SJ/T 11741-2019 PDF English
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Basic data
| Standard ID | SJ/T 11741-2019 (SJ/T11741-2019) |
| Description (Translated English) | (Test method for flex resistance of flexible printed circuit materials) |
| Sector / Industry | Electronics Industry Standard (Recommended) |
| Classification of Chinese Standard | L30 |
| Classification of International Standard | 31.180 |
| Word Count Estimation | 7,710 |
| Date of Issue | 2019 |
| Date of Implementation | 2020-04-01 |
| Issuing agency(ies) | Ministry of Industry and Information Technology |
| Summary | This standard specifies a test method for flex resistance of flexible printed circuit materials. This method is applicable to copper foil and flexible copper clad laminate for flexible copper clad laminate. |