SJ/T 11725-2018 PDF English
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| Std ID | Version | USD | Buy | Deliver [PDF] in | Title (Description) |
| SJ/T 11725-2018 | English | 369 | Add to Cart | 4 days [Need to translate] | Thermal conduction epoxy composites material copper-clad laminated sheets for printed circuits board |
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Basic data
| Standard ID | SJ/T 11725-2018 (SJ/T11725-2018) |
| Description (Translated English) | Thermal conduction epoxy composites material copper-clad laminated sheets for printed circuits board |
| Sector / Industry | Electronics Industry Standard (Recommended) |
| Classification of Chinese Standard | L30 |
| Classification of International Standard | 31.180 |
| Word Count Estimation | 16,159 |
| Date of Issue | 2018-04-30 |
| Date of Implementation | 2018-07-01 |
| Quoted Standard | GB/T 2036; GB/T 4722-2017; GB/T 5230; GB/T 36476-2018; SJ/T 11283; SJ/T 11282 |
| Regulation (derived from) | Ministry of Industry and Information Technology Announcement No.23 of 2018 |
| Issuing agency(ies) | Ministry of Industry and Information Technology |
| Summary | This standard specifies the classification, technical requirements, test methods, inspection rules, marking, packaging, storage and transportation of heat-conducting copper-clad epoxy composite laminates for printed circuits (hereinafter referred to as thermally conductive composite copper-clad laminates). |
