SJ/T 11993-2025 PDF English
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| Std ID | Version | USD | Buy | Deliver [PDF] in | Title (Description) |
| SJ/T 11993-2025 | English | 289 | Add to Cart | 3 days [Need to translate] | Testing method for the pad cratering of printed circuit board assembly |
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Basic data
| Standard ID | SJ/T 11993-2025 (SJ/T11993-2025) |
| Description (Translated English) | Testing method for the pad cratering of printed circuit board assembly |
| Sector / Industry | Electronics Industry Standard (Recommended) |
| Classification of Chinese Standard | L30 |
| Classification of International Standard | 31.18 |
| Word Count Estimation | 13,142 |
| Date of Issue | 2025-05-09 |
| Date of Implementation | 2025-08-01 |
| Issuing agency(ies) | Ministry of Industry and Information Technology |
| Summary | This standard specifies the test procedures, result expression, and test report requirements for printed circuit board component pad cracking. This document applies to the evaluation test of the cracking resistance of rigid printed circuit boards and component pads. |
