GB/T 39842-2021 English PDFUS$409.00 ยท In stock
Delivery: <= 4 days. True-PDF full-copy in English will be manually translated and delivered via email. GB/T 39842-2021: Integrated circuit (IC) card packaging framework Status: Valid
Basic dataStandard ID: GB/T 39842-2021 (GB/T39842-2021)Description (Translated English): Integrated circuit (IC) card packaging framework Sector / Industry: National Standard (Recommended) Classification of Chinese Standard: L56 Word Count Estimation: 22,243 Issuing agency(ies): State Administration for Market Regulation, China National Standardization Administration GB/T 39842-2021: Integrated circuit (IC) card packaging framework---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.Itegrated circuit (IC) card packaging framework ICS 31.200 L56 National Standards of People's Republic of China Integrated circuit (IC) card packaging frame Released on 2021-03-09 2021-07-01 implementation State Administration of Market Supervision and Administration Issued by the National Standardization Management Committee ForewordThis standard was drafted in accordance with the rules given in GB/T 1.1-2009. Please note that some of the contents of this document may involve patents. Publication of this document The agency is not responsible for identifying these patents. This standard was proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This standard is under the jurisdiction of the National Semiconductor Device Standardization Technical Committee (SAC/TC78). This standard was drafted. Shandong Xinhenghui Electronic Technology Co., Ltd. The main drafters of this standard. Zhu Lin, Shao Hanwen, Wang Guangnan, Chen Duo. Integrated circuit (IC) card packaging frame1 ScopeThis standard specifies the technical requirements, inspection methods, and inspection regulations for integrated circuit (IC) card packaging frameworks (hereinafter referred to as IC card packaging frameworks) Rules, packaging, storage and transportation. This standard applies to IC card packaging frames, including contact IC card packaging frames and non-contact IC card packaging frames.2 Normative referencesThe following documents are indispensable for the application of this document. For dated reference documents, only the dated version applies to this article Pieces. For undated reference documents, the latest version (including all amendments) applies to this document. GB/T 2423.2 Environmental testing of electric and electronic products Part 2.Test method Test B. High temperature GB/T 2423.17 Environmental testing of electrical and electronic products Part 2.Test method Test Ka. Salt spray GB/T 2423.50 Environmental Test Part 2.Test Method Test Cy. Constant damp heat is mainly used for accelerated test of components GB/T 2423.51-2020 Environmental Test Part 2.Test Method Test Ke. Flowing Mixed Gas Corrosion Test GB/T 2828.1 Sampling inspection procedure by attributes Part 1.Batch inspection sampling plan retrieved by acceptance quality limit (AQL) GB/T 3922 Textile color fastness test Color fastness to perspiration GB/T 13557 Test method for flexible copper clad materials for printed circuits GB/T 16545-2015 Corrosion of metals and alloys. Removal of corrosion products on corrosion samples GB/T 16649.2 Identification Card IC Card with Contacts Part 2.Contact Size and Position GB/T 16921-2005 Metal coating layer thickness measurement X-ray spectrometry GB/T 17554.1 Identification Card Test Method Part 1.General Characteristic Test GB/T 25933-2010 high purity gold GB/T 25934-2010 (all parts) High-purity gold chemical analysis method GB/T 32642-2016 Method for measuring the surface roughness of flat panel display substrate glass3 Terms and definitionsThe following terms and definitions apply to this document. 3.1 IC card packaging framework ICcardpackagingframework It is laminated with insulating material and conductive material with patterns. It is a carrier to protect the chip and exchange information between the chip and external devices. Interface. Note. From the data transmission method, it can be divided into single interface contact IC card packaging frame, dual interface contact IC card packaging frame and non-contact IC card packaging frame. 3.2 Single-interface contact IC card packaging framework singlesideICcardpackagingframework The IC card packaging frame that can only exchange information with external devices can be realized by contact. ......Tips & Frequently Asked Questions:Question 1: How long will the true-PDF of GB/T 39842-2021_English be delivered?Answer: Upon your order, we will start to translate GB/T 39842-2021_English as soon as possible, and keep you informed of the progress. The lead time is typically 2 ~ 4 working days. The lengthier the document the longer the lead time.Question 2: Can I share the purchased PDF of GB/T 39842-2021_English with my colleagues?Answer: Yes. 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