YS/T 1722-2025 PDF English
| Std ID | Version | USD | Buy | Deliver [PDF] in | Title (Description) |
| YS/T 1722-2025 | English | RFQ | ASK | 3 days [Need to translate] | Oxygen-free copper tape for copper clad ceramic substrate |
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Basic data
| Standard ID | YS/T 1722-2025 (YS/T1722-2025) |
| Description (Translated English) | Oxygen-free copper tape for copper clad ceramic substrate |
| Sector / Industry | Nonferrous Metallurgy Industry Standard (Recommended) |
| Classification of Chinese Standard | H62 |
| Classification of International Standard | 77.150.30 |
| Date of Issue | 2025-04-10 |
| Date of Implementation | 2025-11-01 |
| Issuing agency(ies) | Ministry of Industry and Information Technology |
| Summary | This standard specifies the classification and marking, technical requirements, test methods, inspection rules, marking, packaging, transportation, storage, and accompanying documents and order form contents for oxygen-free copper strips used in copper-clad ceramic substrates. This document applies to oxygen-free copper strips used in the manufacture of power modules and power electronic modules constructed with insulated-gate bipolar transistors (IGBTs). |
