| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | See Detail | Status | Related Standard |
| SJ/T 10454-1993 | English | 279 |
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Days<=3
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Dielectric paste for multilayer lay out of thick film hybrid integrated circuits
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SJ/T 10454-1993
| Obsolete |
SJ/T 10454-1993
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