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GB/T 39842-2021 English PDF

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GB/T 39842-2021: Integrated circuit (IC) card packaging framework
Status: Valid
Standard IDUSDBUY PDFLead-DaysStandard Title (Description)Status
GB/T 39842-2021409 Add to Cart 4 days Integrated circuit (IC) card packaging framework Valid

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Basic data

Standard ID: GB/T 39842-2021 (GB/T39842-2021)
Description (Translated English): Integrated circuit (IC) card packaging framework
Sector / Industry: National Standard (Recommended)
Classification of Chinese Standard: L56
Word Count Estimation: 22,243
Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration

GB/T 39842-2021: Integrated circuit (IC) card packaging framework

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Itegrated circuit (IC) card packaging framework ICS 31.200 L56 National Standards of People's Republic of China Integrated circuit (IC) card packaging frame Released on 2021-03-09 2021-07-01 implementation State Administration of Market Supervision and Administration Issued by the National Standardization Management Committee

Foreword

This standard was drafted in accordance with the rules given in GB/T 1.1-2009. Please note that some of the contents of this document may involve patents. Publication of this document The agency is not responsible for identifying these patents. This standard was proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This standard is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78). This standard was drafted. Shandong Xinhenghui Electronic Technology Co., Ltd. The main drafters of this standard. Zhu Lin, Shao Hanwen, Wang Guangnan, Chen Duo. Integrated circuit (IC) card packaging frame

1 Scope

This standard specifies the technical requirements, inspection methods, and inspection regulations for integrated circuit (IC) card packaging frameworks (hereinafter referred to as IC card packaging frameworks) Rules, packaging, storage and transportation. This standard applies to IC card packaging frames, including contact IC card packaging frames and non-contact IC card packaging frames.

2 Normative references

The following documents are indispensable for the application of this document. For dated reference documents, only the dated version applies to this article Pieces. For undated reference documents, the latest version (including all amendments) applies to this document. GB/T 2423.2 Environmental testing of electric and electronic products Part 2.Test method Test B. High temperature GB/T 2423.17 Environmental testing of electrical and electronic products Part 2.Test method Test Ka. Salt spray GB/T 2423.50 Environmental Test Part 2.Test Method Test Cy. Constant damp heat is mainly used for accelerated test of components GB/T 2423.51-2020 Environmental Test Part 2.Test Method Test Ke. Flowing Mixed Gas Corrosion Test GB/T 2828.1 Sampling inspection procedure by attributes Part 1.Batch inspection sampling plan retrieved by acceptance quality limit (AQL) GB/T 3922 Textile color fastness test Color fastness to perspiration GB/T 13557 Test method for flexible copper clad materials for printed circuits GB/T 16545-2015 Corrosion of metals and alloys. Removal of corrosion products on corrosion samples GB/T 16649.2 Identification Card IC Card with Contacts Part 2.Contact Size and Position GB/T 16921-2005 Metal coating layer thickness measurement X-ray spectrometry GB/T 17554.1 Identification Card Test Method Part 1.General Characteristic Test GB/T 25933-2010 high purity gold GB/T 25934-2010 (all parts) High-purity gold chemical analysis method GB/T 32642-2016 Method for measuring the surface roughness of flat panel display substrate glass

3 Terms and definitions

The following terms and definitions apply to this document. 3.1 IC card packaging framework ICcardpackagingframework It is laminated with insulating material and conductive material with patterns. It is a carrier to protect the chip and exchange information between the chip and external devices. Interface. Note. From the data transmission method, it can be divided into single interface contact IC card packaging frame, dual interface contact IC card packaging frame and non-contact IC card packaging frame. 3.2 Single-interface contact IC card packaging framework singlesideICcardpackagingframework The IC card packaging frame that can only exchange information with external devices can be realized by contact.
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