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JJF 1179-2007 English PDF

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JJF 1179-2007: Calibration Specification of High Temperature Dynamic IC Burn-in System
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JJF 1179-2007English389 Add to Cart 3 days [Need to translate] Calibration Specification of High Temperature Dynamic IC Burn-in System Valid JJF 1179-2007

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Basic data

Standard ID JJF 1179-2007 (JJF1179-2007)
Description (Translated English) Calibration Specification of High Temperature Dynamic IC Burn-in System
Sector / Industry Metrology & Measurement Industry Standard
Classification of Chinese Standard A56
Classification of International Standard 17.220
Word Count Estimation 15,138
Date of Issue 6/14/2007
Date of Implementation 2007-09-14
Quoted Standard GB/T 5170.1-1995; GB/T 5170.2-1996
Regulation (derived from) AQSIQ Announcement No. 95 of 2007
Issuing agency(ies) General Administration of Quality Supervision, Inspection and Quarantine
Summary This standard applies to IC high dynamic aging system calibration.

JJF 1179-2007: Calibration Specification of High Temperature Dynamic IC Burn-in System

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Calibration Specification of High Temperature Dynamic IC Burn-in System People's Republic of China National Metrology Technical Specifications IC temperature dynamic aging system calibration specifications Posted 2007-06-14 2007-09-14 implementation The State Administration of Quality Supervision, Inspection and Quarantine released IC temperature dynamic aging system Calibration Specification stem This specification by the State Administration of Quality Supervision, Inspection and Quarantine, 2007 June 14 ratification and From September 14, 2007 implementation. Focal point. the National Radio Technical Commission metering Drafted by. Ministry of Information Industry Institute of Electronics Industry Standardization The specification of the National Radio Technical Commission responsible for the interpretation of measurement The main drafters of this specification. Wang intoxicated (Information Industry, Ministry of Electronics Industry Standardization Institute) Wu Jingyan (Information Industry, Ministry of Electronics Industry Standardization Institute) Chen greatly (Information Industry, Ministry of Electronics Industry Standardization Institute) Drafters participate. Guoshou Jun (Guilin University of Electronic Science and Technology)

table of Contents

1 Scope (1) 2. Referenced Documents (1) 3 Overview (1) 4 Metrological characteristics (1) 4.1 Temperature Performance (1) 4.2 digital drive signal parameters (2) 4.3 analog drive signal parameters (2) 4.4 aging board device power parameters (2) Calibration Condition 5 (2) 5.1 environmental conditions (2) 5.2 calibration standards of measurement, instrumentation (2) 6 Calibration methods and calibration items (2) 6.1 device is working properly check (2) 6.2 high temperature calibration chamber (3) 6.3 digital drive signal characteristic parameter calibration unit (4) 6.4 analog drive signal characteristic parameter calibration unit (5) 6.5 Aging Area device supply voltage setting unit calibration (6) 7 statements calibration results (7) 8 Recalibration interval (7) Appendix A dynamic burn-in system IC temperature calibration certificate format (8) IC temperature dynamic aging system calibration specifications

1 Scope

This standard applies to integrated calibration temperature dynamic aging system.

2 Citations

GB/T 5170.1-1995 Environmental testing for electric and electronic test equipment basic parameters - General GB/T 5170.2-1996 Inspection methods for basic parameters of temperature Electrical test equipment and electronic products environmental testing equipment Note. When using this code, you should pay attention to using the currently valid version of the documents cited.

3 Overview

IC temperature dynamic aging system for integrated circuit dynamic high temperature aging test, mainly by the control Part of the machine, high temperature chamber, the device power supply unit, a signal drive unit, etc., the system architecture is shown in Figure 1 Shown. Figure 1 integrated circuit temperature dynamic aging system structure diagram Aging system temperature chamber for providing integrated high temperature dynamic aging high temperature environment. That is the power supply unit Aging power, using two power mode, wherein an aging power supply enough power for providing a positive and negative voltage, Two aging power supply to a power source as the input reference integrated circuit device aging providing electrical specifications for the aging device source. Burn-in system is usually divided into three to four workspaces by four independent programmable devices provide electrical power for the entire system Source and signal power. Signal drive unit is integrated dynamic aging core subsystems, its main function is through the main Computer programming control, resulting in a variety of chips required for aging to be analog, digital, and tri-state drive signal waveforms to meet Aging requirements of integrated circuit devices.

4 Metrological characteristics

4.1 Temperature Performance 4.1.1 temperature parameters Temperature range. 20 ℃ ~ 150 ℃;

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