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GB/T 3131-2020 English PDF

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GB/T 3131-2020: Tin-lead solder
Status: Valid

GB/T 3131: Evolution and historical versions

Standard IDContents [version]USDSTEP2[PDF] delivered inStandard Title (Description)StatusPDF
GB/T 3131-2020English319 Add to Cart 4 days [Need to translate] Tin-lead solder Valid GB/T 3131-2020
GB/T 3131-2001English479 Add to Cart 3 days [Need to translate] Tin-lead solder Obsolete GB/T 3131-2001
GB/T 3131-1988EnglishRFQ ASK 3 days [Need to translate] Tin-lead solder Obsolete GB/T 3131-1988
GB/T 3131-1982EnglishRFQ ASK 3 days [Need to translate] Tin-lead solder Obsolete GB/T 3131-1982

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Basic data

Standard ID GB/T 3131-2020 (GB/T3131-2020)
Description (Translated English) Tin-lead solder
Sector / Industry National Standard (Recommended)
Classification of Chinese Standard H62
Classification of International Standard 77.150.60
Word Count Estimation 17,114
Date of Issue 2020-09-29
Date of Implementation 2021-08-01
Older Standard (superseded by this standard) GB/T 3131-2001
Regulation (derived from) National Standard Announcement No. 20 of 2020
Issuing agency(ies) State Administration for Market Regulation, China National Standardization Administration

GB/T 3131-2020: Tin-lead solder

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Tin-lead solder ICS 77.150.60 H62 National Standards of People's Republic of China Replace GB/T 3131-2001 Tin-lead solder 2020-09-29 released 2021-08-01 implementation State Administration for Market Regulation Issued by the National Standardization Management Committee

Foreword

This standard was drafted in accordance with the rules given in GB/T 1.1-2009. This standard replaces GB/T 3131-2001 "Tin-Lead Solder". Compared with GB/T 3131-2001, the main technology except for editorial changes The changes are as follows. ---Modified the impurity element content in the AA grade tin-lead solder grades, the Sb content was revised from ≤0.05% to ≤0.030%, and the Fe content Modified from ≤0.02% to ≤0.010%, As content from ≤0.015% to ≤0.010%, Cu content from ≤0.03% ≤0.020% (see Table 3, Table 3 of the.2001 edition); ---Modified the silver content in some grades. the silver content in S-Sn5PbAgAA was changed from 1.0%~2.0% to 2.3%~ 2.7%; the silver content in the grade S-Sn63PbAgAA was revised from 1.5%~2.5% to 1.8%~2.2% (see Table 3,.2001 Edition of Table 3); ---Deleted the grades "S-Sn65PbAA, S-Sn65PbA, S-Sn65PbB" (see Table 3, Table 4, Table 5, Table 3,.2001 edition Table 4, Table 5); --- Deleted the "summary of impurities except Sb, Bi, Cu" in all grades (see Table 3, Table 4, Table 5,.2001 edition of the table 3.Table 4, Table 5); ---Added the brands S-Sn43PbBiAA, S-Sn43PbBiA, S-Sn43PbBiB", "S-Sn58PbAgAA, S-Sn58PbAgA, S-Sn58PbAgB, Sn55PbBiAA (see Table 3, Table 4, Table 5); ---Modified the number of writing digits for the limit value of each element content, and all the effective digits are written (see Table 3, Table 4, Table 5,.2001 edition Table 3, Table 4, Table 5); ---Modified the S content. the S content in the grade A tin-lead solder grade was changed from ≤0.015% to ≤0.012%; the grade B tin-lead solder grade The content of S in the medium is changed from ≤0.020% to ≤0.015% (see Table 4 and Table 5, and Table 4 and Table 5 in the.2001 edition); ---Modified the Sn content range in the grade B tin-lead solder grades to ±1% (see Table 5, Table 5 of the.2001 edition); ---Increase the allowable deviation of the diameter of < 0.3mm tin wire (see Table 6); ---Deleted the regulation of rosin in flux (see 3.5.1 of.2001 edition); ---Modified the content of resin core flux (see Table 7, Table 7 of the.2001 edition); ---Modified the characteristics of the flux (see 4.3.2, 3.5.3 of the.2001 edition). This standard was proposed by China Nonferrous Metals Industry Association. This standard is under the jurisdiction of the National Nonferrous Metals Standardization Technical Committee (SAC/TC243). Drafting organizations of this standard. Zhejiang Yatong Welding Materials Co., Ltd., Hangzhou Youbang Soldering Materials Co., Ltd., Guangdong Zhongshi Metal Co., Ltd., Shenzhen Xinghongtai Tin Co., Ltd., Dongguan Qiandao Metal Tin Co., Ltd., Yunnan Tin Tin Co., Ltd., Kunshan Chengli Soldering Manufacturing Co., Ltd. The main drafters of this standard. Shi Lei, Feng Bin, Cui Liang, Xia Weidong, Fang Xibo, Xing Biyuan, Huang Yirong, Bai Hailong, Sun Biao, Su Chuanmeng, Liu Ping. The previous versions of the standard replaced by this standard are as follows. ---GB/T 3131-1988, GB/T 3131-2001. Tin-lead solder

