Std ID |
Description (Standard Title) |
SJ 50033/182-2018
|
(Semiconductor discrete devices 3CK3250, 3CK3250UB silicon PNP high frequency low power switching transistors detailed specifications)
|
SJ 50033/183-2018
|
(Semiconductor discrete devices 3CK3251, 3CK3251UB silicon PNP high frequency small power switching transistors detailed specifications)
|
SJ 50033/184-2018
|
(Semiconductor discrete devices 3CK4033, 3CK4033UA, 3CK4033UB silicon PNP high frequency small power switching transistors detailed specifications)
|
SJ 50033/185-2018
|
(Semiconductor discrete devices 3CK5415, 3CK5415U8, 3CK5415UA type silicon PNP high frequency small power switching transistors detailed specifications)
|
SJ 50033/186-2018
|
(Semiconductor discrete devices 3DK2222, 3DK2222UA, 3DK2222UB silicon NPN high frequency small power switching transistors detailed specifications)
|
SJ 50033/187-2018
|
(Semiconductor discrete devices 3CA3741, 3CA3741U1 silicon PNP high-frequency high-power switching transistors detailed specifications)
|
SJ 50033/188-2018
|
(Semiconductor discrete devices 3CA4931, 3CA4931U8 silicon PNP high frequency high power transistor detailed specifications)
|
SJ 50033/189-2018
|
(Semiconductor discrete devices 3CK3634, 3CK3634UB silicon PNP high-frequency high-power switching transistors detailed specifications)
|
SJ 50033/190-2018
|
(Semiconductor discrete devices 3CK3635, 3CK3635UB silicon PNP high-frequency high-power switching transistors detailed specifications)
|
SJ 50033/191-2018
|
(Semiconductor discrete devices 3CK3637, 3CK3637UB silicon PNP high-frequency high-power switching transistors detailed specifications)
|
SJ 50033/192-2018
|
(Semiconductor discrete devices 3CK3762, 3CK3762U8, 3CK3762UA type silicon PNP high-frequency high-power switching transistors detailed specifications)
|
SJ 50033/193-2018
|
(Semiconductor discrete devices 3CK3763, 3CK3763U8, 3CK3763UA type silicon PNP high-frequency high-power switching transistors detailed specifications)
|
SJ 50033/194-2018
|
(Semiconductor discrete devices 3CK5153, 3CK5153U3 silicon PNP high-frequency high-power switching transistors detailed specifications)
|
SJ 50033/195-2018
|
(Semiconductor discrete device 3DA5665 silicon NPN high frequency high power switching transistor detailed specifications)
|
SJ 50033/196-2018
|
(Semiconductor discrete devices 3DK5154, 3DK5154U3 silicon NPN high-frequency high-power switching transistors detailed specifications)
|
SJ/T 11180.2-2019
|
(Audio and audiovisual equipment Digital audio part Basic measurement methods of audio characteristics Part 2: Consumer applications)
|
SJ/T 11180.3-2019
|
(Audio and audiovisual equipment Digital audio section Basic measurement methods of audio characteristics Part 3: Professional applications)
|
SJ/T 11180.4-2019
|
(Audio and audiovisual equipment Digital audio part Basic measurement methods of audio characteristics Part 4: Microcomputer)
|
SJ/T 11186-2019
|
(General specification for solder paste)
|
SJ/T 11236-2020
|
(General technical specifications for anti-static plywood)
|
SJ/T 11265-2019
|
(Soft ferrite powder)
|
SJ/T 11389-2019
|
(Flux for lead-free soldering)
|
SJ/T 11390-2019
|
(Test method for lead-free solder)
|
SJ/T 11391-2019
|
(Tin alloy powder for welding electronic products)
|
SJ/T 11392-2019
|
(Lead-free solder chemical composition and form)
|
SJ/T 11460.3.4-2019
|
(LCD backlight assembly Part 3-4: Blank detail specification for automotive LED backlight assembly)
|
SJ/T 11460.3.5-2019
|
(LCD backlight assembly Part 3-5: Blank detail specification for LED backlight assembly for household appliances)
|
SJ/T 11460.3.6-2019
|
(Backlight assemblies for liquid crystal displays Part 3-6: Blank detail specification for LED backlight assemblies for industrial instruments)
|
SJ/T 11733-2019
|
(Detailed Specification of COB LED Blank)
|
SJ/T 11734-2019
|
(Detailed Specification of Chip Scale Package (CSP) LED Blank)
|
SJ/T 11735-2019
|
