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GB/T 23611-2023: Gold and gold alloy targets
Status: Valid GB/T 23611: Evolution and historical versions
| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| GB/T 23611-2023 | English | 189 |
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Gold and gold alloy targets
| Valid |
GB/T 23611-2023
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| GB/T 23611-2009 | English | 239 |
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Gold target
| Obsolete |
GB/T 23611-2009
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PDF similar to GB/T 23611-2023
Basic data | Standard ID | GB/T 23611-2023 (GB/T23611-2023) | | Description (Translated English) | Gold and gold alloy targets | | Sector / Industry | National Standard (Recommended) | | Classification of Chinese Standard | H68 | | Classification of International Standard | 77.150.99 | | Word Count Estimation | 10,135 | | Date of Issue | 2023-08-06 | | Date of Implementation | 2024-03-01 | | Older Standard (superseded by this standard) | GB/T 23611-2009 | | Issuing agency(ies) | State Administration for Market Regulation, China National Standardization Administration | GB/T 23611-2023: Gold and gold alloy targets---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 77.150.99
CCSH68
National Standards of People's Republic of China
Replace GB/T 23611-2009
Gold and gold alloy targets
Published on 2023-08-06
2024-03-01 Implementation
State Administration for Market Regulation
Released by the National Standardization Administration Committee
Foreword
This document complies with the regulations of GB/T 1.1-2020 "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents"
Custom drafting.
This document replaces GB/T 23611-2009 "Gold Target". Compared with GB/T 23611-2009, except for structural adjustments and editorial changes
In addition, the main technical changes are as follows.
a) Added a "Terms and Definitions" chapter (see Chapter 3);
b) Added AuGe and AuGeNi alloy target varieties (see 4.1.2);
c) Added structural form and supply status (see 4.1.4, 4.1.5);
d) Added technical requirements and test methods for AuGe and AuGeNi alloy targets (see 5.1 and 6.1);
e) Added the chemical composition list of gold targets (see 5.1);
f) Added target welding quality requirements (see 5.5);
g) The outer dimensions and allowable deviations of the gold target have been changed (see 5.6, 3.4 of the.2009 edition);
h) Added rectangular target dimensions and allowable deviation requirements (see 5.6).
Please note that some content in this document may be subject to patents. The publisher of this document assumes no responsibility for identifying patents.
This document is proposed by the China Nonferrous Metals Industry Association.
This document is under the jurisdiction of the National Nonferrous Metals Standardization Technical Committee (SAC/TC243).
This document was drafted by. Youyan Yijin New Materials Co., Ltd., Beijing Nonferrous Metals and Rare Earth Application Research Institute Co., Ltd., Guiyan Platinum Industry
Co., Ltd., Zijin Mining Group Gold Smelting Co., Ltd., Youyan Resources and Environmental Technology Research Institute (Beijing) Co., Ltd., Shenzhen Zhong
Chengda Applied Materials Technology Co., Ltd.
The main drafters of this document. Luo Yao, Lu Baoguo, Jiang Xuan, Wang Peng, Huang Xiaomeng, Dou Chengliang, Guan Jing, Luo Yuanhui, Duan Huaying, Liu Manmen, Zhu Wuxun,
Zhang Bohou, Lin Fengxian, Wu Weihuang, Huang Yongbiao.
This document was first published as GB/T 23611-2009 "Gold Target" in.2009, and this is the first revision.
Gold and gold alloy targets
1 Scope
This document stipulates the product classification, technical requirements, test methods, inspection rules and marking, packaging, transportation and storage of gold and gold alloy targets.
and accompanying documents and order form contents.
This document applies to gold and gold alloy targets for semiconductor electronic devices (hereinafter referred to as "targets").
2 Normative reference documents
The contents of the following documents constitute essential provisions of this document through normative references in the text. Among them, dated quotations
For undated referenced documents, only the version corresponding to that date applies to this document; for undated referenced documents, the latest version (including all amendments) applies to
this document.
GB/T 6394 Method for determination of average grain size of metals
GB/T 8651 Ultrasonic plate wave flaw detection method for metal sheets
GB/T 11066.1 Methods for chemical analysis of gold - Determination of gold content Fire assay
GB/T 11066.10 Methods for chemical analysis of gold - Determination of silicon content Molybdenum blue spectrophotometry
GB/T 11066.11 Methods for chemical analysis of gold - Part 11.Magnesium, chromium, manganese, iron, nickel, copper, palladium, silver, tin, antimony, lead and bismuth content
Determination by inductively coupled plasma mass spectrometry
GB/T 15077 Methods for measuring geometric dimensions of precious metals and their alloy materials
GB/T 25934 (all parts) Chemical analysis methods for high purity gold
YS/T 837 Ultrasonic inspection method for sputtering target-back plate bonding quality
3 Terms and definitions
The following terms and definitions apply to this document.
3.1
Target
In the cathode portion of sputter deposition technology, the cathode material is bombarded with positively charged cations in the form of molecules, atoms, or ions
separated from the cathode and deposited on the anode surface.
Note. The target material consists of target blank and backing plate.
3.2
target blank targrtblank
The material used as sputter material on the cathode.
3.3
backingplate
Material used to support or secure the target.
Note. The target blank and the backing plate can be connected by welding (such as brazing, electron beam welding, diffusion welding, etc.), mechanical compounding, bonding, etc.
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