SJ/T 11742-2019 PDF English
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| Std ID | Version | USD | Buy | Deliver [PDF] in | Title (Description) |
| SJ/T 11742-2019 | English | 399 | Add to Cart | 4 days [Need to translate] | (Thermally conductive non-prepreg prepreg for printed circuit) |
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Basic data
| Standard ID | SJ/T 11742-2019 (SJ/T11742-2019) |
| Description (Translated English) | (Thermally conductive non-prepreg prepreg for printed circuit) |
| Sector / Industry | Electronics Industry Standard (Recommended) |
| Classification of Chinese Standard | L30 |
| Classification of International Standard | 31.180 |
| Word Count Estimation | 17,170 |
| Date of Issue | 2019 |
| Date of Implementation | 2020-04-01 |
| Issuing agency(ies) | Ministry of Industry and Information Technology |
| Summary | This standard specifies the classification, technical requirements, inspection rules, inspection methods, packaging, marking, transportation and storage requirements of thermally conductive non-prepreg epoxy resin prepregs for printed circuits. This standard is applicable to the thermally conductive adhesive film (thermal conductivity range 1.0W/m?K��3.0W/m?K) used for insulating bonding between copper foil and metal substrate in metal-based copper-clad laminates. Thermally conductive adhesive film for bonding between layers of printed boards. |