(Product Carbon Footprint Product Type Rules Portable Computer)
|
SJ/T 11736-2019
|
(Product Carbon Footprint Product Type Rules Desktop Microcomputer)
|
SJ/T 11737-2019
|
(Smart TV based on 2D camera gesture recognition technology requirements and measurement methods)
|
SJ/T 11738-2019
|
(Application model of anti-counterfeiting of bottled wine based on radio frequency identification)
|
SJ/T 11739-2019
|
(Information technology services Call center operation management requirements)
|
SJ/T 11740-2019
|
(Integrated circuit automatic plastic packaging system)
|
SJ/T 11741-2019
|
(Test method for flex resistance of flexible printed circuit materials)
|
SJ/T 11742-2019
|
(Thermally conductive non-prepreg prepreg for printed circuit)
|
SJ/T 11743.1-2019
|
(Piezoelectric and dielectric devices for frequency control and selection Terminology Part 1: Piezoelectric and dielectric resonators)
|
SJ/T 11743.2-2019
|
(Piezoelectric and dielectric devices for frequency control and selection Terminology Part 2: Piezoelectric and dielectric filters)
|
SJ/T 11743.3-2019
|
(Piezoelectric and dielectric devices for frequency control and selection Terminology Part 3: Piezoelectric and dielectric oscillators)
|
SJ/T 11743.4.1-2019
|
(Piezoelectric and dielectric devices for frequency control and selection Terminology Part 4-1: Materials Artificial quartz crystals)
|
SJ/T 11743.4.2-2019
|
(Piezoelectric and dielectric devices for frequency control and selection Terminology Part 4-2: Materials Piezoceramics)
|
SJ/T 11743.4.3-2019
|
(Piezoelectric and dielectric devices for frequency control and selection Terminology Part 4-3: Materials Materials for dielectric devices)
|
SJ/T 11743.4.4-2019
|
(Piezoelectric and dielectric devices for frequency control and selection Terminology Part 4-4: Materials Materials for surface acoustic wave devices)
|
SJ/T 11744-2019
|
(Guidelines for Green Factory Evaluation of Electronic Information Manufacturing)
|
SJ/T 11745-2019
|
(Technical specifications of ultra-high definition television)
|
SJ/T 11746-2019
|
(Ultra-high definition television display performance test method)
|
SJ/T 11747-2019
|
(Smart TV entertainment control coding rules and measurement methods)
|
SJ/T 11748-2019
|
(General specifications for broadcast-grade intelligent PTZ)
|
SJ/T 11749-2019
|
(Technical Specification for Green Design Product Evaluation Printers and All-in-Ones)
|
SJ/T 11750-2019
|
(Green Design Product Evaluation Technical Specifications Smart Terminal Tablet PC)
|
SJ/T 11751-2020
|
(Supply Chain Data Traceability System Data Interface Requirements)
|
SJ/T 11752-2020
|
(Data format requirements of supply chain QR code traceability system)
|
SJ/T 11753-2020
|
(Supply chain two-dimensional code traceability system identification rules)
|
SJ/T 11754-2020
|
(Information Technology Barcode Beta)
|
SJ/T 11755-2020
|
(General specification for zinc-nickel battery)
|
SJ/Z 21325-2018
|
(Ceramic Shell Design Guide)
|
SJ/Z 21467-2018
|
(Military Software Quality Measurement Implementation Guide for Onboard Software Functional Quality Measurement)
|
SJ/Z 21468-2018
|
(Military Software Quality Measurement Implementation Guide for Onboard Software Information Security Quality Measurement)
|
SJ/Z 21469-2018
|
(Military Software Quality Measurement Implementation Guide for On-board Software Maintenance Quality Measurement)
|
SJ/Z 21470-2018
|
(Military Software Quality Measurement Implementation Guide for Onboard Software Efficiency Quality Measurement)
|
SJ/Z 21471-2018
|
(Military Software Quality Metrics Weapon Launch Control Software Compatibility Quality Metrics Implementation Guide)
|
SJ/Z 21472-2018
|
(Military Software Quality Measurement Implementation Guide for Weapon Launch Control Software Portability Quality Measurement)
|
SJ/Z 21482-2018
|
(Commanding Information System Supportability Design Guide)
|
SJ/Z 21483-2018
|
(Command Information System Security Design Guidelines)
|
SJ/Z 21485-2018
|
(Military Embedded Computer Security Design Guide)
