SJ/T 10454-2020 PDF English
Price & Delivery
US$259.00 · In stock · Download in 9 secondsSJ/T 10454-2020: Dielectric paste for multilayer lay out of thick film hybrid integrated circuits
Delivery: 9 seconds. True-PDF full-copy in English & invoice will be downloaded + auto-delivered via email. See step-by-step procedure
Status: Valid
SJ/T 10454: Historical versions
| Std ID | Version | USD | Buy | Deliver [PDF] in | Title (Description) |
| SJ/T 10454-2020 | English | 259 | Add to Cart | 3 days [Need to translate] | Dielectric paste for multilayer lay out of thick film hybrid integrated circuits |
| SJ/T 10454-1993 | English | 279 | Add to Cart | 3 days [Need to translate] | Dielectric paste for multilayer lay out of thick film hybrid integrated circuits |
Click to Preview a similar PDF
Basic data
| Standard ID | SJ/T 10454-2020 (SJ/T10454-2020) |
| Description (Translated English) | Dielectric paste for multilayer lay out of thick film hybrid integrated circuits |
| Sector / Industry | Electronics Industry Standard (Recommended) |
| Classification of Chinese Standard | L90 |
| Classification of International Standard | 31.030 |
| Word Count Estimation | 11,132 |
| Date of Issue | 2020-12-09 |
| Date of Implementation | 2021-04-01 |
| Older Standard (superseded by this standard) | SJ/T 10454-1993 |
| Quoted Standard | GB/T 2423 2-2008; GB/T 2423.3 2006; GB/T 2423.22-2012; SJ/T 11512-2015 |
| Regulation (derived from) | Ministry of Industry and Information Technology Announcement No. 48 (2020) |
| Issuing agency(ies) | Ministry of Industry and Information Technology |
| Summary | This standard specifies the technical requirements, test methods, inspection rules, packaging, storage and transportation of dielectric pastes for thick film hybrid integrated circuit multilayer wiring (hereinafter referred to as pastes). This standard applies to dielectric pastes for thick film hybrid integrated circuit multilayer wiring that match gold, palladium and silver conductor pastes. |
