| Standard ID | Contents [version] | USD | STEP2 | [PDF] delivered in | Standard Title (Description) | See Detail | Status | Related Standard |
| GB/Z 41275.4-2023 | English | 764 |
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Days<=6
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Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array(BGA) re-balling
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GB/Z 41275.4-2023
| Valid |
GB/Z 41275.4-2023
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