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US$969.00 · In stock Delivery: <= 7 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 31845-2015: Mechanical structures for electrotechnical and electronic equipment -- Thermal design specification Status: Valid
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| GB/T 31845-2015 | English | 969 |
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Mechanical structures for electrotechnical and electronic equipment -- Thermal design specification
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GB/T 31845-2015
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Basic data | Standard ID | GB/T 31845-2015 (GB/T31845-2015) | | Description (Translated English) | Mechanical structures for electrotechnical and electronic equipment -- Thermal design specification | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | K05 | | Classification of International Standard | 31.240 | | Word Count Estimation | 46,448 | | Date of Issue | 2015-07-03 | | Date of Implementation | 2016-02-01 | | Quoted Standard | GB 3095; GB 3096; GB 4943.1-2011; GB/T 14295-2008; YD/T 1821-2008; ETS 300 119-5; GR-63; ASTM D5470 | | Regulation (derived from) | National Standard Announcement 2015 No.22 | | Issuing agency(ies) | General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China | | Summary | This Standard specifies the basic principles of electrical and electronic equipment, machinery for thermal design, thermal design requirements, commonly used cooling technology, a key component cooling, thermal interface materials and related requirements for thermal testing, thermal design also introduces the algorithm and commonly used materials in the appendix physical parameters. This Standard applies to all electrical and electronic equipment thermal design of mechanical structures except handheld devices. The following electrical and electronic equipment referred to as "equipment", electrical and electronic equipment mechanical structure referred to as "mechanical structure." |
GB/T 31845-2015: Mechanical structures for electrotechnical and electronic equipment -- Thermal design specification ---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Mechanical structures for electrotechnical and electronic equipment. Thermal design specification
ICS 31.240
K05
National Standards of People's Republic of China
Electrical and electronic equipment mechanical structure
Thermal design specifications
Issued on. 2015-07-03
2016-02-01 implementation
Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China
Standardization Administration of China released
Table of Contents
Introduction Ⅲ
1 Scope 1
2 Normative references 1
3 Terms and definitions
4 Thermal Design Overview 4
The basic principles of thermal design 4 4.1
Relevant factors thermal design 4 4.2
The basic mode of heat transfer of 4.3 5
Select the cooling method 5 4.4
4.5 accessible surface temperature for 6
The temperature of the device 7 4.6
The temperature of the device 7 4.7
Noise device 7 4.8
4.9 redundant design 7
4.10 Other 7
5 commonly used cooling technology 8
5.1 Natural cooling 8
5.1.1 natural heat conduction in 8
5.1.2 natural heat convection 8
5.1.3 natural heat radiation in 9
5.1.4 Natural cooling heat transfer path control 10
10 5.2 Forced air cooling
5.2.1 duct design 10
5.2.2 fan selection, installation and speed control 12
5.2.3 Selection of the heat exchanger 16
5.2.4 Air Filter Selection 17
5.2.5 noise forced air cooling device control 18
5.2.6 Forced Air Cooling common main measures 19
Thermal management principles 5.2.7 Forced air cooling device 19
20 5.3 Additional cooling technology
5.3.1 Liquid Cooling 20
5.3.2 Peltier 20
5.3.3 phase change thermal storage 20
6 heat management technology 20
6.1 Overview 20
The basic principle of heat management 21 6.2
6.2.1 Room plan 21
6.2.2 engine room cooling 22
6.2.3 engine room cooling mode selection 26
7 key components cooling and thermal interface material 26
7.1 radiator 26
7.1.1 The design of the radiator 26
7.1.1.1 radiator design process 26
7.1.1.2 General design requirements of the radiator 27
7.1.2 radiator installation requirements 27
7.2 heat pipe 27
7.2.1 Overview 27
Applications 27 7.2.2 Heat Pipe
7.2.3 choose to install the heat pipe 27
7.3 thermal interface material 27
7.3.1 Overview 27
7.3.2 performance thermal interface materials and parameters 28
7.3.2.1 Thermal conductivity 28
7.3.2.2 Thermal resistance 28
7.3.2.3 Continuous use temperature 28
7.3.2.4 hardness and compressibility 28
7.3.2.5 Breakdown Voltage 28
7.3.3 types of thermal interface materials 28
8 Thermal test 28
8.1 The purpose of thermal testing 28
Content 8.2 Thermal test 28
29 8.3 Hot develop test programs
8.3.1 Test Environment 29
8.3.2 Select test point 29
8.4 Common Test Equipment 29
8.5 Installation position sensor 29
8.5.1 Test installation position of the device 29 when the surface temperature
8.5.2 installation location to test the air temperature at 30
PCB mounting position 8.5.3 test temperature of 31
8.5.4 Test installation position when the amplifier tube 31
Appendix A (informative) Thermal design used in the calculation 32
Thermo-physical properties of Annex B (informative) Material 36
Comparison of different types of heat pipes constituting Appendix C (informative) heat pipe 38
Kind and Annex D (informative) requirements for thermal interface materials 39
References 41
Foreword
This standard was drafted in accordance with GB/T 1.1-2009 given rules.
