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YS/T 937-2013: Nickel-platinum target
Status: Valid
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| YS/T 937-2013 | English | 549 |
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Nickel-platinum target
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YS/T 937-2013
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Basic data | Standard ID | YS/T 937-2013 (YS/T937-2013) | | Description (Translated English) | Nickel-platinum target | | Sector / Industry | Nonferrous Metallurgy Industry Standard (Recommended) | | Classification of Chinese Standard | H68 | | Classification of International Standard | 77.150.99 | | Word Count Estimation | 21,244 | | Quoted Standard | GB/T 1031; GB/T 6394; GB/T 14265; GB/T 15077; GJB 1580A; YS/T 837 | | Regulation (derived from) | Ministry of Industry and Information Technology Bulletin No. 52, 2013; industry standard for filing Notice No. 1 of 2014 (No. 169 overall) | | Issuing agency(ies) | Ministry of Industry and Information Technology | | Summary | This standard specifies: Nickel platinum target requirements, test methods, inspection rules and signs, packaging, transportation, storage, quality certificates and contracts (or purchase orders) content. This standard applies to: semiconductor thin film | YS/T 937-2013: Nickel-platinum target---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
Nickel-platinum target
ICS 77.150.99
H68
People's Republic of China Nonferrous Metals Industry Standard
Nickel platinum target
Issued on. 2013-10-17
2014-03-01 implementation
Ministry of Industry and Information Technology of the People's Republic of China released
Foreword
This standard was drafted in accordance with GB/T 1.1-2009 given rules.
This standard by the National Standardization Technical Committee Nonferrous Metals (SAC/TC243) centralized.
This standard is drafted by. There RESEARCH billion of the new Materials Co., Ltd., Beijing Nonferrous Metal Research Institute.
Participated in the drafting of this standard. Jiang Feng Electronics Co., Ltd. Ningbo, China Nonferrous Metals Industry Institute of Standards and Metrology and Quality.
The main drafters of this standard. Zhu Xiaoguang, Gu Xinfu, Yang Yonggang, to Lei He Jinjiang, Guo Li Shan, Lv Baoguo, Yao Lijun, Wang Xueze,
Li Yongjun, yet again brilliant, Sun Xiulin, Chen Caixia, Zhang Li, Li, Liu Hongbin, Xiaqian Kun, Jiang Yuhui.
Nickel platinum target
1 Scope
This standard specifies the nickel-platinum target requirements, test methods, inspection rules and signs, packaging, transportation, storage, quality certificates and contracts
(Or orders) content.
This standard applies to all types of semiconductor films of nickel-platinum target.
2 Normative references
The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein
Member. For undated references, the latest edition (including any amendments) applies to this document.
GB/T 1031 Geometrical product specifications (GPS) Surface texture Profile method Surface roughness parameters and their values
GB/T 6394 Determination of average grain size of metal
GB/T 14265 metallic materials hydrogen, oxygen, nitrogen, carbon and sulfur analysis General
GB/T 15077 precious metals and their alloys geometry measurement methods
GJB1580A deformation of the metal ultrasonic inspection method
YS/T 837 sputtering targets - back binding quality ultrasonic inspection
3 Terms and Definitions
The following terms and definitions apply to this document.
3.1
Target target
Sputter deposition techniques cathode portion. The cathode material in the form of positively charged cations Struck molecules, atoms or ions
From the surface of the anode and cathode deposition.
3.2
Target blanks targetblank
The cathode material used as the target portion.
3.3
Backplane backingplate
For supporting a fixed target or blank section. Target and back by welding (such as brazing, electron beam welding, diffusion bonding, etc.), complex machinery,
Bonding or the like are connected.
4 Requirements
4.1 Categories
4.1.1 Nickel platinum target and classified according to the composite structure is divided into two monomers as shown in FIG.
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