| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | See Detail | Status | Related Standard |
| SJ 21600-2021 | English | 159 |
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Days<=3
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(Test method for X/Y axis thermal expansion coefficient of substrates for printed circuits - TMA method)
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SJ 21600-2021
| Valid |
SJ 21600-2021
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