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GB/T 15157.12-2011 English PDF

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GB/T 15157.12-2011: Connectors for frequencies below 3 MHz for use with printed boards -- Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits
Status: Valid
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GB/T 15157.12-2011English494 Add to Cart 4 days [Need to translate] Connectors for frequencies below 3 MHz for use with printed boards -- Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits Valid GB/T 15157.12-2011

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Basic data

Standard ID GB/T 15157.12-2011 (GB/T15157.12-2011)
Description (Translated English) Connectors for frequencies below 3 MHz for use with printed boards -- Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits
Sector / Industry National Standard (Recommended)
Classification of Chinese Standard L23
Classification of International Standard 31.220.10
Word Count Estimation 25,265
Date of Issue 2011-12-30
Date of Implementation 2012-07-01
Quoted Standard GB/T 1031-2009; GB/T 1360-1998; GB/T 5095.1-1997; GB/T 5095.2-1997; GB/T 5095.3-1997; GB/T 5095.4-1997; GB/T 5095.5-1997; GB/T 5095.6-1997; GB/T 5095.7-1997; GB/T 5095.8-1997; IEC 60191-2-1966
Adopted Standard IEC 60603-12-1992, IDT
Regulation (derived from) Announcement of Newly Approved National Standards No. 23 of 2011
Issuing agency(ies) General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China, Standardization Administration of the People's Republic of China
Summary This standard specifies the dual in-line IC (see IEC 60191-2: 1966 the provisions, such as A-50) socket dimensions, general requirements and test methods. This section applies to the end having a through board plugged into an outlet intended for compliance GB/T 1360-1998 provided a basic grid of 2. 54mm (0. 1in) of the PCB. This section does not include testing Aging outlet.

GB/T 15157.12-2011: Connectors for frequencies below 3 MHz for use with printed boards -- Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits



---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Connectors for frequencies below 3 MHz for use with printed boards Part 12. Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits ICS 31.220.10 L23 National Standards of People's Republic of China Frequencies below 3MHz PCB connector Part 12. IC socket size, General requirements and test methods detailed specifications Part 12. Detailspecificationfordimensions, generalrequirementsandtestsfora (IEC 60603-12.1992, IDT) Issued on. 2011-12-30 2012-07-01 implementation Administration of Quality Supervision, Inspection and Quarantine of People's Republic of China Standardization Administration of China released

Table of Contents

Introduction Ⅲ 1 Scope 1 2 Normative references 1 3 IEC type designation 2 4 Common features 2 Size 3 5 6 Characteristics 4 7 7 test schedule 8 has a plate inserted through the end of welding DIP socket (standard) 11 9 has a plate inserted through the non-welded wire wrap terminations of DIP socket (standard) 13 10 has a plate inserted through the end of welding DIP socket (small shell type) 14 11 has a plate inserted through the non-welded wire wrap terminations of DIP socket (small shell type) 16 12 foot contact retention force standard gauge 17 13 standard gauge socket 18