1 Scope

This standard specifies the classification and marking, technical requirements, test methods, inspection rules, marking, packaging, transportation, storage and quality of tin-lead solder. Quantity certificate and purchase order (or contract) content. This standard applies to tin-lead solder used for welding in electrical and electronic equipment, communication equipment and other machinery manufacturing.

2 Normative references

The following documents are indispensable for the application of this document. For dated reference documents, only the dated version applies to this article Pieces. For undated references, the latest version (including all amendments) applies to this document. GB/T 2828.1 Sampling inspection procedure by attributes Part 1.Batch inspection sampling plan retrieved by acceptance quality limit (AQL) GB/T 8170 Numerical rounding rules and the expression and determination of limit values GB/T 10574.1-2003 Tin-lead solder chemical analysis method Determination of tin content GB/T 10574.2-2003 Tin-lead solder chemical analysis method Determination of antimony content GB/T 10574.3-2003 Tin-lead solder chemical analysis method Determination of bismuth content GB/T 10574.4-2003 Tin-lead solder chemical analysis method Determination of iron content GB/T 10574.5-2003 Tin-lead solder chemical analysis method Determination of arsenic content GB/T 10574.6-2003 Tin-lead solder chemical analysis method determination of copper content GB/T 10574.7-2017 Tin-lead solder chemical analysis methods Part 7.Determination of silver content Flame atomic absorption spectrometry and Potassium thiocyanate potentiometric titration GB/T 10574.8-2017 Tin-lead solder chemical analysis methods Part 8.Determination of zinc content Flame atomic absorption spectrometry GB/T 10574.9-2017 Tin-lead solder chemical analysis methods Part 9.Determination of aluminum content Electrothermal atomic absorption spectrometry GB/T 10574.10-2017 Tin-lead solder chemical analysis methods Part 10.Determination of cadmium content Flame atomic absorption spectrometry And Na2EDTA titration GB/T 10574.11-2017 Tin-lead solder chemical analysis methods Part 11.Determination of phosphorus content Crystal violet-phosphovanadium molybdenum heteropoly acid Spectrophotometry GB/T 10574.12-2017 Tin-lead solder chemical analysis method Part 12.Determination of sulfur content High frequency combustion infrared absorption light Spectroscopy GB/T 10574.13-2017 Tin-lead solder chemical analysis methods Part 13.Antimony, bismuth, iron, arsenic, copper, silver, zinc, aluminum, cadmium, phosphorus And gold content determination inductively coupled plasma atomic emission spectrometry GB/T 10574.14-2017 Tin-lead solder chemical analysis methods Part 14.Tin, lead, antimony, bismuth, silver, copper, zinc, cadmium and arsenic content Photoemission spectrometry GB/T 15829 Flux classification and performance requirements

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Answer: Yes. Unless special scenarios such as technical constraints or academic study, you should always prioritize to purchase the latest version GB/T 3131-2020 even if the enforcement date is in future. Complying with the latest version means that, by default, it also complies with all the earlier versions, technically.