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Test method for semiconductor equipment reliability, availability and maintainability (RAM)
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Specification for definition and measurement of semiconductor equipment reliability, availability and maintainability (RAM)
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Basic data
| Standard ID | GB/T 24468-2025 (GB/T24468-2025) |
| Description (Translated English) | Test method for semiconductor equipment reliability, availability and maintainability (RAM) |
| Sector / Industry | National Standard (Recommended) |
| Classification of Chinese Standard | L85 |
| Classification of International Standard | 17.040.30 |
| Word Count Estimation | 34,394 |
| Date of Issue | 2025-10-05 |
| Date of Implementation | 2026-05-01 |
| Older Standard (superseded by this standard) | GB/T 24468-2009 |
| Issuing agency(ies) | State Administration for Market Regulation and Standardization Administration of China |
GB/T 24468-2025: Test method for semiconductor equipment reliability, availability and maintainability (RAM)
---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
ICS 17.040.30
CCSL85
National Standards of the People's Republic of China
Replaces GB/T 24468-2009
Semiconductor device reliability, availability and
Maintainability (RAM) Measurement Methods
Published on 2025-10-05
Implemented on May 1, 2026
State Administration for Market Regulation
The State Administration for Standardization issued a statement.
Table of contents
Preface III
1.Scope 1
2 Normative References 1
3.Terms and Definitions 1
4.Abbreviations
5 General Principles 4
6.Classification of the time elapsed by the equipment 4
6.1 Overview 4
6.2 Production Time 5
6.3 Standby time 6
6.4 Project Time 6
6.5 Planned downtime 6
6.6 Unplanned downtime 7
6.7 Unplanned Time 9
7.Calculation of RAM Indicator 9.
7.1 Overview 9
7.2 Equipment Reliability 10
7.3 Equipment Availability 11
7.4 Equipment maintainability 12
7.5 Equipment utilization rate 13
8.RAM indicator test steps 13
9.Uncertainty Measurement 14
9.1 Overview 14
9.2 Calculation of the lower confidence limit of MTBFp 14
9.3 Calculation of the upper confidence limit of MTBFp 14
9.4 Calculation of MTBFp Confidence Interval 15
9.5 Calculation of the lower confidence limit of MTBFp at zero failures 15
9.6 Tests to demonstrate that the MTBFp meets the requirements at a given confidence level 15
10.Measurement of reliability growth or degradation 15
Appendix A (Normative) Overall Testing of Multi-Process Cluster Equipment 16
A.1 Module Tracing Requirements 16
A.2 Overall failure rate and mean time to repair cluster equipment 16
A.3 Time Mapping 17
A.4 Modeling the Pre-determined Process Flow 17
A.5 IPF time is determined by the module's time 22
A.6 Determining the timing of multi-process cluster equipment 22
A.7 Indicators for IPF and Multi-Process Cluster Equipment 24
Appendix B (Normative) Confidence Limit Coefficient 25
Appendix C (Normative) Measurement of Reliability Growth or Degradation 27
C.1 Introduction 27
C.2 Accurately record the failure time 27
C.3 Trend Testing 27
C.4 Reliability Growth Model 28
C.5 Reliability Analysis Process 29
Foreword
This document complies with the provisions of GB/T 1.1-2020 "Standardization Work Guidelines Part 1.Structure and Drafting Rules of Standardization Documents".
Drafting.
This document supersedes GB/T 24468-2009 "Definition and Measurement Specifications for Reliability, Availability and Maintainability (RAM) of Semiconductor Devices".
Compared with GB/T 24468-2009, apart from structural adjustments and editorial changes, the main technical changes are as follows.
a) Changed "purpose" to "scope" and modified the description of the scope (see Chapter 1, Chapter 1 of the.2009 edition);
b) Modified "Single-channel trunking device", "Multi-channel trunking device", "Safety tool", "Non-working time", "Working time", and "Available working time".
Terms such as "non-working time", "non-working event", "shutdown", "on", and "cut off" (see Chapter 3, Chapter 4 of the.2009 edition);
c) A new chapter on "Abbreviations" has been added (see Chapter 4);
d) The word "Scope" was changed to "General Provisions," and the provisions regarding the General Provisions were amended (see Chapter 5, Chapter 2 of the.2009 edition);
e) The definition of time has been changed (see Chapter 6, Chapter 5 in the.2009 edition);
f) The formulas for E-Uptime (%) and S-Uptime (%) have been modified (see 7.3.1 and 7.3.2, and 6.3.1 and 6.3.2 in the.2009 edition);
g) Added specifications for RAM metric testing procedures (see Chapter 8);
h) The measurement of reliability growth or degradation has been changed (see Chapter 10, Chapter 8 in the.2009 edition);
i) Confidence limit coefficients not used in the main text have been removed (Appendix A,.2009 edition).
