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YS/T 919-2013 English PDF

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YS/T 919-2013: High purity copper ingot
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PDF similar to YS/T 919-2013


Standard similar to YS/T 919-2013

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Basic data

Standard ID YS/T 919-2013 (YS/T919-2013)
Description (Translated English) High purity copper ingot
Sector / Industry Nonferrous Metallurgy Industry Standard (Recommended)
Classification of Chinese Standard H62
Classification of International Standard 77.120.30
Word Count Estimation 8,861
Quoted Standard GB/T 14265; YS/T 837; YS/T 922
Regulation (derived from) Ministry of Industry and Information Technology Bulletin No. 52, 2013; industry standard for filing Notice No. 1 of 2014 (No. 169 overall)
Issuing agency(ies) Ministry of Industry and Information Technology
Summary This standard specifies the requirements of high copper ingot products, manufacturing conditions, test methods, inspection rules, marking, packaging, transportation, storage, quality certificates and contracts (or purchase orders) content. This standard a

YS/T 919-2013: High purity copper ingot

---This is a DRAFT version for illustration, not a final translation. Full copy of true-PDF in English version (including equations, symbols, images, flow-chart, tables, and figures etc.) will be manually/carefully translated upon your order.
High purity copper ingot ICS 77.120.30 H62 People's Republic of China Nonferrous Metals Industry Standard High copper ingots Issued on. 2013-10-17 2014-03-01 implementation Ministry of Industry and Information Technology of the People's Republic of China released

Foreword

This standard was drafted in accordance with GB/T 1.1-2009 given rules. This standard by the national non-ferrous metals Standardization Technical Committee (SAC/TC243) centralized. This standard was drafted. Yes REVIEW billion of the new Materials Co., Ltd.. The main drafters. Zhang Tao, Liu Shuqin, yet again Yan, Wang Xinping, Gao Yan, He Xin, Zeng Hao, Wang right, Lei Jifeng, Wang Yongming, Zhu Xiaoguang, Chen. High copper ingots

1 Scope

This standard specifies the requirements of high pure copper ingot product, manufacturing conditions, test methods, inspection rules, marking, packaging, transportation, storage, quality Certificates and contracts (or orders) content. This standard applies to the manufacture of semiconductor copper target desired high copper ingots. Other industries required high copper ingots can also refer to use.

2 Normative references

The following documents for the application of this document is essential. For dated references, only the dated version suitable for use herein Member. For undated references, the latest edition (including any amendments) applies to this document. GB/T 14265 metallic materials hydrogen, oxygen, nitrogen, carbon and sulfur analysis General YS/T 837 sputtering targets - back binding quality ultrasonic inspection Determination glow YS/T 922 high copper chemical analysis of trace impurities in the discharge mass spectrometry

3 Requirements

3.1 Categories High copper ingots chemical composition is divided into four grades. 6N5,6N, 5N, 4N5. 3.2 Chemical Composition Requirements 3.2.1 high copper ingots impurities should be consistent with the requirements specified in Table 1. Table 1 high impurity content of copper ingots Grade 6N5 6N 5N 4N5 Copper content (mass fraction) /%, no less than 99.99995 99.9999 99.999 99.995 Impurities/10-4% no greater than Ag 0.1 0.3 2 25 Al 0.005 0.05 0.5 - As 0.01 0.02 0.1 5 Bi 0.01 0.02 0.2 1 Ca 0.01 0.02 0.5 - Cd 0.05 - 0.1 1 Cl 0.05 - - - Co 0.02 - 0.3 - Cr 0.01 0.02 0.1 - F 0.05 - - 1

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