with technical differences to suit China's technical conditions and the situation of adjustment.
The situation is reflected in Chapter 2 "Regulatory Reference Documents", and the specific adjustments are as follows.
● Added reference to national standard GB/T 686;
● Replace ISO 9453 with reference to GB/T 3131 adopting international standards and modify GB/T 20422 adopting international standards;
● Replace ISO 9454-1 with GB/T 15829 which adopts international standards;
--- Added terms and definitions (see Chapter 3);
--- Added the normative Appendix B "Technical Requirements for Wetting Balance Test System" to facilitate standard applications;
--- Deleted the appendix B (normative appendix) of ISO 9455-16..2013.
The following editorial changes have also been made in this section.
--- Amend the standard name to "Solder Test Method Part 16. Wetting Balance Method of Wetting Performance of Solder".
--- Informative appendix A "Structural changes of this part compared with ISO 9455-16..2013" has been added to facilitate application and ISO
Standard control.
This part is proposed and managed by the National Welding Standardization Technical Committee (SAC/TC55).
Drafting units of this section. Shenzhen Hanerxin Electronic Technology Co., Ltd., Zhejiang Yatong Welding Materials Co., Ltd., Shenzhen Vital New Materials
Co., Ltd., Shenzhen Tongfang Electronic New Materials Co., Ltd., Suzhou Keshida Electronic Materials Co., Ltd., Harbin Welding Research Institute
Co., Ltd., Beijing Kangpu Xiwei Technology Co., Ltd., Shenzhen Yida Industrial Co., Ltd., Harbin Institute of Technology.
The main drafters of this section. Ma Xin, Jin Xia, Tang Xin, He Peng, Xiao Hanfei, Li Chunfang, Su Jinhua, Sun Xiaomei, Wang Zhigang, Yang Haifeng.
Test method for solder
Part 16. Wetting performance of solder
1 Scope
This part of GB/T 38265 specifies the test method for evaluating the wettability of solders--wetting balance method, including method principle, test
Agent, equipment, test piece, test procedure, standard solder test, test data description, test data processing, test report, etc.
This section applies to all types of liquid solder.
2 Normative references
The following documents are essential for the application of this document. For dated references, only the dated version applies to this article
Pieces. For undated references, the latest version (including all amendments) applies to this document.
GB/T 686 chemical reagent acetone
GB/T 2423.3-2016 Environmental test Part 2. Test method Test Cab. Constant humidity test (IEC 60068-2-
78..2012, IDT)
GB/T 2423.28-2005 Environmental testing for electric and electronic products Part 2. Test methods Test T. Soldering (IEC 60068-
2-20. 1979, IDT)
GB/T 2423.32-2008 Environmental test for electric and electronic products. Part 2. Test methods Test Ta. Wettable weighing method
(IEC 60068-2-54..2006, IDT)
GB/T 3131 tin-lead solder
Classification and performance requirements of GB/T 15829 soldering flux (GB/T 15829-2008, ISO 9454-1..1990, ISO 9454-2.
1998, MOD)
GB/T 20422 lead-free solder (GB/T 20422-2018, ISO 9453..2014, MOD)
3 terms and definitions
The terms and definitions defined in GB/T 15829 and the following apply to this document.
3.1
Wetting force
The force generated by the molten solder in the vertical direction of the metal sheet infiltration, including the corresponding buoyancy.
3.2
Solder bath
It can hold solder, has heating device to melt the solder, and can keep heat at a certain temperature.
4 Symbols and descriptions
The symbols, units and corresponding descriptions used in this section are shown in Table 1.
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