Please note that some content in this document may involve patents. The issuing organization of this document assumes no responsibility for identifying patents.
This document was proposed and is under the jurisdiction of the National Technical Committee on Standardization of Semiconductor Equipment and Materials (SAC/TC203).
This document was drafted by. China Electronics Technology Standardization Institute, NAURA Technology Group Corporation, and SMIC.
Road Manufacturing (Shanghai) Co., Ltd., Qingdao Sirui Intelligent Technology Co., Ltd., Beijing Jingyi Automation Equipment Technology Co., Ltd.
Xingqi (Shanghai) Semiconductor Co., Ltd., Changshu Zhaoheng Zhongli Precision Machinery Co., Ltd., Shanghai Yinguan Semiconductor Technology Co., Ltd., Shanghai
Cabernet Advanced Materials Technology Co., Ltd., Zhizhen Precision Instruments (Qingdao) Co., Ltd., Shanghai CESI Technology Development Co., Ltd., Shenzhen
GlobalFoundries Integrated Circuit Equipment Co., Ltd., Beijing Heqi Precision Technology Co., Ltd., Hangzhou Kunte Magnetic Levitation Technology Co., Ltd., Shanghai Pudat
Semiconductor Equipment Co., Ltd., Suzhou Zhicheng Semiconductor Technology Co., Ltd., Shenzhen Axis Automation Technology Co., Ltd., Chengchuan Technology (Suzhou)
(Zhejiang) Co., Ltd., the 13th Research Institute of China Electronics Technology Group Corporation, Shenzhen Aixin Semiconductor Technology Co., Ltd., Yaoguang Semiconductor (Zhejiang) Co., Ltd.
Jiang) Co., Ltd., Wuxi Yiwen Microelectronics Technology Co., Ltd., Wuxi Grace Precision Machinery Co., Ltd., Beijing North China Microelectronics Co., Ltd.
Equipment Co., Ltd., Changzhou Mingsai Robotics Technology Co., Ltd., Zhuhai Aodewei Technology Co., Ltd., Shenzhen Fengyuansheng Technology Co., Ltd.
Limited Company, Dongguan Taijin Precision Technology Co., Ltd., Shanghai Winsun Electronic Technology Co., Ltd., Guangdong Quanxin Semiconductor Co., Ltd.
Suzhou Magnesium Technology Co., Ltd.
The main drafters of this document are. Nan Jiang, Ren Xiang, Ji Ankuan, Jian Duanduan, Lan Liguang, Ni Hao, Nie Xiang, Zhang Cong, Zhuo Zuliang, Yu Hao, and Zhou Liang.
Qi Ying, Yang Shaohui, Liu Jijun, Luo Zhongping, Li Pengtuan, Wen Lieyang, Jiang Xuchu, Wang Zhenhua, Tang Chengyan, Tao Jinweng, Wang Xiangrong, Chen Yingxiang
Zhang Xueying, Wei Jiaqi, Cao Zhiqiang, Zhang Xingxing, Liu Fei, Zhong Hua, Zheng Yuqian, Wang Chengxin, Zhang Yin, Qian Wenfang, Yang Shipin, Li Gaoyong, Gu Xiaoyong
Zhao Yingwei, Shang Chao, Wang Tao, Sun Wenbin, Qin Chun, Li Changfeng, Gong Bo, He Yiliang, Huang Meilin, Lü Wei, Zhou Tianxi, Qiao Zhixin.
The release history of this document and the document it replaces is as follows.
---First published in.2009 as GB/T 24468-2009;
---This is the first revision.
Semiconductor device reliability, availability and
Maintainability (RAM) Measurement Methods
1 Scope
This document describes the measurement methods for the reliability, availability, and maintainability (RAM) of semiconductor devices.
This document applies to the reliability, availability, and maintainability (RAM) testing of semiconductor devices.
2 Normative references
This document has no normative references.
3 Terms and Definitions
The following terms and definitions apply to this document.
3.1
reliability
The possibility that a device will perform its intended function under specified conditions over a period of time.
3.2
availability
When needed, the device is in a state where it can perform its intended functions.
3.3
maintainability
The possibility that a device may remain in or be restored to a state in which it can perform its intended functions for a period of time.
3.4
Cluster device clustertool
A manufacturing system consisting of mechanically interconnected integrated process modules.
Note. These modules may come from different manufacturers.
3.5
A cluster of devices with only one processing flow.
3.6
multi-path cluster tool
Cluster equipment with one or more independent processing steps.
Note. For example, multiple loading ports of the same model, multiple vacuum locks, and multiple process chambers.
3.7
host
Intelligent systems that communicate with equipment on behalf of factories and users, and play a supervisory role.
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