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YS/T 893-2013: High-purity sputtering titanium target used in electronic film
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| YS/T 893-2013 | English | 239 |
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High-purity sputtering titanium target used in electronic film
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YS/T 893-2013
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Basic data | Standard ID | YS/T 893-2013 (YS/T893-2013) | | Description (Translated English) | High-purity sputtering titanium target used in electronic film | | Sector / Industry | Nonferrous Metallurgy Industry Standard (Recommended) | | Classification of Chinese Standard | H64 | | Classification of International Standard | 77.150.50 | | Word Count Estimation | 9,967 | | Quoted Standard | GB/T 1031; GB/T 4698.7; GB/T 4698.14; GB/T 4698.15; GB/T 6394; GJB 1580A; YS/T 837; YS/T 891; YS/T 892 | | Regulation (derived from) | Ministry of Industry and Information Technology Bulletin No. 52, 2013; industry standard for filing Notice No. 1 of 2014 (No. 169 overall) | | Issuing agency(ies) | Ministry of Industry and Information Technology | | Summary | This standard specifies the electronic film sputtering target with a high titanium requirements, test methods, inspection rules and signs, packaging, transportation, storage and quality certificates and contracts (orders) and so on. This standard applies | YS/T 893-2013: High-purity sputtering titanium target used in electronic film---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
High-purity sputtering titanium target used in electronic film
ICS 77.150.50
H64
People's Republic of China Nonferrous Metals Industry Standard
Electronic film with high titanium sputtering target
Issued on. 2013-10-17
2014-03-01 implementation
Ministry of Industry and Information Technology of the People's Republic of China released
Foreword
This standard was drafted in accordance with GB/T 1.1-2009 given rules.
This standard by the National Standardization Technical Committee Nonferrous Metals (SAC/TC243) centralized.
This standard was drafted. Yes REVIEW billion of the new Materials Co., Ltd., Ningbo Jiang Feng Electronic Materials Co., Ltd.
The main drafters of this standard. He Jinjiang, Dong Ting Yi, Flaw, Luo Junfeng, Teng Haitao, Yu Jie, He Xin, money Hongbing, Chen Zhou, Liu Dan,
Luling Zhi, Wang Xueze, Xiong.
Electronic film with high titanium sputtering target
1 Scope
This standard specifies the electronic film was highly pure titanium sputtering target requirements, test methods, inspection rules and signs, packaging, transportation, storage and
Quality certification and contract (order) and so on.
This standard applies to all types of titanium sputtering targets used in the manufacture of electronic film.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein
Member. For undated references, the latest edition (including any amendments) applies to this document.
GB/T 1031 Geometrical product specifications (GPS) Surface texture Profile method Surface roughness parameters and their values
GB/sponge titanium, titanium and titanium alloys - oxygen, nitrogen determination of T 4698.7
GB/T 4698.14 Sponge titanium, titanium and titanium alloys - Determination of carbon contents
Determination of GB/T 4698.15 Sponge titanium, titanium and titanium alloys the amount of hydrogen
GB/T 6394 Determination of average grain size of metal
GJB1580A deformation of the metal ultrasonic inspection method
YS/T 837 sputtering targets - back binding quality ultrasonic inspection
Determination glow YS/T 891 high titanium chemical analysis of trace elements in the discharge mass spectrometry
Inductively coupled plasma mass spectrometry YS/T 892 high titanium chemical analysis of trace elements
3 Terms and Definitions
The following terms and definitions apply to this document.
3.1
Target target
In sputter deposition techniques cathode portion. The cathode material is positively charged cations Struck with molecules, atoms or ions form
Formula from the cathode and the anode surface deposition.
3.2
Target blanks targetblank
Used as a cathode sputtering material part.
3.3
Backplane backingplate
For supporting or part of a fixed target. Backplane can target blanks by welding (such as brazing, diffusion bonding, etc.), mechanical composite, bonding and other parties
Connection.
4 Requirements
4.1 Categories
4.1.1 According to the structure and form into a composite of the two monomers, shown in Figure 1.
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