SJ 21600-2021 PDF English
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Basic data
| Standard ID | SJ 21600-2021 (SJ21600-2021) |
| Description (Translated English) | (Test method for X/Y axis thermal expansion coefficient of substrates for printed circuits - TMA method) |
| Sector / Industry | Electronics Industry Standard |
| Classification of Chinese Standard | L30 |
| Classification of International Standard | 31.180 |
| Word Count Estimation | 7,781 |
| Date of Issue | 2021-12-27 |
| Date of Implementation | 2022-03-01 |
| Issuing agency(ies) | Ministry of Industry and Information Technology |