| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | See Detail | Status | Related Standard |
| SJ/Z 21356-2018 | English | 399 |
Add to Cart
|
Days<=4
|
Design guidelines for flip chip bonding process of SiP products
|
SJ/Z 21356-2018
| Valid |
SJ/Z 21356-2018
|