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Reliability test method for optoelectronic devices used in telecommunications
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GB/T 33768-2017
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Basic data Standard ID | GB/T 33768-2017 (GB/T33768-2017) | Description (Translated English) | Reliability test method for optoelectronic devices used in telecommunications | Sector / Industry | National Standard (Recommended) | Classification of Chinese Standard | M31 | Classification of International Standard | 33.180.20 | Word Count Estimation | 38,353 | Date of Issue | 2017-05-31 | Date of Implementation | 2017-12-01 | Quoted Standard | GB/T 19001; GB/T 21194 | Issuing agency(ies) | General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China | Summary | This standard specifies the terms and definitions of the reliability test methods for optoelectronic devices for communications, general requirements, detailed requirements, including the purpose of the test, equipment, conditions, procedures, tests and failure criteria. This standard applies to communications optoelectronic devices, other areas of optoelectronic devices can also refer to the use. |
GB/T 33768-2017: Reliability test method for optoelectronic devices used in telecommunications---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Reliability test method for optoelectronic devices used in telecommunications
ICS 33.180.20
M31
National Standards of People's Republic of China
Reliability test method for optoelectronic devices for communications
2017-05-31 released
2017-12-01 implementation
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
China National Standardization Management Committee released
Directory
Preface III
1 Scope 1
2 normative reference document 1
3 Terms and definitions 1
General requirements
4.1 Test Type 1
4.2 Test equipment 1
4.3 Test environment 2
4.4 Sampling plan 2
4.5 Test Report 2
5 detailed requirements 3
5.1 Compliance test 3
5.1.1 photoelectric characteristics 3
5.1.2 Dimensions 4
5.1.3 External visual inspection 4
5.2 Mechanical integrity test 5
5.2.1 Mechanical shock 5
5.2.2 Variable frequency vibration 6
5.2.3 Thermal shock 7
5.2.4 Fiber torque 8
5.2.5 Fiber lateral tension 9
5.2.6 Fiber Rally 9
5.2.7 pin firmness 10
5.2.8 Connector insertion and durability 11
5.2.9 Force transmission 12
5.3 Environmental tests 13
5.3.1 High temperature storage 13
5.3.2 Low temperature storage 14
5.3.3 Temperature cycle 14
5.3.4 constant hot and humid 16
5.3.5 Moisture resistant cycle 16
5.3.6 High temperature life 18
5.4 Physical Characteristics Test 19
5.4.1 Internal water vapor content 19
5.4.2 Sealing 20
5.4.3 ESD threshold 22
5.4.4 ESD immunity 24
5.4.5 Chip Shear Force 27
5.4.6 Solderability 28
5.4.7 Wire bonding strength 30
5.4.8 Flammability 31
Reference 34
Foreword
This standard is drafted in accordance with the rules given in GB/T 1.1-2009.
Please note that some of the contents of this document may involve patents. The issuer of this document does not assume responsibility for the identification of these patents.
This standard is proposed by the Ministry of Industry and Information Technology of the People's Republic of China.
This standard is owned by the Ministry of Industry and Information Technology (communications).
The drafting of this standard. Wuhan Fiberhome Technology Group Co., Ltd., ZTE Corporation, China Information and Communication Research Institute, Shenzhen
New Flying Electronic Technology Co., Ltd.
The drafting of this standard. Zhao Xianming, Song Mengyang, Jiang Yi, Gong Xue, Luo Yong, Deng Zhifang, Yang Chun, Wu Chengbin, Zhao Wenyu, Chen Yue.
Reliability test method for optoelectronic devices for communications
1 Scope
This standard specifies the terms and definitions of the reliability test method for optoelectronic devices for communications, general requirements, detailed requirements, including test
Purpose, equipment, conditions, procedures, inspection and failure criteria.
This standard applies to communications optoelectronic devices, other areas of optoelectronic devices can also refer to the use.
2 normative reference documents
The following documents are indispensable for the application of this document. For dated references, only the dated edition applies to this article
Pieces. For undated references, the latest edition (including all modifications) applies to this document.
GB/T 19001 quality management system requirements
GB/T 21194 General requirements for reliability of optoelectronic devices for communications equipment
3 terms and definitions
The following definitions and definitions as defined in GB/T 21194 apply to this document.
3.1
Optoelectronic devices optoelectronicdevice
Elements with photoelectric properties.
Note. including but not limited to laser diodes, light-emitting diodes, photodiodes, avalanche photodiodes and their components or modules, collectively referred to as "photoelectric
Sub-device ".
3.2
Sample specimen
A sample of optoelectronic devices used as a reliability test.
3.3
Failure failure
When the optoelectronic device does not meet the specified photoelectric parameters and/or physical parameters, it is called failure.
3.4
Failure criterion
Determine the basis for failure of optoelectronic devices.
4 General requirements
4.1 Test type
Test types include. compliance test, mechanical integrity test, environmental test and physical characteristics of the test.
4.2 Test equipment
The test equipment should be maintained and calibrated on a regular basis. The maintenance, calibration and control of the test equipment shall comply with the relevant provisions of GB/T 19001.
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