Foreword

GB/T 15157 "for frequencies below 3MHz Printed board connectors" is divided into 14 parts. --- Part 1. Generic specification - General requirements and preparation of detail specifications, with assessed quality guidelines --- Part 2. Evaluation of quality with common mounting features basic grid of 2.54mm (0.1in) of PCB with two formula Detail specification --- Part 3. contact center spacing and terminations center staggered pitch of 2.54mm are two connectors Details specification --- Part 4. contact center spacing and terminations center staggered pitch of 1.91mm are two connectors Details specification --- Part 5. pitch of 2.54mm double-sided PCB fork socket connector and two connectors detailed specification --- Part 6. nominal thickness of 1.6mm or double-sided PCB with contact pitch of 2.54mm cutlery socket PCB connectors and connector detail specification --- Part 7. having a common mating features eight fixed and free connectors with assessed quality Detail specification --- Part 8. There is 0.63mm × 0.63mm square male contacts basic grid of 2.54mm two-piece printed circuit board connectors Detail specification --- Part 9. basic grid of 2.54mm of the back panel and cable connectors, two-piece PCB connector detail specification --- Part 10. Direction of a basic grid of 2.54mm two-piece PCB connector detail specification --- Part 11. Detail specification for coaxial connector (free connectors and fixed connectors size) --- Part 12. Dimensions of the IC socket, general requirements and test methods for detailed specifications --- Part 13. Freedom connector insulation displacement terminals for non-assessed quality of basic grid of the two-piece 2.54mm PCB connector detail specification --- Part 14. Audio, video and audio-visual equipment detailed specification for audio and video low circular connectors This part of GB/T 15157 "for frequencies below 3MHz Printed board connectors" Part 12. This section drafted in accordance with GB/T 1.1-2009 given rules. This section identical with IEC 60603-12.1992 "for frequencies below 3MHz Printed board connectors - Part 12. Integrated circuit plug Block dimensions, general requirements and test methods for detailed specifications. " This part of IEC 60603-12.1992 made the following editorial changes. a) Remove IEC 60603-12.1992 in the preface. b) increase the GB/T 5095.1-1997 and GB/T 5095.8-1997 in reference file. This part is proposed by the Ministry of Industry and Information Technology of the People's Republic of China. This section is under the jurisdiction of the National electronic equipment Electromechanical components for Standardization Technical Committee (SAC/TC166). This section was drafted by. China Electronics Standardization Institute, Zhejiang Changxing Electronics Factory, Xiamen Maishi Electric Co., Shenzhen City Electric Co., Ltd. Ruisong. The main drafters of this section. Austrian Chen, Cao Hongguo, Luo Xiaoqing, Zheng Kun and, He Shuhui, Wang Qilong. Frequencies below 3MHz PCB connector Part 12. IC socket size, General requirements and test methods detailed specifications

1 Scope

This section provides dual in-line integrated circuit (see IEC 60191-2. 1966 provisions, such as A-50) socket sizes, generally Sum test methods. Socket includes a standard type (see Figures 6 and 7) and a small housing type (see Fig. 8 and 9). This section applies to the receptacle having a predetermined plate insertion through terminations for compliance with GB/T 1360-1998 for the provision of basic grid 2.54mm (0.1in) PCB. Small shell socket can be side to side and end to end mounted on a 2.54mm (0.1in) Grid. This section does not include a test Burn outlet.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein Member. For undated references, the latest edition (including any amendments) applies to this document. GB/T 1031-2009 Geometrical product specifications surface contour method (GPS) Surface texture roughness parameters and their values GB/T 1360-1998 printed circuit grid system (idt IEC 60097.1991) GB/T 5095.1-1997 electronic equipment - Basic testing procedures and measuring methods - Part Electromechanical components 1. General (Idt IEC 60512-1.1994) GB/T 5095.2-1997 electronic equipment - Basic testing procedures and measuring methods Electromechanical components - Part 2. General examination, electrical Continuity and contact resistance tests, insulation tests and voltage stress test (idt IEC 60512-2.1994) GB/T 5095.3-1997 electronic equipment - Basic testing procedures and measuring methods - Electromechanical components - Part 3. Current - carrying capacity test Test (idt IEC 60512-3. 1976) GB/T 5095.4-1997 electronic equipment - Basic testing procedures and measuring methods - Electromechanical components - Part 4. Dynamic stress test Test (idt IEC 60512-4. 1976) GB/T 5095.5-1997 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 5. Impact tests (Free components), static load tests (fixed components), endurance tests and overload tests (idt IEC 60512-5.1992) GB/T 5095.6-1997 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 6. Climatic tests and Soldering tests (idt IEC 60512-6. 1984) GB/T 5095.7-1997 electronic equipment - Basic testing procedures and measuring methods Electromechanical components - Part 7. Mechanical operating test Test and tightness test (idt IEC 60512-7.1993) GB/T 5095.8-1997 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 8. Connector contact And terminations of mechanical tests (idt IEC 60512-8.1993) IEC 60191-2. Mechanical standardization of semiconductor devices - Part 21966. Dimension (Mechanicalstandardizationof semiconductordevices-Part 2. Dimensions)

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