|
SJ/Z 21501-2018
|
(Radar Environmental Adaptability Design Guide)
|
SJ/Z 21502-2018
|
(Radar Electromagnetic Compatibility Design Guide)
|
SJ/Z 21503-2018
|
(Data link equipment environmental adaptability design guide)
|
SJ/Z 21504-2018
|
(Design Guidelines for Electromagnetic Compatibility of Electronic Countermeasure Systems)
|
SJ/Z 21537-2018
|
(Semiconductor integrated circuit statistical process control technology implementation guide)
|
SJ/Z 21538-2018
|
(Implementation Guide of Hybrid Integrated Circuit Statistical Process Control Technology)
|
SJ/Z 21539-2018
|
(Implementation guide of statistical process control technology for connectors for high-speed data processing)
|
SJ/Z 21540-2018
|
(High-speed cable assembly statistical process control technology implementation guide)
|
SJ 20434A-2020
|
(Mechanical interface of military communication electroacoustic device and equipment)
|
SJ 20534A-2020
|
(General Specification for Military Communication Cap)
|
SJ 20575A-2020
|
(General specification for ship sound reinforcement equipment)
|
SJ 20978.1A-2020
|
(Air Traffic Control System Surveillance Data Exchange Requirements Part 1: General Structure)
|
SJ 20978.2A-2020
|
(Air Traffic Control System Surveillance Data Exchange Requirements Part 2: Single Radar Service Information Transmission)
|
SJ 20978.3A-2020
|
(Air traffic control system surveillance data exchange requirements Part 3: Single radar meteorological information transmission)
|
SJ 20978.4A-2020
|
(Air Traffic Control System Surveillance Data Exchange Requirements Part 4: Single Radar Target Report Transmission)
|
SJ 20978.5A-2020
|
(Air traffic control system surveillance data exchange requirements Part 5: Single sensor surface activity data transmission)
|
SJ 20978.6A-2020
|
(Air Traffic Control System Surveillance Data Exchange Requirements Part 6: Broadcast Automatic Dependent Surveillance (ADS-B) Data Transmission)
|
SJ 20978.7A-2020
|
(Air Traffic Control System Surveillance Data Exchange Requirements Part 7: System Track Information Transmission)
|
SJ 20978.8A-2020
|
(Air traffic control system surveillance data exchange requirements Part 8: Surveillance data processing system status information transmission)
|
SJ 21494.10-2020
|
(Safety production standardization requirements for military electronics industry Part 10: Field test)
|
SJ 21494.11-2020
|
(Safety production standardization requirements for military electronics industry Part 11: Machining)
|
SJ 21494.12-2020
|
(Safety production standardization requirements for military electronics industry Part 12: Radiation operations)
|
SJ 21494.13-2020
|
(Safety production standardization requirements for military electronics industry Part 13: Power support equipment and facilities)
|
SJ 21494.14-2020
|
(Safety production standardization requirements for military electronics industry Part 14: Scientific research and production of pyrotechnics)
|
SJ 21494.8-2020
|
(Safety production standardization requirements for military electronics industry Part 8: Electroplating and printed board operations)
|
SJ 21494.9-2020
|
(Safety production standardization requirements of military electronics industry Part 9: Hazardous chemicals)
|
SJ 21546-2020
|
(Specification for laser leveling and flip-chip welding machine for infrared device manufacturing)
|
SJ 21547-2020
|
(Specification for automatic screen filling machine for infrared device manufacturing)
|
SJ 21548-2020
|
(Static strain test method of printed circuit board assembly)
|
SJ 21549-2020
|
(Data collection and management requirements for surface assembly of military electronic equipment)
|
SJ 21550-2020
|
(High-speed signal transmission performance test method of microelectronic package ceramic housing)
|
SJ 21551-2020
|
(General specification for high-power semiconductor laser chips)
|
SJ 21552-2020
|
(High-density functional substrate hybrid multi-layer integration process technical requirements)
|