Please note that some of the content of this document may involve patents. Release mechanism of the present document does not assume responsibility for the identification of these patents.
The standard electrical and electronic equipment by the National Standardization Technical Committee integrated structure (SAC/TC34) and focal points.
This standard was drafted. ZTE, Beijing Sifang Automation Co., Ltd., Huawei Technologies Co.,
State Grid Electric Power Research Institute, Nanjing NARI-RELAYS Electric Co., Ltd., XJ Electric Co., Ltd., Guodian Nanjing Automation Co. Shares
The company, China Shipbuilding Industry Corporation seventh fifteen Institute, FiberHome, Port cabinet Jiangsu days Ltd., Chi
Qi River State Electric Co., million-controlled Group Co., Ltd. Tianjin Electric originals.
The main drafters of this standard. Xue Song, King Besthope, Zhangkai Guo Tian Heng, Zhang real, Zhang Yu, Yin Donghai, Guo Yulong, Wang Wei, Song Xiaojun, Aijun,
Zhuyun Xiao Wu Bei, Pang Haiou, Yuan Fenghua, swim Han Tao, Wu Jue, Jiang Guoqing, Magui Chang, Shen with chapters.
Electrical and electronic equipment mechanical structure
Thermal design specifications
1 Scope
This standard specifies the basic principles of electrical and electronic equipment, machinery for thermal design, thermal design requirements, commonly used cooling technology, the key to cooling unit
Parts, thermal interface materials and related requirements for thermal testing, and describes the physical parameters of the thermal design of algorithms and materials commonly used in the Appendix.
This standard applies to all electrical and electronic equipment thermal design of mechanical structures except handheld devices. The following electrical and electronic equipment referred to as "setting
Preparation of "electrical and electronic equipment mechanical structure referred to as" mechanical structure. "
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein
Member. For undated references, the latest edition (including any amendments) applies to this document.
GB 3095 Ambient Air Quality Standard
GB 3096 acoustic environment quality standards
GB 4943.1-2011 Safety of information technology equipment - Part 1. General requirements
GB/T 14295-2008 Air Filter
YD/T 1821-2008 communications center room environmental conditions
ETS300119-5 equipment engineering; standard equipment for the European Telecommunications practical application; fifth part. Thermal Management (Environmental
Engineering (EE); EuropeanTelecommunicationStandardforEquipmentPractice; Part 5. Thermal
Management)
GR-63 Network Equipment Building System Requirements. Physical protection (NetworkEquipment-BuildingSystemRequire-
ment. PhysicalProtection)
ASTMD54701) Standard Test Method (StandardTestMethodfor heat transfer characteristics of thermal conductivity of electrically insulating material
ThermalTransmissionPropertiesofThermalyConductiveElectricalInsulationMaterials)
1) ASTM. AmericanSocietyforTestingandMaterials, American Society for Testing and Materials.
3 Terms and Definitions
The following terms and definitions apply to this document.
3.1
Temperature gradient temperaturegradient
Wait isothermal surface normal direction, temperature change amount per unit length.
3.2
Heat flow heattransferrate
Heat transfer unit of time on the road calories.
3.3
Thermal thermalresistance
Divided by the temperature difference between hot hot road traffic.
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