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Std ID |
Description (Standard Title) |
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SJ/T 11776-2021
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(Harmonic protector)
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SJ/T 11777-2021
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(Technical requirements and measurement methods for the calibrator of the semiconductor tube characteristic diagram instrument)
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SJ/T 11778-2021
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(Safety requirements for lithium-ion batteries and battery packs for portable household appliances)
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SJ/T 11779-2021
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(Thermally conductive resin-coated copper foil for printed circuit)
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SJ/T 11780-2021
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(Energy consumption specification for push plate electronic ceramic tunnel kiln)
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SJ/T 11781-2021
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(Energy consumption specification for push-plate hydrogen furnace)
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SJ/T 11782-2021
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(Information system integration and service organization quality management norms)
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SJ/T 2660-2021
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(Test method of flux for soldering)
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SJ/T 11783-2021
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(Reference model of smart health care service platform)
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SJ/T 11784-2021
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(Classification and description of smart health care products)
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SJ/T 11785-2021
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(Technical requirements for health management wrist wearable devices)
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SJ/T 11786-2021
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(Technical requirements and test methods of smart watches for the elderly)
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SJ/T 11787-2021
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(General technical requirements for video cloud storage systems)
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SJ/T 11788-2021
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(Competence requirements for big data practitioners)
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SJ/T 11789-2021
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(Evaluation method of lead-free nozzle)
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SJ/T 11790-2021
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(Wheel steering test method)
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SJ 30036-2019
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(Security and confidentiality inspection requirements for military secret-related industrial control systems)
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SJ 30037-2019
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(Safety supervision and inspection procedures and requirements for scientific research and production of weapons and equipment)
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SJ 30038-2019
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(Safety risk classification requirements for weapons and equipment scientific research and production processes)
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SJ 30039-2019
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(General requirements for clarification of safety technology in scientific research and production of weapons and equipment)
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SJ 30040-2019
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(General rules for safety management of relevant parties in the scientific research and production of weapons and equipment)
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SJ 30041-2019
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(General requirements for safety control of guided munition assembly testing)
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SJ 21553-2020
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(Three-dimensional heterogeneous integrated fine-pitch micro-bump production technology requirements)
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SJ 21554-2020
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(Process control requirements for back drilling of printed boards)
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SJ 21555-2020
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(Test method for signal transmission loss of high-speed circuit on printed circuit board)
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SJ 21556-2020
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(Traceability Control Requirements for Military Printed Board Manufacturing Process)
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SJ 21557-2020
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(X-ray non-destructive testing methods for printed boards)
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SJ 21558-2020
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(Stirling refrigerator micro-vibration test method)
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SJ 21559-2020
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(Stirling Refrigerator Design Guide)
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SJ 21560-2020
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(General specification for superconducting filters)
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SJ 21561-2020
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(CIC Solar Cell Specification for Space)
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SJ 21562-2020
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(Specification for lanthanum gallium tantalate piezoelectric crystal)
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SJ 21563-2020
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(Military radio frequency cable assembly processing requirements)
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SJ 21564-2020
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(Military electronics assembly bonding process requirements)
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SJ 21565.1-2020
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(Hydrogen control requirements for microwave multi-chip components Part 1: General)
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SJ 21565.2-2020
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(Hydrogen control requirements for microwave multi-chip modules Part 2: Test method for hydrogen release)
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SJ 21566-2020
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(Augmented reality (AR) data requirements for assembly and maintenance of military electronic equipment)
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SJ 21567-2020
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(Augmented reality (AR) assembly requirements for assembly and maintenance of military electronic equipment)
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SJ/Z 21568-2020
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(Electromagnetic compatibility design guide for special aircraft mission electronic systems)
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SJ/Z 21569-2020
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(Reliability Design Guidelines for Military Wireless Communication Systems)
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SJ/Z 21570-2020
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(Maintainability Design Guide for Military Wireless Communication System)
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SJ/Z 21571-2020
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(Testability Design Guide for Military Wireless Communication System)
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SJ/Z 21572-2020
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(Security Design Guidelines for Military Wireless Communication Systems)
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SJ/Z 21573-2020
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(Design Guidelines for Electromagnetic Compatibility of Military Wireless Communication Systems)
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SJ/Z 21574-2020
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(Guide to Modeling and Simulation of Military Radar Information Processing System)
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SJ/Z 21575-2020
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(Radar Admission Terminal Environmental Adaptability Design Guide)
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SJ/Z 21576-2018
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(Command Information System Software Testability Design Guide)
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SJ/Z 21577-2020
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(Design Guidelines for Testability of Military Hardened Computers)
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SJ/Z 21578-2020
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(Military rugged computer electromagnetic compatibility design guide)
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SJ/Z 21579-2020
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(Design Guide for Maintainability of Military Hardened Computers)
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SJ/Z 21580-2018
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(Implementation Guide for Statistical Process Control Technology of Semiconductor Discrete Devices)
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SJ/Z 21581-2020
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(Implementation Guide for Statistical Process Control Technology of Solid State Relay)
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SJ/Z 21582-2020
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(Implementation Guide for Statistical Process Control Technology for Tantalum Electrolytic Capacitors)
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SJ/Z 21583-2020
