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GB/T 38265.8-2022 English PDF

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GB/T 38265.8-2022: Test methods for soft soldering fluxes - Part 8: Determination of zinc content
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GB/T 38265.8-2022English239 Add to Cart 3 days [Need to translate] Test methods for soft soldering fluxes - Part 8: Determination of zinc content Valid GB/T 38265.8-2022

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Basic data

Standard ID GB/T 38265.8-2022 (GB/T38265.8-2022)
Description (Translated English) Test methods for soft soldering fluxes - Part 8: Determination of zinc content
Sector / Industry National Standard (Recommended)
Classification of Chinese Standard J33
Classification of International Standard 25.160.50
Word Count Estimation 11,128
Date of Issue 2022-10-12
Date of Implementation 2022-10-12
Issuing agency(ies) State Administration for Market Regulation, China National Standardization Administration

GB/T 38265.8-2022: Test methods for soft soldering fluxes - Part 8: Determination of zinc content

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Test methods for soft soldering fluxes - Part 8.Determination of zinc content ICS 25.160.50 CCSJ33 National Standards of People's Republic of China Soldering Flux Test Method Part 8.Determination of zinc content (ISO 9455-8.1991, Softsolderingfluxes-Testmethods- Released on 2022-10-12 2022-10-12 implementation State Administration for Market Regulation Released by the National Standardization Management Committee

table of contents

Preface III Introduction IV 1 Scope 1 2 Normative references 1 3 Terms and Definitions 1 4 Principle 1 5 Reagent 1 6 Instruments and equipment 2 7 Test Step 2 8 Experimental data processing 2 9 Precision 3 10 Test report 3 Appendix A (Informative) Comparison between this document and ISO 9455-8.1991 structure number 4 Reference 5

foreword

This document is in accordance with the provisions of GB/T 1.1-2020 "Guidelines for Standardization Work Part 1.Structure and Drafting Rules for Standardization Documents" drafting. This document is part 8 of GB/T 38265 "Test Methods for Solder Flux". GB/T 38265 has released the following parts. --- Part 1.Gravimetric method for the determination of non-volatile matter content; --- Part 2.Determination of non-volatile matter content boiling point method; --- Part 3.Determination of acid value Potentiometric titration and visual titration; --- Part 5.Copper mirror test; --- Part 6.Determination of content of halides (excluding fluorides); --- Part 8.Determination of zinc content; --- Part 9.Determination of ammonia content; --- Part 10.Solder wetting performance spreading test method; --- Part 11.Solubility of flux residues; --- Part 13.Determination of flux splashing; --- Part 14.Evaluation of the adhesiveness of flux residues; --- Part 15.Copper corrosion test; --- Part 16.Solder wetting performance Wetting balance method; --- Part 17.Flux residue surface insulation resistance comb test and electrochemical migration test. This document is modified to adopt ISO 9455-8.1991 "Test methods for soldering flux - Part 8.Determination of zinc content". Compared with ISO 9455-8.1991, this document has more structural adjustments, and the comparison list of structural number changes between the two documents See Appendix A. The technical differences between this document and ISO 9455-8.1991 and their reasons are as follows. --- Increase the reference to GB/T 15347 (see 5.1) to adapt to my country's technical conditions and increase operability; --- Increase the reference to GB/T 658 (see 5.2) to adapt to the technical conditions of our country and increase operability; --- Changed the density values of reagents "hydrochloric acid" and "ammonia water" (see 5.3, 5.4) to adapt to the technical conditions of our country; --- Increased the requirements of "laboratory analytical balance" in the instrument and equipment (see 6.1), to facilitate the application of this document; --- Increase the reference to GB/T 6379.2 (see Chapter 9) to adapt to the technical conditions of our country and increase operability; The following editorial changes have been made to this document. --- In order to coordinate with existing standards, the name of the standard was changed to "Test methods for soldering flux - Part 8.Determination of zinc content". --- Replaced ISO 9454-1 with the informative referenced GB/T 15829 and moved to the references (see Chapter 1 and references), to It adapts to the technical conditions of our country and complies with the standard writing requirements. Please note that some contents of this document may refer to patents. The issuing agency of this document assumes no responsibility for identifying patents. This document is proposed and managed by the National Welding Standardization Technical Committee (SAC/TC55). This document is drafted by. East China University of Science and Technology, Harbin Welding Research Institute Co., Ltd., Shenzhen Weite New Materials Co., Ltd., Shaoxing Tianlong Tin Materials Co., Ltd., Zhejiang Yatong Welding Materials Co., Ltd., Xiamen Jiyu Solder Co., Ltd., Zhengzhou Machinery Research Institute Co., Ltd. Company, Harbin Institute of Technology. The main drafters of this document. Luo Jianqiang, He Peng, Li Weijun, Dong Jianguang, Zhang Lingling, Wang Shaohua, Cheng Yafang, Lu Xiaochun, Sun Xiaomei, Song Bei.

