YS/T 863-2025 PDF English
| Std ID | Version | USD | Buy | Deliver [PDF] in | Title (Description) |
| YS/T 863-2025 | English | RFQ | ASK | 3 days [Need to translate] | Copper profile for computer cooling systems |
| YS/T 863-2013 | English | 479 | Add to Cart | 3 days [Need to translate] | Copper profiles for computer heat sink |
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Basic data
| Standard ID | YS/T 863-2025 (YS/T863-2025) |
| Description (Translated English) | Copper profile for computer cooling systems |
| Sector / Industry | Nonferrous Metallurgy Industry Standard (Recommended) |
| Classification of Chinese Standard | H62 |
| Classification of International Standard | 77.150.30 |
| Date of Issue | 2025-04-10 |
| Date of Implementation | 2025-11-01 |
| Older Standard (superseded by this standard) | YS/T 863-2013 |
| Issuing agency(ies) | Ministry of Industry and Information Technology |
| Summary | This standard specifies the classification and marking, technical requirements, test methods, inspection rules, marking, packaging, transportation, storage, and accompanying documents and order form contents for copper profiles used in computer heat sinks. This document applies to copper profiles used in computer heat sinks. |
