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YS/T 93-2015: Paste soft solder specification YS/T 93: Evolution and historical versions
| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | Status | PDF |
| YS/T 93-2015 | English | 529 |
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Paste soft solder specification
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YS/T 93-2015
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| YS/T 93-1996 | English | 359 |
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Code for paste soft solder
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YS/T 93-1996
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PDF similar to YS/T 93-2015
Basic data | Standard ID | YS/T 93-2015 (YS/T93-2015) | | Description (Translated English) | Paste soft solder specification | | Sector / Industry | Nonferrous Metallurgy Industry Standard (Recommended) | | Classification of Chinese Standard | H68 | | Classification of International Standard | 77.150.99 | | Word Count Estimation | 15,135 | | Date of Issue | 2015-04-30 | | Date of Implementation | 2015-10-01 | | Older Standard (superseded by this standard) | YS/T 93-1996 | | Quoted Standard | GB/T 1480; GB/T 3260.1; GB/T 3260.2; GB/T 3260.3; GB/T 3260.4; GB/T 3260.5; GB/T 3260.6; GB/T 3260.7; GB/T 3260.8; GB/T 3260.9; GB/T 3260.10; GB/T 10574.1; GB/T 10574.2; GB/T 10574.3; GB/T 10574.4; GB/T 10574.5; GB/T 10574.6; GB/T 10574.7; GB/T 10574.8; GB/T 10574.9; GB/T 10574.10; GB/T 10574.11; GB/T 10574.12; GB/T 10574.13; GB/T 15072.1; GB/T 15072.2; GB/T 15072.3; GB/T 15072.4; GB/T 15072.5; GB/T 15072.6; GB/T 15072.7; GB/T 15072.8; GB/T 15072.9; GB/T 15072.10; GB/T 15072.11; GB/T 15072.12; GB/T 15072.13; GB/T 15072.14; GB/T 15072.15; GB/T 15072.16; GB/T 15072.17; GB/T 15072.18; GB/T 15072.19; GB/T 15829; GJB 950A | | Regulation (derived from) | Ministry of Industry and Information Technology Announcement (2015 No. 28) | | Issuing agency(ies) | Ministry of Industry and Information Technology | | Summary | This Standard specifies the solder cream (referred to paste) requirements, test methods, inspection rules and signs, packaging, transportation, storage, quality certificate and purchase order (or contract) and so on. This Standard applies to a melting temperature lower than 427 �� solder paste. | YS/T 93-2015: Paste soft solder specification---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Paste soft solder specification
ICS 77.150.99
H68
People's Republic of China Nonferrous Metals Industry Standard
Replacing YS/T 1993-1996
Solder paste specifications
Issued on. 2015-04-30
2015-10-01 implementation
Ministry of Industry and Information Technology of the People's Republic of China released
Foreword
This standard was drafted in accordance with GB/T 1.1-2009 given rules.
Instead of the standard YS/T 93-1996 "solder paste specifications." Compared with this standard YS/T 93-1996, have the following main
change.
--- Increased S-Sn99.0Ag0.3Cu0.7, S-Sn95.0Sb5.0 two lead-free solder and other brands;
--- Increased S-In52.0Sn48.0, S-In97.0Ag3.0 grade indium-based solder;
--- Increased S-Au80.0Sn20.0, S-Au88.0Ge12.0 low grade precious metal solder.
This standard by the national non-ferrous metals Standardization Technical Committee (SAC/TC243) and focal points.
This standard is drafted by. Your research Platinum Ltd., China Nonferrous Metals Industry Standards and Metrology Institute for Quality.
Drafters of this standard. Xu Kun, to Lei, Li Wei, Zhu Wuxun, Luo Ximing, Liu Yi.
This standard replaces the standards previously issued as follows.
--- YS/T 93-1996.
Solder paste specifications
1 Scope
This specification defines the cream solder (solder paste for short) requirements, test methods, inspection rules and signs, packaging, transportation, storage, quality certificate
Specification and purchase order (or contract) and so on.
This instruction applies to a melting temperature lower than 427 ℃ solder paste.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein
Member. For undated references, the latest edition (including any amendments) applies to this document.
GB/T 1480 Determination of particle size metal powder dry sieving
GB/T 3260 (all parts), chemical analysis of tin
GB/T 10574 (all parts), chemical analysis of tin Method
GB/T 15072 (all parts), chemical analysis of precious metal alloys
GB/T 15829 solder agent classification and performance requirements
GJB950A (all parts), precious metals and their alloys trace element analysis method
3 Terms and Definitions
The following terms and definitions apply to this document.
3.1
Paste pastesolder
Modulated by the soldering and brazing flux powder made of a homogeneous mixture.
3.2
Active agent acticator
To improve one component welding brazing flux effect.
3.3
Wettability wetting
Molten solder spreading degree (base material) surface of the substrate.
3.4
Lead-free Lead-freesign flag
Used to designate lead-free solder paste signs with symbols as follows.
[IPC/JEDECJ-STD-609,4.2]
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