Introduction

As the key supporting combination material in the soldering process, soldering agent has a decisive influence on the quality of soldered joints. The strong foundation project being implemented, the national science and technology major project "core electronic devices, high-end general-purpose chips and basic software products" and "ultra-large-scale Technology research and development of core electronic devices, high-end chips and integrated circuit complete sets of technology in the Special Project of Modular Integrated Circuit Manufacturing Equipment and Complete Processes Among them, solder is the key basic material, and the formulation of test method standards for its quality performance evaluation is of great significance. Since 1988, my country has promulgated and implemented GB/T 3131 "Sn-Lead Solder", GB/T 20422 "Soldering Flux Classification and Performance Requirements". requirements", GB/T 15829 "Lead-free Solder" and GB/T 28770 "Test Method for Solder", etc. It not only has an important impact on the solderability and manufacturability of solder, but also has great influence on the environment, reliability and application of solder joints. Very critical. GB/T 38265 "Test Methods for Soldering Fluxes" is a general test method standard for soldering fluxes, and is intended to be composed of the following parts. --- Part 1.Gravimetric method for the determination of non-volatile matter content. The purpose is to specify the use of gravimetric method to determine the non-volatile Test method for substance content. --- Part 2.Determination of non-volatile matter content Boiling point method. The purpose is to stipulate the determination of the non-volatile oil in solder by the boiling point method. Test method for substance content. --- Part 3.Determination of acid value potentiometric titration and visual titration. The purpose is to specify the use of potentiometric titration and visual titration Standard test method for the determination of acid value in solder. --- Part 5.Copper mirror test. The purpose of this specification is to specify a test method for evaluating the aggressiveness of solder to copper by means of the copper mirror test. --- Part 6.Determination of halide (excluding fluoride) content. The purpose is to specify the use of three quantitative methods for the determination of solder flux Ionic Halide Content and a Qualitative Method Test Method for the Presence of Ionic Halides in Solder Fluxes. --- Part 8.Determination of zinc content. The purpose is to specify the test for the determination of zinc content in soldering flux by EDTA titration method method. --- Part 9.Determination of ammonia content. The purpose of this document is to specify a test method for the determination of ammonia content in solder fluxes by distillation. --- Part 10.Solder wetting performance spreading test method. The purpose is to specify the use of spreading method to evaluate the wetting performance of solder test method. --- Part 11.Solubility of flux residues. The purpose is to specify a qualitative method for the evaluation of solder residues in selected solvents Solubility test method. --- Part 13.Determination of flux splashing. Its purpose is to specify a test method for evaluating the spattering properties of solder fluxes on steel test pieces. --- Part 14.Evaluation of the adhesiveness of flux residues. The purpose is to specify the use of chalk powder for the evaluation of residues after soldering after soldering. Adhesive test method. --- Part 15.Copper corrosion test. The purpose is to specify the qualitative evaluation of the surface of copper plates using the copper corrosion test under controlled environmental conditions. Test method for corrosivity of solder residues. --- Part 16.Solder wetting properties Wetting balance method. The purpose is to specify the use of wetting balance method to evaluate the wettability of solder capable test method --- Part 17.Flux residue surface insulation resistance comb test and electrochemical migration test. The purpose is to specify the use of surface Insulation resistance comb test and electrochemical migration test to evaluate the corrosion of flux residues on the surface of the test piece after soldering method. This document specifies the method for the determination of zinc content in soldering flux. This method has the advantages of simple operation, strong applicability, accurate and reliable results, etc. At present, it has become an important detection method in soldering flux products. Soldering Flux Test Method Part 8.Determination of zinc content

1 Scope

This document specifies the method for the determination of zinc content in soldering flux, including principles, reagents, instruments and equipment, test procedures, test data processing, precision Density, test report, etc. This document is applicable to water-soluble solder fluxes of type 3 defined in GB/T 15829 with a zinc content (calculated as zinc chloride) of approximately 25%.

2 Normative references

The contents of the following documents constitute the essential provisions of this document through normative references in the text. Among them, dated references For documents, only the version corresponding to the date is applicable to this document; for undated reference documents, the latest version (including all amendments) is applicable to this document. GB/T 658 Chemical Reagent Ammonium Chloride (GB/T 658-2006, ISO 6353-2.1983, NEQ) GB/T 6379.2 Accuracy of measurement methods and results (trueness and precision) - Part 2.Determination of repeatability of standard measurement methods Basic methods of reliability and reproducibility (GB/T 6379.2-2004, ISO 5725-2.1994, IDT) GB/T 15347 Chemical Reagent L()-Ascorbic Acid (GB/T 15347-2015, ISO 6353-3.1987, NEQ)

3 Terms and Definitions

This document does not have terms and definitions that need to be defined.

4 principles

Ammonium chloride is added to the aqueous solder solution containing sulfuric acid, and the solution is made alkaline by adding ammonia water, and the iron element is precipitated in the form of hydroxide. starch separation. The zinc content in solder flux was determined by EDTA titration.

5 reagents

Unless otherwise stated, only reagents confirmed to be of analytical grade and distilled or deionized water were used in the analysis. 5.1 Ascorbic acid Meet the requirements of GB/T 15347. 5.2 Ammonium chloride (NH4Cl) Meet the requirements of GB/T 658. 5.3 Hydrochloric acid The density is 1.19g/mL.

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