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(Implementation Guide for Statistical Process Control Technology of Ceramic Capacitors)
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SJ/Z 21584-2020
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(Implementation Guide for Statistical Process Control Technology of Chip Film Fixed Resistors)
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SJ/Z 21576-2020
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(Design Guidelines for Testability of Command Information System Software)
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SJ/Z 21580-2020
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(Implementation Guide for Statistical Process Control Technology of Semiconductor Discrete Devices)
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SJ/T 10348-2020
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Detail specification for electronic components. Surge suppression varistors. Type MYG2 zinc oxide varistors for use in over-voltage protection. Assessment level E
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SJ/T 10349-2020
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Detail specification for electronic components. Surge suppression varistors. Type MYG3 zinc oxide varistors for use in over-voltage protection. Assessment level E
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SJ/T 10454-2020
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Dielelectric paste for multilayer lay out of thick film hybrid integrated circuits
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SJ/T 10455-2020
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Copper conductor paste for thick film hybrid integrated circuits
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SJ/T 10567-2020
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Detail specification for electronic components. Fixed capacitors of ceramic dielectric, type CC2. Assessment level EZ
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SJ/T 10568-2020
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Detail specification for electronic components. Fixed capacitor of ceramic dilectric, type CT2. Assessment level EZ
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SJ/T 10785-2020
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Detail specification for electronic component. Fixed polyethylene terephthalate film dielectric metal foil d. c. capacitors, type CL10. Assessment level EZ
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SJ/T 10786-2020
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Detail specification for electronic component. Fixed polyethylene-terephthalate film dielectric metal foil d. c. capacitors, type CL11. Assessment level EZ
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SJ/T 10787-2020
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Detail specification for electronic component. Fixed polyethylene-terephthalate film dielectric metal foil d. c. capacitors，type CL 12. Assessment level EZ
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SJ/T 10856-2020
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Detail specification for electronic components Type CA42 fixed Tantalum capacitors with solid electrolyte Assessment level E
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SJ/T 10874-2020
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Detail specification for electronic component. Fixed metallized polyethylene-terephthalate film d. c. capacitors, type CL21. Assessment level EZ
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SJ/T 10875-2020
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Detail specification for electronic components. Capacitors of disc feed-through ceramic dielectric, type CC52. Assessment level EZ
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SJ/T 10876-2020
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Detail specification for electronic components. Capacitors of disc feed-through ceramic dielectric, type CT52. Assessment level EZ
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SJ/T 10943-2020
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Test method for granulometric distribution of alundum powder for vacuum tubes. Density balance method
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SJ/T 10998-2020
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Detail specification for electronic component. Fixed polypropylene film dielectric metal foil d. c. capacitors, type CBB 13. Assessment level EZ
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SJ/T 11755--2020
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(General specification for zinc-nickel batteries)
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SJ/T 11757-2020
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(General specification for lithium-ion batteries and battery packs for portable household appliances)
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SJ/T 11758-2020
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(LED chip performance specification for LCD backlight assembly)
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SJ/T 11759-2020
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(Measurement of the height-to-width ratio of the grid lines of photovoltaic cells by laser scanning confocal microscopy)
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SJ/T 11760-2020
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(Photoelectric integration method for measuring the reflectivity of the textured surface of photovoltaic cells)
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SJ/T 11761-2020
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(Specification for loading ports of semiconductor equipment for wafers of 200mm and below)
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SJ/T 11762-2020
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(Semiconductor equipment manufacturing information marking requirements)
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SJ/T 11763-2020
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(Man-machine interface specification for semiconductor manufacturing equipment)
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SJ/T 11765-2020
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(Testing method for low frequency noise parameters of transistors)
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SJ/T 11766-2020
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(Testing method for power consumption and noise parameters of photoelectric coupling device)
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SJ/T 11767-2020
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(Diode power noise parameter test method)
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SJ/T 11768-2020
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(Low-frequency noise parameter test method for resistors)
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SJ/T 11769-2020
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(General requirements for testing methods of low-frequency noise parameters of electronic components)
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SJ/T 11770-2020
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(Technical Specification for Evaluation of Green Design Products Microcomputer)
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SJ/T 11771-2020
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(Technical Specification for Evaluation of Green Design Products)
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SJ/T 11772-2020
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(Evaluation of enterprise cloud effect)
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SJ/T 1542-2020
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Method for chemical analysis of nickel and nickel alloy for vacuum tubes
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SJ/T 1543-2020
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Method for spectral analysis of nickel and nickel aloy for vacuum tubes
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SJ/T 2307.1-2020
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Detail specification for electronic components. Surge suppression varistors. Type MYL1 zinc oxide varistors for use in lightning arrester. Assessment level E
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SJ/T 10551-2021
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(Emission spectrum analysis method of impurities in aluminum oxide for electronic ceramics)
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SJ/T 10552-2021
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(Emission spectrum analysis method of impurities in titanium dioxide for electronic ceramics)
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SJ/T 10553-2021
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(Emission spectrum analysis method of impurities in zirconium dioxide for electronic ceramics)
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SJ/T 11457.1.3-2021
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(Waveguide type dielectric resonators-Part 1-3: Comprehensive information and test conditions-Measurement methods for the complex relative permittivity of dielectric resonator materials in the microwave frequency band)
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SJ/T 11457.1.4-2021
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(Waveguide-type dielectric resonators-Part 1-4: Comprehensive information and test conditions-Measuring method of the complex relative permittivity of dielectric resonator materials in the millimeter wave frequency band)
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SJ/T 11460.3.3.1-2021
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(Backlight assemblies for liquid crystal displays-Part 3-3-1: Detailed specifications for direct-lit LED backlight assemblies for television receivers)
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SJ/T 11773-2021
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(Semiconductor integrated circuit stamping type lead frame)
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SJ/T 11774-2021
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(Technical specification for silver electroplating of integrated circuit lead frame)
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SJ/T 11775-2021
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(Multi-wire cutting machine for semiconductor materials)
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